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October 4, 2011 -- Peter Brenner, global marketing manager, photovoltaics, at DuPont MCM was interviewed by ElectroIQ.com about DuPont’s new lower-silver Solamet metallization pastes. He explained that, to achieve strong electrical performance with reduced silver content, the tabbing material needs to have good solderability (which means sufficient metal laydown) and good adhesion (which comes from very good frit properties), and depending on the cell configuration, it may also need good conductivity. Listen to his interview below.
