Direct chip bonding, all-SiC design increase power density in Mitsubishi Electric inverter
May 23, 2012
Mitsubishi Electric Corporation developed a prototype forced-air-cooled three-phase 400V output inverter with all-silicon carbide (SiC) power modules and direct lead bonding that has a power density of 50kVA per liter. |
Present at IEEE IEDM 2012
May 22, 2012
IEEE International Electron Devices Meeting (IEDM) is seeking original presentations on microelectronics research and development, with a focus on silicon and non-silicon device and process technology, circuit/device interactions; energy-harvesting, biomedical, and power electronics; magnetics an...
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Power discrete semiconductors grow with cloud computing, electric vehicle demand
May 22, 2012
Power discretes’ sales revenue will grow at a CAGR of 6.5%, 2012-2016, estimates GBI Research. Power discretes are meeting demand for energy-efficient and environmentally friendly products. |
ONNN opens IC design center in Czech Republic
May 21, 2012
ON Semiconductor (Nasdaq:ONNN) expanded its Roznov, Czech Republic, operations with a new 4,000sq.m. research and design facility, a quarter of which is high-tech laboratories. |
Low-cost Flash memory boosted by gray-market cellphones
May 21, 2012
The massive “gray market” for cellphones is propelling sales of lower-cost flash memories like eMMC and SPI NOR, as manufacturers of the unregulated phones strive to keep production costs low, says IHS. |
Bridging the fabless-foundry gap: Highlighted ConFab presentation
May 18, 2012
At The ConFab in Las Vegas, TSMC’s BJ Woo, senior director, Graphic/PLD/CPU Business Development Division, will present “Bridging the Fabless-Foundry Gap.” |
Lower DRAM prices enable more DRAM per smartphone without higher pricetag
May 18, 2012
DRAM’ percentage of the cost of a smartphone is decreasing, even as DRAM usage in smartphones is on the rise. Lowering ASPs for DRAM components caused DRAM costs in smartphones to fall by more than half in the course of a year, according to IHS. |
JEDEC publishes LPDDR3 standard for low-power memory chips
May 17, 2012
JEDEC Solid State Technology Association published the JESD209-3 LPDDR3 Low Power Memory Device Standard, targeting the performance and density demands of new-gen mobile devices. |
Semiconductor companies see increased venture capital funding in April
May 17, 2012
In April 2012, venture investment dollars received by semiconductor companies was $194.2 million; a 901.0% increase M/M and 461.3% increase Y/Y, reports the Global Semiconductor Alliance (GSA). |
Tight 28nm supply shifts GPU maker shares in Q1
May 17, 2012
Barclays Capital’s C.J. Muse looks at the forecast for PC GPUs based on a new report from Mercury Research. Shipments of PC graphic devices in Q1 2012 came in in-line to slightly below historical trends. Nvidia lost share to Intel and AMD due to tight 28nm chip supply. |
Microsoft joins Hybrid Memory Cube Consortium
May 16, 2012
The Hybrid Memory Cube Consortium (HMCC) is a collaboration developing and implementing an open interface standard for Hybrid Memory Cube semiconductor memory architectures. Microsoft Corp. has now joined the consortium. |
SMIC expands Beijing fab for smaller-node semiconductor manufacturing
May 15, 2012
Semiconductor Manufacturing International Corporation (SMIC) signed a cooperation framework document between its subsidiary SMIC Beijing and the Beijing municipal government, forming a joint venture for SMIC Beijing's expansion adjacent to its 12” mega-fab. |
DRAM partially recovers thanks to Elpida bankruptcy
May 15, 2012
The market for DRAM is expected to partially reverse the drastic losses it incurred in 2011 and achieve revenue growth this year, the result of balanced supply and demand following the exit of major manufacturer Elpida Memory, according to IHS. |
Infineon CEO Bauer resigns for health considerations
May 15, 2012
Infineon Technologies AG (FSE:IFX, OTCQX:IFNNY) CEO Peter Bauer will resign his post at the end of the current fiscal year (September 30, 2012) due to worsening osteoporosis. |
GLOBALFOUNDRIES joins top-20 semiconductor suppliers in Q1 2012 on Elpida bankruptcy
May 14, 2012
The top 20 semiconductor suppliers in Q1 2012, compiled in IC Insights' May Update to The McClean Report, show Intel’s firm hold on the top of the rankings, but a disappointing quarter overall. GLOBALFOUNDRIES replaced bankrupt Elpida on the top 20 charts. |