SEMICONDUCTORS

SEMICONDUCTOR NEWS & FEATURES

Gigaphoton opens Korean subsidiary for DUV, EUV lithography support

05/16/2012

Gigaphoton Inc., lithography light source manufacturer, began operations at its wholly owned subsidiary, Gigaphoton Korea Inc. Gigaphoton points to Korea as “one of the most important regions in the global semiconductor industry.”

Microsoft joins Hybrid Memory Cube Consortium

05/16/2012

The Hybrid Memory Cube Consortium (HMCC) is a collaboration developing and implementing an open interface standard for Hybrid Memory Cube semiconductor memory architectures. Microsoft Corp. has now joined the consortium.

SMIC expands Beijing fab for smaller-node semiconductor manufacturing

05/15/2012

Semiconductor Manufacturing International Corporation (SMIC) signed a cooperation framework document between its subsidiary SMIC Beijing and the Beijing municipal government, forming a joint venture for SMIC Beijing's expansion adjacent to its 12” mega-fab.

Buhler approved to acquire Leybold Optics

05/15/2012

Bühler’s acquisition of Leybold Optics from EQT III, for an undisclosed sum, was approved without any restrictions by anti-trust authorities.

SUSS MicroTec takes over SUSS MicroOptics

05/15/2012

SÜSS MicroTec AG has increased its shareholding in SUSS MicroOptics S.A. to 100%. SUSS MicroOptics is a leading company for high-quality refractive and diffractive micro-optics.

IHS DRAM predictions.

DRAM partially recovers thanks to Elpida bankruptcy

05/15/2012

The market for DRAM is expected to partially reverse the drastic losses it incurred in 2011 and achieve revenue growth this year, the result of balanced supply and demand following the exit of major manufacturer Elpida Memory, according to IHS.

Infineon CEO Bauer resigns for health considerations

05/15/2012

Infineon Technologies AG (FSE:IFX, OTCQX:IFNNY) CEO Peter Bauer will resign his post at the end of the current fiscal year (September 30, 2012) due to worsening osteoporosis.

Chinese GaAs foundry installs SPTS PVD tool

05/15/2012

SPTS Technologies installed a Sigma fxP physical vapor deposition (PVD) system at a Chinese foundry producing RF devices on gallium arsenide (GaAs) substrates.

SEMICONDUCTORS LIVE NEWS STREAM

MAGNACHIP SEMICONDUCTOR REPORTS DISPOSITION BY PRESIDENT HWANG (Europe)

WASHINGTON, May 17 -- MagnaChip Semiconductor Corp. (MX), Luxembourg, has filed a Form 4 with the Securities and Exchang...

AXT REPORTS ACQUISITION BY DIRECTOR CHEN (California)

WASHINGTON, May 17 -- AXT Inc. (AXTI), Fremont, Calif., has filed a Form 4 with the Securities and Exchange Commission n...

PERICOM SEMICONDUCTOR REPORTS DISPOSITION BY SENIOR VP FINANCE TACHIBANA (California)

WASHINGTON, May 17 -- Pericom Semiconductor Corp. (PSEM), San Jose, Calif., has filed a Form 4 with the Securities and E...

AXT REPORTS ACQUISITION BY DIRECTOR LEBLANC (California)

WASHINGTON, May 17 -- AXT Inc. (AXTI), Fremont, Calif., has filed a Form 4 with the Securities and Exchange Commission n...

AXT REPORTS ACQUISITION BY DIRECTOR CHANG (California)

WASHINGTON, May 17 -- AXT Inc. (AXTI), Fremont, Calif., has filed a Form 4 with the Securities and Exchange Commission n...

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PVD Solutions for Next Generation MEMS and Sensors

As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with ...
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FREE WEBCAST: Lens Tilt in Small Auto-Focus Cameras

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SEMICONDUCTORS EVENTS

SEMICONDUCTORS PODCASTS

imec advances CMOS beyond silicon to Ge, III-V

12/14/2011 Marc Heyns, fellow at research consortium imec, discusses the group's work on chip fab materials beyond silicon, namely, Ge and III-V, presented in...

Self-powered electronics: Achievements and challenges @ IEDM

12/12/2011 Dennis Buss, a visiting scientist at the Massachusetts Institute of Technology (MIT) and consultant at Texas Instruments (TI), presented "Rese...

KLA-Tencor enlarges monitor-wafer suite

12/07/2011 KLA-Tencor Corporation (NASDAQ: KLAC) added to its SensArray portfolio of advanced wireless temperature monitoring wafers. The products use time-ba...

EVG doubles process module space in XT Frame platform

12/05/2011 EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the XT Frame equipment platform for better process throughput and tool...

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