Axus Technology introduced the Titan Carrier Upgrade for IPEC and Strasbaugh legacy CMP chemical mechanical polishing/planarization (CMP) tools for semiconductor and related manufacturing.

North America-based manufacturers of semiconductor fab equipment posted $1.60 billion in orders and $1.45 billion in billings in April 2012 for a book-to-bill ratio of 1.10, according to SEMI.

Brown University is using supercomputer simulations to better understand the ion bombardment of metal surfaces used in manufacturing nanoelectronics.

Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.

Indian River State College in FL will be the first college in the southeastern US to offer students access to the instrumentation and curriculum provided by the NanoProfessor Nanoscience Education Program from NanoInk.

At The ConFab in Las Vegas, TSMC’s BJ Woo, senior director, Graphic/PLD/CPU Business Development Division, will present “Bridging the Fabless-Foundry Gap.”

Barclays Capital updates its wafer fab/semiconductor production equipment (WFE/SPE) capital expenditures expectations for TSMC, Samsung, Intel, UMC, GLOBALFOUNDRIES, SMIC, and Huali.

SEMICON West is less than 2 months away, July 10-12 in San Francisco, CA. Plan your attendee schedule now with highlights from the Extreme Electronics “show within a show;” 4 strong keynotes; sessions on device architecture and node shrink, lithography, 450mm wafers and more.

Bühler’s acquisition of Leybold Optics from EQT III, for an undisclosed sum, was approved without any restrictions by anti-trust authorities.

SPTS Technologies installed a Sigma fxP physical vapor deposition (PVD) system at a Chinese foundry producing RF devices on gallium arsenide (GaAs) substrates.

SENSIRION introduced the SLQ-QT105 semiconductor-grade flow sensor for flow rates below 2cc/sec (120ml/min) of hydrocarbon-based liquids, such as photoresists and solvents.

Nanotrons Corporation launched the SPray Assisted Layer-by-layer Assembly System (SPALAS) for nano-enabled optical coatings on semiconductor, plastic, and glass substrates using layer-by-layer (LbL) self-assembly.

Astro Pak Corporation opened its Class 100 and Class 1000 cleanrooms, recently renovated and expanded, in Downey, CA. The cleanrooms host contract precision cleaning for the semiconductor manufacturing, aerospace, and other industries.

Dow Corning will add 2 AIXTRON AIX 2800G4 WW planetary reactor platforms to its silicon carbide (SiC) epitaxy capacity for next-generation power electronics.