Tokyo Electron (TEL) establishes organic EL and FPD departments, eliminates MEMS dev
02/03/2012
Tokyo Electron Ltd. (TEL) restructured its organization, with a new "Organic EL Division" established under GM Takeshi Okubo, as well as other new and consolidating subsidiaries in the semiconductor and liquid crystal production segments. |
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AMD outlines SoC-centric strategy
02/03/2012
AMD's (NYSE:AMD) new president and CEO Rory P. Read detailed what he called an "ambidextrous" strategy for the company, building on its x86 and graphics IP while incorporating other technologies and IP for differentiation in the electronics marketplace. |
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Smart mobile consumer electronics head for 25%+ growth
02/02/2012
Consumer electronics devices are shifting from specific functions to multiple functions and Internet connectivity, creating an overlap of features and functions between product categories not only in the mobile segment, but also in other CE devices like digital TVs and set top boxes. This entire ...
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Wireless leads semiconductor-related OEM spending in 2011
02/02/2012
Propelled by the appeal of Apple Inc.’s iPhone and iPad, the wireless communications sphere surpassed computers to lead all segments in semiconductor-related spending among top OEMs in 2011. |
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Tackling EUV lithography shadow distortions with OPC
02/02/2012
James Word and Christian Zunia, Mentor Graphics, explore the current capabilities of model-based OPC software to model and correct for the shadowing distortions unique to extreme ultra-violet lithography (EUVL). |
Soitec advances LED strategy with Altatech Semiconductor buy
02/01/2012
Soitec (Euronext Paris) completed its acquisition of all of the outstanding shares of Altatech Semiconductor S.A. The final purchase price was EUR15 million. |
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Gore debuts high-purity 20nm PTFE filter for semiconductor, FPD fab
02/01/2012
Gore introduced a 20nm-rated PTFE filter, available in a HDPE cartridge. The filter is optimized for bulk processing high-purity chemicals used in semiconductor and flat panel display manufacturing. |
Sematech: Soitec Joins Front End Processes and Advanced Metrology Programs
Sematech announced that Soitec, a manufacturer of semiconductor substrates for the electronics and energy industries, has joined Sematech's Front E...
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Innovative Micro Technology Names Craig Ensley as CEO
Innovative Micro Technology, Inc. (IMT) announced that Craig Ensley has joined IMT as President and Chief Executive Officer.
In a release on Jan. 2...
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Financial year 2011-2012: Soitec provides full year guidance on its results
January 31, 2012
Bernin, France -- Soitec (Euronext Paris), a world leader in generating and manufacturing revolutionary semiconductor materials fo...
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VOLTERRA SEMICONDUCTOR REPORTS ACQUISITION BY SENIOR VP FINANCE BURNS (California)
WASHINGTON, Jan. 31 -- Volterra Semiconductor Corp. (VLTR), Fremont, Calif., has filed a Form 4 with the Securities and Exchange Commission noting ...
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Preventing the Destructive Potential of Partial Discharge on HV Optic Devices
The Partial Discharge phenomenon has been plaguing the electrical and electronic industries for many years, by damaging equipment and increasing pr...
Sponsored by
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Cooling Thin Consumer Electronic Devices
Today’s modern electronic devices are more dense and capable than ever before. Cooling these devices is important not only for the reliabilit...
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FREE WEBCAST: Lens Tilt in Small Auto-Focus CamerasThis webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors. Sponsored by
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APEC 2012Orlando, FL
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Strategies in LightSanta Clara, CA
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LED Korea 2012Seoul, Korea
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ISS Europe 2012Munich, Germany
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imec advances CMOS beyond silicon to Ge, III-V
12/14/2011
Marc Heyns, fellow at research consortium imec, discusses the group's work on chip fab materials beyond silicon, namely, Ge and III-V, presented in...
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Self-powered electronics: Achievements and challenges @ IEDM
12/12/2011
Dennis Buss, a visiting scientist at the Massachusetts Institute of Technology (MIT) and consultant at Texas Instruments (TI), presented "Rese...
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KLA-Tencor enlarges monitor-wafer suite
12/07/2011
KLA-Tencor Corporation (NASDAQ: KLAC) added to its SensArray portfolio of advanced wireless temperature monitoring wafers. The products use time-ba...
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EVG doubles process module space in XT Frame platform
12/05/2011
EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the XT Frame equipment platform for better process throughput and tool...
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