DEVICE ARCHITECTURE

MAGAZINE

05/01/2013
Volume 56, Issue 3

SEMICONDUCTORS BLOG

DEVICE ARCHITECTURE ARTICLES

Printed, flexible and organic electronics sees 15.2% CAGR over the next decade

05/17/2013 The new report from IDTechEx titled "Printed, Organic & Flexible Electronics: Forecasts, Players & Opportunities 2013-2023" finds...

Samsung announces industry-first 45nm embedded flash logic process development

05/17/2013 Samsung Electronics Co., Ltd., a provider of advanced semiconductor solutions, today announced the industry’s first 45nm embedded flash logic proce...

Vishay Intertechnology enhances precision thin film chip resistor arrays

05/16/2013 Vishay Intertechnology, Inc. today announced that the company has enhanced its ACAS 0606 AT and ACAS 0612 AT precision thin film chip resistor arra...

Imec and Renesas collaborate on ultra-low power short range radios

05/16/2013

Imec and Renesas Electronics Corporation announced today that they have entered into a new strategic research collaboration at Holst Centre.

HEADLINES

United Kingdom Intellectual Property Office Publishes Application for Trademark "LE GUI" to Bayat Kahn for Multiple Goods and Services

South Wales, United Kingdom, May 17 -- Bayat Kahn Corp. Ltd., Manchester, has filed the trademarks "LE GUI" on April 8 for multiple goods and servi...

EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System For Micro- and Nano-Electronics Production

Flexible System Integrates Spin/Spray Coating and Wet Processing for MEMS, Advanced Packaging and Compound Semiconductor ApplicationsSINGAPORE,&nbs...

Washington: Remarks by the President at Applied Materials, Inc. - Austin, TX

The White House has issued the following remarks of President Barack Obama:THE PRESIDENT: Hello, Austin! How you doing? (Applause.) Well, it is wo...

-Advantest's President and CEO Haruo Matsuno Earns ACE Award for Executive of the Year

ENP Newswire - 10 May 2013Release date- 09052013 - TOKYO, Japan - Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857, N...

TSMC April sales hit new high

Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chip maker, said Friday that its consolidated sales for April hit a new...

USPTO ISSUES TRADEMARK: GPT

ALEXANDRIA, Va., May 9 -- The trademark GPT (Reg. No. 4331981) was issued on May 7 by the USPTO.Owner: GRAND PLASTIC TECHNOLOGY CORPORATION CORPORA...

TSMC to spend US$1.5 billion on R&D in 2013

Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chip maker, said Thursday it will allocate US$1.5 billion (NT$44.3 bill...

FINANCIAL

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...
Sponsored by

Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embe...

WEBCASTS

On Demand Webcasts

Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
Sponsored by

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...
Sponsored by

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