More Device Architecture Articles

Direct chip bonding, all-SiC design increase power density in Mitsubishi Electric inverter

May 23, 2012

Mitsubishi Electric Corporation developed a prototype forced-air-cooled three-phase 400V output inverter with all-silicon carbide (SiC) power modules and direct lead bonding that has a power density of 50kVA per liter.

Present at IEEE IEDM 2012

May 22, 2012 IEEE International Electron Devices Meeting (IEDM) is seeking original presentations on microelectronics research and development, with a focus on silicon and non-silicon device and process technology, circuit/device interactions; energy-harvesting, biomedical, and power electronics; magnetics an...

Power discrete semiconductors grow with cloud computing, electric vehicle demand

May 22, 2012

Power discretes’ sales revenue will grow at a CAGR of 6.5%, 2012-2016, estimates GBI Research. Power discretes are meeting demand for energy-efficient and environmentally friendly products.

ONNN opens IC design center in Czech Republic

May 21, 2012

ON Semiconductor (Nasdaq:ONNN) expanded its Roznov, Czech Republic, operations with a new 4,000sq.m. research and design facility, a quarter of which is high-tech laboratories.

Low-cost Flash memory boosted by gray-market cellphones

May 21, 2012

The massive “gray market” for cellphones is propelling sales of lower-cost flash memories like eMMC and SPI NOR, as manufacturers of the unregulated phones strive to keep production costs low, says IHS.

Bridging the fabless-foundry gap: Highlighted ConFab presentation

May 18, 2012

At The ConFab in Las Vegas, TSMC’s BJ Woo, senior director, Graphic/PLD/CPU Business Development Division, will present “Bridging the Fabless-Foundry Gap.”

Lower DRAM prices enable more DRAM per smartphone without higher pricetag

May 18, 2012

DRAM’ percentage of the cost of a smartphone is decreasing, even as DRAM usage in smartphones is on the rise. Lowering ASPs for DRAM components caused DRAM costs in smartphones to fall by more than half in the course of a year, according to IHS.

JEDEC publishes LPDDR3 standard for low-power memory chips

May 17, 2012

JEDEC Solid State Technology Association published the JESD209-3 LPDDR3 Low Power Memory Device Standard, targeting the performance and density demands of new-gen mobile devices.

Semiconductor companies see increased venture capital funding in April

May 17, 2012

In April 2012, venture investment dollars received by semiconductor companies was $194.2 million; a 901.0% increase M/M and 461.3% increase Y/Y, reports the Global Semiconductor Alliance (GSA).

Tight 28nm supply shifts GPU maker shares in Q1

May 17, 2012

Barclays Capital’s C.J. Muse looks at the forecast for PC GPUs based on a new report from Mercury Research. Shipments of PC graphic devices in Q1 2012 came in in-line to slightly below historical trends. Nvidia lost share to Intel and AMD due to tight 28nm chip supply.

Microsoft joins Hybrid Memory Cube Consortium

May 16, 2012

The Hybrid Memory Cube Consortium (HMCC) is a collaboration developing and implementing an open interface standard for Hybrid Memory Cube semiconductor memory architectures. Microsoft Corp. has now joined the consortium.

SMIC expands Beijing fab for smaller-node semiconductor manufacturing

May 15, 2012

Semiconductor Manufacturing International Corporation (SMIC) signed a cooperation framework document between its subsidiary SMIC Beijing and the Beijing municipal government, forming a joint venture for SMIC Beijing's expansion adjacent to its 12” mega-fab.

DRAM partially recovers thanks to Elpida bankruptcy

May 15, 2012

The market for DRAM is expected to partially reverse the drastic losses it incurred in 2011 and achieve revenue growth this year, the result of balanced supply and demand following the exit of major manufacturer Elpida Memory, according to IHS.

Infineon CEO Bauer resigns for health considerations

May 15, 2012

Infineon Technologies AG (FSE:IFX, OTCQX:IFNNY) CEO Peter Bauer will resign his post at the end of the current fiscal year (September 30, 2012) due to worsening osteoporosis.

GLOBALFOUNDRIES joins top-20 semiconductor suppliers in Q1 2012 on Elpida bankruptcy

May 14, 2012

The top 20 semiconductor suppliers in Q1 2012, compiled in IC Insights' May Update to The McClean Report, show Intel’s firm hold on the top of the rankings, but a disappointing quarter overall. GLOBALFOUNDRIES replaced bankrupt Elpida on the top 20 charts.

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