Econometric forecasting service predicts 6% growth in semiconductor wafers in 2013
Feb 7, 2013
A new econometric semiconductor industry forecast predicts semiconductor wafer area production to grow slightly less than 6% in 2013, according to Linx Consulting. |
Looking for an integrated post-tapeout flow
Feb 6, 2013
Dr. Steffen Schulz discusses the role of a flexible platform for computational lithography in a successful business strategy. |
Semiconductor R&D spending rises 7% despite weak market
Feb 5, 2013
Spending on research and development by semiconductor companies grew 7% in 2012 to a record-high $53.0 billion, even though the semiconductor market declined 1% to $317.6 billion. |
KLA-Tencor announces new e-beam inspection system
Jan 30, 2013
KLA-Tencor Corporation (NASDAQ: KLAC) announced the eS805, a new electron-beam inspection system capable of detecting very small defects, and defects that cause electrical problems. |
1/f noise measurement system unveiled
Jan 29, 2013
ProPlus Design Solutions announced it is shipping a new wafer-level, 1/f noise measurement system. Increasingly, circuit designers are interested in 1/f noise data at higher frequencies. |
Process Watch: Exploring the dark side
Jan 25, 2013
A particle as small as three microns in diameter, attached to the back side of the wafer—the dark side, if you will—can cause yield-limiting defects on the front side of the wafer during patterning of a critical layer. |
IBM team wins Feynman Prize for scanning probe microscopy
Jan 17, 2013
IBM Researchers won the prestigious Feynman prize given by the Foresight Group. The team was the first to produce images detailed enough to identify the structure of individual molecules, as well as metal-molecule complexes. |
GlobalFoundries adding R&D facility to NY fab campus
Jan 11, 2013
GlobalFoundries says it plans to build a $2 billion "Technology Development Center" R&D facility at its Fab 8 campus in Saratoga County, NY, for semiconductor technology development and manufacturing: EUV lithography photomasks to new interconnect and packaging technologies en...
|
SEMI approves first HB-LED standards
Jan 9, 2013
SEMI's HB-LED Standards Committee has approved its first standard, specifying sapphire wafers used in making high-brightness light-emitting diode (HB-LED) devices. |
2013: Advanced chemistry moves center stage
Jan 4, 2013
We are in an age where chemistry is center stage in the race to advance Moore’s Law and More Than Moore. |
IDC: Semiconductor revenues will grow 4.9% in 2013
Jan 4, 2013
The International Data Corporation is forecasting that semiconductor revenues worldwide will improve by 4.9% to $319 billion in 2013 and log a compound annual growth rate (CAGR) of 4.1% from 2011-2016. |
2013: Healthy revenue growth, but capex likely flat
Jan 4, 2013
Based on current indications, capital spending would seem to be flat in 2013. However, Semico predicts healthy revenue growth this year, which may encourage more spending, particularly in the second half of the year. This may bring total capex for 2013 into the positive range.
|
2013: An economic outlook for the global IC market
Jan 3, 2013
Predictions for 2013 show several notable trends: overall silicon area growth for 2013 should average approximately 6%; the first quarter and the second half are likely to show slower growth than the second quarter; and the modest growth forecast for 2013 is predominantly demand driven. |
2013: 450mm is the next big opportunity
Jan 3, 2013
In semiconductor manufacturing, 450mm is the next big opportunity. Issues of economic scale and complexity will force fab designers, OEMs and process integrators to investigate all open avenues in the search for solutions to the huge challenges that accompany 450mm. |
2013: Accelerating R&D and decreasing time to yield
Jan 3, 2013
In order to maintain profitability manufacturers must increase the productivity and return from their R&D investments. |