SEMICONDUCTORS
MAGAZINE
05/01/2013
Volume 56, Issue 3
SEMICONDUCTORS BLOGS
SEMICONDUCTOR ARTICLES
NexPlanar announces major expansion for semiconductor CMP pads
05/24/2013
Rapidly increasing customer demand for NexPlanar's advanced semiconductor CMP pads has necessitated a significant capacity expansion in both the U.S. and Asia. |
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Flexible devices manufactured by roll-to-roll technologies to reach nearly $22.7 billion by 2017
05/23/2013
The diffusion of roll-to-roll technologies is expected to have a marked effect in lowering the unit prices of flexible devices. Consequently, while consumption in terms of volume is forecast to rise very rapidly, revenues will increase somewhat more moderately. |
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Photonics societies launch the National Photonics Initiative to increase R&D and economy
05/23/2013
Photonics societies across the United States today announced the launch of the National Photonics Initiative. |
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Innovation could bring flexible solar cells, transistors, displays
05/22/2013
Researchers have created a new type of transparent electrode that might find uses in solar cells, flexible displays for computers and consumer electronics and future "optoelectronic" circuits for sensors and information processing. |
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Four-junction solar cell achieves 43.6% efficiency
05/22/2013
Soitec announced the PV industry’s first four-junction solar cell device, which uses two dual-junction sub cells grown on different III-V compound materials, which allows optimal band-gap combinations tailored to capture a broader range of the solar spectrum. |
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IDC predicts semiconductor market to experience 3-4% revenue growth in 2013
05/22/2013
IDC expects the semiconductor market to return to growth in 2013 with revenues forecast to increase by 3.5 percent this year. |
North American semiconductor equipment industry posts April 2013 book-to-bill ratio of 1.08
05/22/2013
North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in April 2013 (three-month average basis) and a book-to-bill ratio of 1.08. |
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HEADLINES
ON Semiconductor Gets Title III Government Funding to Advance Next-Generation Star Tracker Image Sensor
ON Semiconductor has collaborated with SRI International and Ball Aerospace & Technologies Corp. to secure funding for...
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-Fujitsu Limited - Notice of Company Split Contract Execution with Semiconductor Subsidiary
ENP Newswire - 24 May 2013Release date- 23052013 - Tokyo - Fujitsu Limited has concluded a contract with its consolidated ...
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-Advantest Earns 25th Consecutive Ranking as a Top Semiconductor Test Equipment Supplier in the Annual VLSIresearch Customer Satisfaction Survey
ENP Newswire - 24 May 2013Release date- 23052013 - TOKYO, Japan - Leading semiconductor test equipment supplier Advantest ...
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Touchstone Semiconductor Introduces the Industry's Only Ultra Low-Power, Load Independent, High-Efficiency Boost
3.5µA TS3300 Maintains 84% Efficiency over a 100:1 Output Current Span While Delivering 75mAMILPITAS, CALIF. &nd...
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Rating of [ICRA]D reaffirmed for bank facilities of Solar Semiconductor Private Limited
Solar Semiconductor Private LimitedInstrument Amount Rating Action Term Loans Rs. 258.44 crore (enhanced from Rs. 208.55 c...
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FORM 8-K: FREESCALE SEMICONDUCTOR FILES CURRENT REPORT
WASHINGTON, May 23 -- Freescale Semiconductor Ltd., Austin, Texas, files Form 8-K (current report) with Securities and Exc...
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FINANCIALS
TECHNOLOGY PAPERS
Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...
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Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...
Sponsored by
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WEBCASTS
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...
Sponsored by
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450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
Sponsored by
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VIDEOS
EVENTS
Magnesium Workshop Madrid 2013: An International Workshop on Processing-Microstructure-Mechanical Property of Magnesium AlloysMadrid, Spain
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2013 5th IEEE International Memory Workshop (IMW)Monterey, CA , United States
408-765-5249
May 26, 2013
- May 29, 2013
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2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD)Kanazawa, Japan , Japan
+81 92 805 3227
+81 92 805 3881
May 26, 2013
- May 30, 2013
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ECTCLas Vegas, NV
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2013 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)Seattle, WA , United States
603-885-3279
603-885-8256
June 2, 2013
- June 4, 2013
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NEW PRODUCTS
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3M announces QDEF; to bring 50% more color to LCD devices
May 21, 2013
3M announced today it is in the final stages of scale-up for its new 3M Quantum Dot Enhancement Film (QDEF). The new film allow...
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COMSOL Multiphysics 4.3b offers new additions to simulation platform
May 16, 2013
COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL s...
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Spectra-Physics introduces industrial picosecond laser
May 10, 2013
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...
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Multitest announces ecoAmp for high-power applications
May 8, 2013
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...
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