Applied Materials selects Praxair gas system for Varian VIIsta ion implant tools
02/15/2012
The UpTime sub-atmospheric dopant gas delivery system from Praxair Electronics will be Applied Materials' (AMAT's) factory default standard for the Varian VIISta ion implant platform. |
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49 semiconductor wafer fabs close 2009-2011
02/15/2012
IC manufacturers closed 49 wafer fabs between 2009 and 2011, according to IC Insights. Smaller wafer fabs (≤200mm) suffered the most closures, and Japan and North America led the way. |
ISMI convenes 200mm semiconductor fab tool obsolescence forum
02/15/2012
Tool obsolescence is increasingly important to semiconductor manufacturers running 200mm wafer fab lines, reports ISMI, which has chartered an Equipment Obsolescence Forum for alternative sourcing. |
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SPIE Advanced Lithography: Intel's, TSMC's tool roadmap takeaways
02/15/2012
After attending SPIE Advanced Lithography, Barclays Capital came away with a lower lithography tool shipments forecast, more hope for EUV lithography, and expectations of a litho buying spree at Intel. |
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Smart electronics subject of Renesas ConFab keynote
02/14/2012
The ConFab's second-day keynote will be "Smart Society, the Sensing Era and Signal Chain" presented by Ali Sebt, CEO of Renesas Electronics America. |
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SRC to advance PV and smart grid technologies
02/14/2012
Hydro One Networks, NEC and ON Semiconductor join SRC’s global Energy Research Initiative, expanding the focus to include finding new materials, devices and methodologies for power controls/management and energy collection, conversion and storage. |
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Techcet reveals CMP metrology, supply, and process trends
02/14/2012
Lita Shon-Roy and Michael Fury, PhD, Techcet will present "CMP Market Outlook & New Technology - Dynamic Slurry Metrology," a free webinar at 2 times on February 22. |
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PERICOM SEMICONDUCTOR REPORTS DISPOSITION BY SENIOR VP RESEARCH AND DEVELOPMENT HUI (California)
WASHINGTON, Feb. 15 -- Pericom Semiconductor Corp. (PSEM), San Jose, Calif., has filed a Form 4 with the Securities and Exchange Commission notin...
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PERICOM SEMICONDUCTOR REPORTS DISPOSITION BY OFFICER CHEN (California)
WASHINGTON, Feb. 15 -- Pericom Semiconductor Corp. (PSEM), San Jose, Calif., has filed a Form 4 with the Securities and Exchange Commission notin...
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VOLTERRA SEMICONDUCTOR REPORTS MULTIPLE TRANSACTIONS BY DIRECTOR ROSS (California)
WASHINGTON, Feb. 15 -- Volterra Semiconductor Corp. (VLTR), Fremont, Calif., has filed a Form 4 with the Securities and Exchange Commission notin...
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Chip Shot: Happy 100th Arizona: Intel Microprocessor One of State's Great Innovations
February 14, 2012
Today, Arizona celebrates 100 years of statehood. Noting important people, places and events that shaped the state, the In...
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Preventing the Destructive Potential of Partial Discharge on HV Optic Devices
The Partial Discharge phenomenon has been plaguing the electrical and electronic industries for many years, by damaging equipment and increasing pr...
Sponsored by
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Cooling Thin Consumer Electronic Devices
Today’s modern electronic devices are more dense and capable than ever before. Cooling these devices is important not only for the reliabilit...
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FREE WEBCAST: Lens Tilt in Small Auto-Focus CamerasThis webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors. Sponsored by
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ISS Europe 2012Munich, Germany
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SPIE Smart Structures and Materials & Nondestructive Evaluation and Health Monitoring 2012San Diego, CA
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Compound Semiconductors CS Europe ConferenceFrankfurt, Germany
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Printed Electronics Europe 2012Berlin, Germany
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imec advances CMOS beyond silicon to Ge, III-V
12/14/2011
Marc Heyns, fellow at research consortium imec, discusses the group's work on chip fab materials beyond silicon, namely, Ge and III-V, presented in...
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Self-powered electronics: Achievements and challenges @ IEDM
12/12/2011
Dennis Buss, a visiting scientist at the Massachusetts Institute of Technology (MIT) and consultant at Texas Instruments (TI), presented "Rese...
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KLA-Tencor enlarges monitor-wafer suite
12/07/2011
KLA-Tencor Corporation (NASDAQ: KLAC) added to its SensArray portfolio of advanced wireless temperature monitoring wafers. The products use time-ba...
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EVG doubles process module space in XT Frame platform
12/05/2011
EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the XT Frame equipment platform for better process throughput and tool...
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