Metrology needs double as semiconductors move from 90nm to 32nm node
05/29/2012
KLA-Tencor Corporation (NASDAQ:KLAC) measures a 70% increase in fab process steps from 90nm to 32nm semiconductor nodes. This doubles the critical inspection steps required, report Citi analysts. |
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Process Watch: The dangerous disappearing defect
05/29/2012
In this first installment of a series called "Process Watch,” experts from KLA-Tencor explain why a defect might be classified as “Not Found” or “SEM Non-visual (SNV),” and how a SNV count can disguise or hide real problems. |
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Directed self-assembly lithography research yields contact holes on semiconductor wafer
05/28/2012
Stanford University researchers, sponsored by Semiconductor Research Corporation (SRC), have created contact hole patterns for logic and memory semiconductors using a next-generation directed self-assembly (DSA) lithography process. |
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Spansion (CODE) unveils SLC NAND with extended roadmap for embedded designs
05/25/2012
Flash memory chip maker Spansion Inc. (NYSE:CODE) debuted its first family of single-level cell (SLC) NAND products using 4Xnm floating-gate technology. Spansion plans to roll out 3X and 2Xnm node versions of the NAND chips in the near future, without obsoleting the more mature designs. |
Field report: CMP users group
05/25/2012
Michael A. Fury reports on the NCCAVS CMP Users Group meeting, held on May 16th. |
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ITF: Reconfigurable radios and scaled CMOS for a true mobile life
05/25/2012
The next big thing according to Charlotte Soens, manager mm-wave communication program at imec, is that people will start using these mobile devices to watch high-quality photos and videos, stored in the cloud. Soens presented details at imec's International Technology Forum. |
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ITF: The technology knobs for system scaling
05/25/2012
At imec's International Technology Forum, An Steegen, Senior Vice President Process Technology at imec, discusses the three technology knobs that are key for a further system scaling. |
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ITF: Life has changed
05/25/2012
At imec's International Technology Forum, the research consortium's CEO, Lec van den Hove, draws attention to the need for the industry to solve the world's health problems. |
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SRC and Stanford University Unveil New Circuit Pattern-Design Process
Researchers sponsored by Semiconductor Research Corp. (SRC), a university-research consortium for semiconductors and rel...
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Ultra Clean Holdings Inks Merger Pact with American Integration Technologies
Ultra Clean Holdings, Inc., a developer and supplier of critical subsystems for the semiconductor capital equipment, fla...
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Exar Corporation CEO Louis DiNardo to Participate in Communications Semiconductors Panel
Exar Corporation President and Chief Executive Officer, Louis DiNardo, has been selected to participate in the Emerging ...
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CVRx Selects ON Semiconductor for Advanced Implantable Device Used in the Treatment of Hypertension
ON Semiconductor, a supplier of high-performance silicon solutions for energy efficient electronics, announced that CVRx...
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SmartKem Drives International Growth Strategy with Appointment of Bill Freer as Chairman
May 29, 2012
SmartKem Limited, the developer of high performance, printable organic semiconductor materials for fle...
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PVD Solutions for Next Generation MEMS and Sensors
As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with ...
Sponsored by
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FREE WEBCAST: Lens Tilt in Small Auto-Focus CamerasThis webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors. Sponsored by
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The ConFab 2012Las Vegas, NV
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Display Week 2012Boston, MA
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IEEE International Interconnect Technology Conference (IITC)San Jose, CA
June 4, 2012
- June 6, 2012
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2012 Symposia on VLSI Technology and CircuitsHonolulu, HI
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Semiconductor Asia 2012Shanghai, China
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imec advances CMOS beyond silicon to Ge, III-V
12/14/2011
Marc Heyns, fellow at research consortium imec, discusses the group's work on chip fab materials beyond silicon, namely, Ge and III-V, presented in...
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Self-powered electronics: Achievements and challenges @ IEDM
12/12/2011
Dennis Buss, a visiting scientist at the Massachusetts Institute of Technology (MIT) and consultant at Texas Instruments (TI), presented "Rese...
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KLA-Tencor enlarges monitor-wafer suite
12/07/2011
KLA-Tencor Corporation (NASDAQ: KLAC) added to its SensArray portfolio of advanced wireless temperature monitoring wafers. The products use time-ba...
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EVG doubles process module space in XT Frame platform
12/05/2011
EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the XT Frame equipment platform for better process throughput and tool...
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