More Device Architecture Articles

Four-junction solar cell achieves 43.6% efficiency

May 22, 2013

Soitec announced the PV industry’s first four-junction solar cell device, which uses two dual-junction sub cells grown on different III-V compound materials, which allows optimal band-gap combinations tailored to capture a broader range of the solar spectrum.

IDC predicts semiconductor market to experience 3-4% revenue growth in 2013

May 22, 2013

IDC expects the semiconductor market to return to growth in 2013 with revenues forecast to increase by 3.5 percent this year.

NSF and SRC to fund research to create failure-resistant systems and circuits

May 21, 2013

Leaders of the National Science Foundation (NSF) and the Semiconductor Research Corporation (SRC) today announced 18 new projects funded through a joint initiative to address research challenges in the design of failure-resistant circuits and systems.

Eleven companies move up in Q1’13 top 20 semi supplier ranking

May 21, 2013

Qualcomm, TSMC, and SK Hynix each register greater than 20 percent year-over-year growth.

Toshiba to start mass production of next generation NAND flash memory

May 21, 2013

Toshiba Corporation today announced that the company has developed second generation 19nm process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month.

Imec and GLOBALFOUNDRIES collaborate to advance high-density memory technology

May 21, 2013

Imec and GLOBALFOUNDRIES announced today that they have expanded joint development efforts to advance STT-MRAM (spin-transfer torque magnetoresistive random access memory) technology.

Extending optical lithography; outlook for DSA

May 20, 2013

This year’s SEMICON West front-end processing TechXPOTs on lithography and transistors below 20nm will provide critical updates on how technologists are coping with the next scaling challenges.

How Intel can enable a successful $200 PC in the age of the media tablet

May 20, 2013

Can PC makers produce ultrathin, touch-screen PCs that are appealing to consumers—and that are priced at just $200?

Printed, flexible and organic electronics sees 15.2% CAGR over the next decade

May 17, 2013

The new report from IDTechEx titled "Printed, Organic & Flexible Electronics: Forecasts, Players & Opportunities 2013-2023" finds that the total market for these technologies will grow from $16.04 billion in 2013 to $76.79 billion in 2023.

Samsung announces industry-first 45nm embedded flash logic process development

May 17, 2013 Samsung Electronics Co., Ltd., a provider of advanced semiconductor solutions, today announced the industry’s first 45nm embedded flash logic process development called eFlash. Samsung successfully implemented the new process into the smart card test chip, which means that this process technology...

Vishay Intertechnology enhances precision thin film chip resistor arrays

May 16, 2013

Vishay Intertechnology, Inc. today announced that the company has enhanced its ACAS 0606 AT and ACAS 0612 AT precision thin film chip resistor arrays with tighter absolute tolerance, relative tolerance, and relative TCR for the new S, T, and U accuracy grades.

Imec and Renesas collaborate on ultra-low power short range radios

May 16, 2013

Imec and Renesas Electronics Corporation announced today that they have entered into a new strategic research collaboration at Holst Centre.

EU announces achievements of three-year power microelectronics program

May 16, 2013

LAST POWER, the European Union-sponsored program aimed at developing a cost-effective and reliable technology for power electronics, today announced its three-year program achievements.