ISSCC round-up: 2.5D packaging for IVRs, smallest NAND flash chip, more
02/22/2012
International Solid-State Circuits Conference (ISSCC) is going on now, gathering semiconductor design and device architecture presentations from research firms like imec to chip companies like IBM. Here are some highlighted presentations. |
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MIT's nanowire growth control method could optimize LEDs, other semiconductors
02/22/2012
MIT researchers used gases to precisely control nanowires' width and composition as they grow, which could yield complex structures optimally designed for particular applications, like LED substrates or solar panels. |
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Chip substrate factory begins producing thermal-control substrates in Russia
02/22/2012
MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month. |
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Semiconductor inventory correction occurred, shows Gartner lead time analysis
02/21/2012
Semiconductor vendors had slow Q3 and Q4 revenues, indicating that the anticipated correction to chip inventory levels occurred, Gartner reports. The correction process will be largely completed by Q1 2012, evidenced by rising trends in the lead-time index. |
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The ultimate limit of Moore’s Law: The one-atom transistor
02/21/2012
A team of researchers at the University of New South Wales, Purdue University and the University of Melbourne have built the smallest transistor ever using a single phosphorous atom. |
IRPS set for April in Anaheim
02/21/2012
The IEEE International Reliability Physics Symposium (IRPS) is set for April 15, 2012 – April 19, 2012, in Anaheim, CA. |
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Combo chipsets to suffer against new embedded WiFi chipsets
02/21/2012
Processors like Qualcomm’s Snapdragon will make an impact on future chip revenues, reports analyst firm In-Stat, an NPD Group company. |
Mouser Electronics Recognized as Leading Global Distribution Partner for New Product Introduction by ON Semiconductor
Mouser Electronics, Inc., a design engineering resource and distributor for semiconductors and electronic components, has been honored with ON Se...
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CYMER REPORTS MULTIPLE TRANSACTIONS BY VP MCGINNIS (California)
WASHINGTON, Feb. 22 -- Cymer Inc. (CYMI), San Diego, has filed a Form 4 with the Securities and Exchange Commission noting the change in the bene...
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-Broadcom Completes Acquisition of NetLogic Microsystems, Inc
ENP Newswire - 21 February 2012
Release date- 17022012 - IRVINE and SANTA CLARA, Calif - Broadcom Corporation (NASDAQ: BRCM), a global innov...
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MONOLITHIC POWER SYSTEMS REPORTS MULTIPLE TRANSACTIONS BY VP TSENG (California)
WASHINGTON, Feb. 21 -- Monolithic Power Systems Inc. (MPWR), San Jose, Calif., has filed a Form 4 with the Securities and Exchange Commission not...
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Preventing the Destructive Potential of Partial Discharge on HV Optic Devices
The Partial Discharge phenomenon has been plaguing the electrical and electronic industries for many years, by damaging equipment and increasing pr...
Sponsored by
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Cooling Thin Consumer Electronic Devices
Today’s modern electronic devices are more dense and capable than ever before. Cooling these devices is important not only for the reliabilit...
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FREE WEBCAST: Lens Tilt in Small Auto-Focus CamerasThis webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors. Sponsored by
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ISS Europe 2012Munich, Germany
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US FPD Smart Displays ConferenceSan Diego, CA
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SPIE Smart Structures and Materials & Nondestructive Evaluation and Health Monitoring 2012San Diego, CA
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Compound Semiconductors CS Europe ConferenceFrankfurt, Germany
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imec advances CMOS beyond silicon to Ge, III-V
12/14/2011
Marc Heyns, fellow at research consortium imec, discusses the group's work on chip fab materials beyond silicon, namely, Ge and III-V, presented in...
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Self-powered electronics: Achievements and challenges @ IEDM
12/12/2011
Dennis Buss, a visiting scientist at the Massachusetts Institute of Technology (MIT) and consultant at Texas Instruments (TI), presented "Rese...
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KLA-Tencor enlarges monitor-wafer suite
12/07/2011
KLA-Tencor Corporation (NASDAQ: KLAC) added to its SensArray portfolio of advanced wireless temperature monitoring wafers. The products use time-ba...
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EVG doubles process module space in XT Frame platform
12/05/2011
EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the XT Frame equipment platform for better process throughput and tool...
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