DEVICE ARCHITECTURE

MAGAZINE

05/01/2013
Volume 56, Issue 3

DEVICE ARCHITECTURE ARTICLES

Toshiba to start mass production of next generation NAND flash memory

05/21/2013 Toshiba Corporation today announced that the company has developed second generation 19nm process technology that it will apply to mass production ...

Imec and GLOBALFOUNDRIES collaborate to advance high-density memory technology

05/21/2013 Imec and GLOBALFOUNDRIES announced today that they have expanded joint development efforts to advance STT-MRAM (spin-transfer torque magnetoresisti...

Extending optical lithography; outlook for DSA

05/20/2013 This year’s SEMICON West front-end processing TechXPOTs on lithography and transistors below 20nm will provide critical updates on how technologist...

How Intel can enable a successful $200 PC in the age of the media tablet

05/20/2013

Can PC makers produce ultrathin, touch-screen PCs that are appealing to consumers—and that are priced at just $200?

HEADLINES

WEALTHMAKERS.COM Issues Bearish Research Reports on AGII, ASCA, BHLB, CAMT, CCMP, CIE

May 20, 2013WEALTHMAKERS.COM / www.wealthmakers.com , a Wall Street research and trading firm providing unbiased statistical stock market predictio...

United Kingdom Intellectual Property Office Publishes Application for Trademark "LE GUI" to Bayat Kahn for Multiple Goods and Services

South Wales, United Kingdom, May 17 -- Bayat Kahn Corp. Ltd., Manchester, has filed the trademarks "LE GUI" on April 8 for multiple goods and servi...

EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System For Micro- and Nano-Electronics Production

Flexible System Integrates Spin/Spray Coating and Wet Processing for MEMS, Advanced Packaging and Compound Semiconductor ApplicationsSINGAPORE,&nbs...

Washington: Remarks by the President at Applied Materials, Inc. - Austin, TX

The White House has issued the following remarks of President Barack Obama:THE PRESIDENT: Hello, Austin! How you doing? (Applause.) Well, it is wo...

-Advantest's President and CEO Haruo Matsuno Earns ACE Award for Executive of the Year

ENP Newswire - 10 May 2013Release date- 09052013 - TOKYO, Japan - Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857, N...

TSMC April sales hit new high

Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chip maker, said Friday that its consolidated sales for April hit a new...

USPTO ISSUES TRADEMARK: GPT

ALEXANDRIA, Va., May 9 -- The trademark GPT (Reg. No. 4331981) was issued on May 7 by the USPTO.Owner: GRAND PLASTIC TECHNOLOGY CORPORATION CORPORA...

FINANCIAL

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...
Sponsored by

Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embe...

WEBCASTS

On Demand Webcasts

Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
Sponsored by

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...
Sponsored by

VIDEO

EIQ2 SST

FEATURED PRODUCTS


© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS