SEMICONDUCTORS

SEMICONDUCTOR NEWS & FEATURES

Metrology needs double as semiconductors move from 90nm to 32nm node

05/29/2012

KLA-Tencor Corporation (NASDAQ:KLAC) measures a 70% increase in fab process steps from 90nm to 32nm semiconductor nodes. This doubles the critical inspection steps required, report Citi analysts.

Process Watch: The dangerous disappearing defect

05/29/2012

In this first installment of a series called "Process Watch,” experts from KLA-Tencor explain why a defect might be classified as “Not Found” or “SEM Non-visual (SNV),” and how a SNV count can disguise or hide real problems.

Figure. Researchers first use a layout for 22nm SRAM contacts in the top layer. Through conventional lithography, a guiding template is fabricated, shown on the second layer. Application of a block copolymer solution leads to a self-assembled circuit contact pattern in the third layer.

Directed self-assembly lithography research yields contact holes on semiconductor wafer

05/28/2012

Stanford University researchers, sponsored by Semiconductor Research Corporation (SRC), have created contact hole patterns for logic and memory semiconductors using a next-generation directed self-assembly (DSA) lithography process.

Spansion (CODE) SLC NAND chip.

Spansion (CODE) unveils SLC NAND with extended roadmap for embedded designs

05/25/2012

Flash memory chip maker Spansion Inc. (NYSE:CODE) debuted its first family of single-level cell (SLC) NAND products using 4Xnm floating-gate technology. Spansion plans to roll out 3X and 2Xnm node versions of the NAND chips in the near future, without obsoleting the more mature designs.

Field report: CMP users group

05/25/2012

Michael A. Fury reports on the NCCAVS CMP Users Group meeting, held on May 16th.

ITF: Reconfigurable radios and scaled CMOS for a true mobile life

05/25/2012

The next big thing according to Charlotte Soens, manager mm-wave communication program at imec, is that people will start using these mobile devices to watch high-quality photos and videos, stored in the cloud. Soens presented details at imec's International Technology Forum.

ITF: The technology knobs for system scaling

05/25/2012

At imec's International Technology Forum, An Steegen, Senior Vice President Process Technology at imec, discusses the three technology knobs that are key for a further system scaling.

ITF: Life has changed

05/25/2012

At imec's International Technology Forum, the research consortium's CEO, Lec van den Hove, draws attention to the need for the industry to solve the world's health problems.

SEMICONDUCTORS LIVE NEWS STREAM

SRC and Stanford University Unveil New Circuit Pattern-Design Process

Researchers sponsored by Semiconductor Research Corp. (SRC), a university-research consortium for semiconductors and rel...

Ultra Clean Holdings Inks Merger Pact with American Integration Technologies

Ultra Clean Holdings, Inc., a developer and supplier of critical subsystems for the semiconductor capital equipment, fla...

Exar Corporation CEO Louis DiNardo to Participate in Communications Semiconductors Panel

Exar Corporation President and Chief Executive Officer, Louis DiNardo, has been selected to participate in the Emerging ...

CVRx Selects ON Semiconductor for Advanced Implantable Device Used in the Treatment of Hypertension

ON Semiconductor, a supplier of high-performance silicon solutions for energy efficient electronics, announced that CVRx...

SmartKem Drives International Growth Strategy with Appointment of Bill Freer as Chairman

May 29, 2012 SmartKem Limited, the developer of high performance, printable organic semiconductor materials for fle...

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SEMICONDUCTORS WEBCASTS

PVD Solutions for Next Generation MEMS and Sensors

As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with ...
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FREE WEBCAST: Lens Tilt in Small Auto-Focus Cameras

This webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors.

SEMICONDUCTORS VIDEOS

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SEMICONDUCTORS EVENTS

The ConFab 2012

Las Vegas, NV
June 3, 2012 - June 6, 2012

Display Week 2012

Boston, MA

IEEE International Interconnect Technology Conference (IITC)

San Jose, CA
June 4, 2012 - June 6, 2012

2012 Symposia on VLSI Technology and Circuits

Honolulu, HI
June 12, 2012 - June 15, 2012

Semiconductor Asia 2012

Shanghai, China
June 20, 2012 - June 21, 2012

SEMICONDUCTORS PODCASTS

imec advances CMOS beyond silicon to Ge, III-V

12/14/2011 Marc Heyns, fellow at research consortium imec, discusses the group's work on chip fab materials beyond silicon, namely, Ge and III-V, presented in...

Self-powered electronics: Achievements and challenges @ IEDM

12/12/2011 Dennis Buss, a visiting scientist at the Massachusetts Institute of Technology (MIT) and consultant at Texas Instruments (TI), presented "Rese...

KLA-Tencor enlarges monitor-wafer suite

12/07/2011 KLA-Tencor Corporation (NASDAQ: KLAC) added to its SensArray portfolio of advanced wireless temperature monitoring wafers. The products use time-ba...

EVG doubles process module space in XT Frame platform

12/05/2011 EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the XT Frame equipment platform for better process throughput and tool...

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