Gigaphoton opens Korean subsidiary for DUV, EUV lithography support
05/16/2012
Gigaphoton Inc., lithography light source manufacturer, began operations at its wholly owned subsidiary, Gigaphoton Korea Inc. Gigaphoton points to Korea as “one of the most important regions in the global semiconductor industry.” |
|
Microsoft joins Hybrid Memory Cube Consortium
05/16/2012
The Hybrid Memory Cube Consortium (HMCC) is a collaboration developing and implementing an open interface standard for Hybrid Memory Cube semiconductor memory architectures. Microsoft Corp. has now joined the consortium. |
|
SMIC expands Beijing fab for smaller-node semiconductor manufacturing
05/15/2012
Semiconductor Manufacturing International Corporation (SMIC) signed a cooperation framework document between its subsidiary SMIC Beijing and the Beijing municipal government, forming a joint venture for SMIC Beijing's expansion adjacent to its 12” mega-fab. |
|
Buhler approved to acquire Leybold Optics
05/15/2012
Bühler’s acquisition of Leybold Optics from EQT III, for an undisclosed sum, was approved without any restrictions by anti-trust authorities. |
|
SUSS MicroTec takes over SUSS MicroOptics
05/15/2012
SÜSS MicroTec AG has increased its shareholding in SUSS MicroOptics S.A. to 100%. SUSS MicroOptics is a leading company for high-quality refractive and diffractive micro-optics. |
|
|
DRAM partially recovers thanks to Elpida bankruptcy
05/15/2012
The market for DRAM is expected to partially reverse the drastic losses it incurred in 2011 and achieve revenue growth this year, the result of balanced supply and demand following the exit of major manufacturer Elpida Memory, according to IHS. |
Infineon CEO Bauer resigns for health considerations
05/15/2012
Infineon Technologies AG (FSE:IFX, OTCQX:IFNNY) CEO Peter Bauer will resign his post at the end of the current fiscal year (September 30, 2012) due to worsening osteoporosis. |
|
Chinese GaAs foundry installs SPTS PVD tool
05/15/2012
SPTS Technologies installed a Sigma fxP physical vapor deposition (PVD) system at a Chinese foundry producing RF devices on gallium arsenide (GaAs) substrates. |
|
MAGNACHIP SEMICONDUCTOR REPORTS DISPOSITION BY PRESIDENT HWANG (Europe)
WASHINGTON, May 17 -- MagnaChip Semiconductor Corp. (MX), Luxembourg, has filed a Form 4 with the Securities and Exchang...
|
AXT REPORTS ACQUISITION BY DIRECTOR CHEN (California)
WASHINGTON, May 17 -- AXT Inc. (AXTI), Fremont, Calif., has filed a Form 4 with the Securities and Exchange Commission n...
|
PERICOM SEMICONDUCTOR REPORTS DISPOSITION BY SENIOR VP FINANCE TACHIBANA (California)
WASHINGTON, May 17 -- Pericom Semiconductor Corp. (PSEM), San Jose, Calif., has filed a Form 4 with the Securities and E...
|
AXT REPORTS ACQUISITION BY DIRECTOR LEBLANC (California)
WASHINGTON, May 17 -- AXT Inc. (AXTI), Fremont, Calif., has filed a Form 4 with the Securities and Exchange Commission n...
|
AXT REPORTS ACQUISITION BY DIRECTOR CHANG (California)
WASHINGTON, May 17 -- AXT Inc. (AXTI), Fremont, Calif., has filed a Form 4 with the Securities and Exchange Commission n...
|
PVD Solutions for Next Generation MEMS and Sensors
As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with ...
Sponsored by
|
FREE WEBCAST: Lens Tilt in Small Auto-Focus CamerasThis webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors. Sponsored by
|
Advanced Semiconductor Manufacturing ConferenceSaratoga Springs, NY
|
IEEE Photonics Society 2012 Optical Interconnects ConferenceSanta Fe, NM
|
Korea Display Conference 2012Seoul, South Korea
|
The ConFab 2012Las Vegas, NV
|
Display Week 2012Boston, MA
|
imec advances CMOS beyond silicon to Ge, III-V
12/14/2011
Marc Heyns, fellow at research consortium imec, discusses the group's work on chip fab materials beyond silicon, namely, Ge and III-V, presented in...
|
Self-powered electronics: Achievements and challenges @ IEDM
12/12/2011
Dennis Buss, a visiting scientist at the Massachusetts Institute of Technology (MIT) and consultant at Texas Instruments (TI), presented "Rese...
|
KLA-Tencor enlarges monitor-wafer suite
12/07/2011
KLA-Tencor Corporation (NASDAQ: KLAC) added to its SensArray portfolio of advanced wireless temperature monitoring wafers. The products use time-ba...
|
EVG doubles process module space in XT Frame platform
12/05/2011
EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the XT Frame equipment platform for better process throughput and tool...
|
