SEMICONDUCTORS
MAGAZINE
05/01/2013
Volume 56, Issue 3
SEMICONDUCTORS BLOGS
SEMICONDUCTOR ARTICLES
Flexible devices manufactured by roll-to-roll technologies to reach nearly $22.7 billion by 2017
05/23/2013
The diffusion of roll-to-roll technologies is expected to have a marked effect in lowering the unit prices of flexible devices. Consequently, while consumption in terms of volume is forecast to rise very rapidly, revenues will increase somewhat more moderately. |
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Photonics societies launch the National Photonics Initiative to increase R&D and economy
05/23/2013
Photonics societies across the United States today announced the launch of the National Photonics Initiative. |
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Innovation could bring flexible solar cells, transistors, displays
05/22/2013
Researchers have created a new type of transparent electrode that might find uses in solar cells, flexible displays for computers and consumer electronics and future "optoelectronic" circuits for sensors and information processing. |
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Four-junction solar cell achieves 43.6% efficiency
05/22/2013
Soitec announced the PV industry’s first four-junction solar cell device, which uses two dual-junction sub cells grown on different III-V compound materials, which allows optimal band-gap combinations tailored to capture a broader range of the solar spectrum. |
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IDC predicts semiconductor market to experience 3-4% revenue growth in 2013
05/22/2013
IDC expects the semiconductor market to return to growth in 2013 with revenues forecast to increase by 3.5 percent this year. |
North American semiconductor equipment industry posts April 2013 book-to-bill ratio of 1.08
05/22/2013
North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in April 2013 (three-month average basis) and a book-to-bill ratio of 1.08. |
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NSF and SRC to fund research to create failure-resistant systems and circuits
05/21/2013
Leaders of the National Science Foundation (NSF) and the Semiconductor Research Corporation (SRC) today announced 18 new projects funded through a joint initiative to address research challenges in the design of failure-resistant circuits and systems. |
HEADLINES
Dialog Semiconductor Unveils New Bluetooth Smart Chip
Dialog Semiconductor plc, a provider of integrated power management, audio and short-range wireless technologies, recently...
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Panasonic to end US solar wafer processing - report
(SeeNews North America) - May 23, 2013 - Japan's Panasonic Corp (TYO:6752) will terminate production of silicon wafers for...
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Oclaro Enables Direct Diode Systems with Broadest Wavelength Range of High Power Laser Diodes
Unique Design, Packaging and Manufacturing Expertise Enables Oclaro to Deliver Laser Diodes with Highest Performance and B...
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ON Semiconductor Introduces Industry Leading, Best in Class System Level Performance Expansion to IGBT Portfolio
New IGBT devices expand current ratings and deliver efficient, high-speed switching capabilities for power applications su...
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Yerevan to host 9th International Research Conference "Semiconductor Micro- and Nanoelectronics"
Yerevan will host the 9th International Research Conference "Semiconductor Micro- and Nanoelectronics" on May 24.The three...
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Shares of IC inspection tool supplier play catch-up with Largan
Shares of Hermes Microvision Inc., one of Taiwan's leading semiconductor inspection tool and equipment suppliers, extended...
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FINANCIALS
TECHNOLOGY PAPERS
Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...
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Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...
Sponsored by
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WEBCASTS
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...
Sponsored by
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450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
Sponsored by
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VIDEOS
EVENTS
Magnesium Workshop Madrid 2013: An International Workshop on Processing-Microstructure-Mechanical Property of Magnesium AlloysMadrid, Spain
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2013 5th IEEE International Memory Workshop (IMW)Monterey, CA , United States
408-765-5249
May 26, 2013
- May 29, 2013
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2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD)Kanazawa, Japan , Japan
+81 92 805 3227
+81 92 805 3881
May 26, 2013
- May 30, 2013
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ECTCLas Vegas, NV
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2013 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)Seattle, WA , United States
603-885-3279
603-885-8256
June 2, 2013
- June 4, 2013
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NEW PRODUCTS
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3M announces QDEF; to bring 50% more color to LCD devices
May 21, 2013
3M announced today it is in the final stages of scale-up for its new 3M Quantum Dot Enhancement Film (QDEF). The new film allow...
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COMSOL Multiphysics 4.3b offers new additions to simulation platform
May 16, 2013
COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL s...
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Spectra-Physics introduces industrial picosecond laser
May 10, 2013
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...
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Multitest announces ecoAmp for high-power applications
May 8, 2013
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...
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