Direct chip bonding, all-SiC design increase power density in Mitsubishi Electric inverter
May 23, 2012
Mitsubishi Electric Corporation developed a prototype forced-air-cooled three-phase 400V output inverter with all-silicon carbide (SiC) power modules and direct lead bonding that has a power density of 50kVA per liter. |
Amkor plans semiconductor packaging and test facility in Korea
May 19, 2012
Amkor Technology Inc. (NASDAQ:AMKR) plans to build a state-of-the-art factory and global research and development center in the Incheon Free Economic Zone, which is located in the greater metropolitan area of Seoul, Korea. |
Silicon Labs offers bare die from 1 wafer and up
May 16, 2012
Mixed-signal IC maker Silicon Laboratories Inc. (NASDAQ: SLAB) introduced a microcontroller (MCU) die sales program with a minimum order quantity of 1 wafer. |
CMOS image sensor suppliers ramp up 300mm capacity
May 11, 2012
CMOS image sensors (CIS) are breaking sales records again, after several years without upward momentum, reports IC Insights. New portable systems and embedded imaging are lifting CIS to $6.3 billion in 2012 and new record sales each year through 2016. |
SATS provider Carsem begins LED packaging and test
May 4, 2012
Semiconductor packaging and test services provider Carsem will assemble and test LED packages, partnering with a key customer and applying semiconductor packaging technologies for better LEDs. |
Micropelt raises EUR6.5M for wafer-based energy harvesting technology
May 3, 2012
Micropelt has raised EUR6.5 million for the roll-out and global expansion of its thin-film thermoelectric energy harvesting technology: EUR5 million by Ludgate Environmental Fund (LEF); EUR1 million from the MUCAP; and EUR0.5 million by the existing shareholders IBG/Goodvent, KfW, L-Bank and SHS.
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GaN Systems collaborates with APEI to optimize power electronics packaging
May 3, 2012
GaN Systems and Arkansas Power Electronics International will co-develop a high-temperature, high-performance package optimized for gallium nitride (GaN) transistors and diodes. |
David McCann of GLOBALFOUNDRIES to speak at The ConFab 2012
May 3, 2012
Solid State Technology is proud to announce that David McCann will speak at The ConFab 2012. David, the Senior Director for Packaging R&D at GLOBALFOUNDRIES in Malta, New York, will speak on the evolution toward silicon-based interconnect and packaging, which is having profound impact on how ...
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What have we done for you lately?
May 1, 2012
This page is usually reserved for a guest editorial by someone in the industry that wants to rant a little bit about the lack of standards in any given area, the need to get young students interested in engineering and the sciences, why fab safety is so important, or answering the call to innovat...
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MEMS packaging growth, trends, and special requirements
May 1, 2012
The MEMS packaging sector is growing 2x faster (~20% CAGR) by unit shipments than the larger IC packaging industry, shows Yole Développement in its report "MEMS Packaging." |
NXP increases pad pitch while shrinking package form factor
Apr 24, 2012
NXP Semiconductors released the new SOT1226 "Diamond" package using a “unique pad pitch design” to shrink the package by 25% from the prior design, with a 0.5mm pad pitch, 50% larger than typical small package designs. |
EoPlex builds packaging facility in Malaysia
Apr 24, 2012
EoPlex Limited, a subsidiary of ASTI Holdings Limited, Singapore, will open a new factory for its xLC semiconductor package technology in Q2 2012, in Malaysia. |
Toshiba builds semiconductor fab in Thailand to replace flooded fab
Apr 24, 2012
Toshiba Corporation (TOKYO: 6502) will rebuild its semiconductor manufacturing operations in Thailand by relocating Toshiba Semiconductor Thailand Co., Ltd. (TST) to a new manufacturing facility. |
STATS ChipPAC adds Pasquale Pistorio, STMicroelectronics leader, to Board
Apr 23, 2012
Semiconductor packaging service provider STATS ChipPAC Ltd. (SGX-ST:STATSChP) appointed Pasquale Pistorio as a member of the Board of Directors, effective immediately. |
Mold packaging meets metal TSV for 5-10x density of conventional substrates
Apr 19, 2012
Silex Microsystems brought its Met-Via full-wafer-thickness TSV technology into Chip Architectures by Joint Associated Labs for European Diagnostics, where it is being used to create cost-effective molded chip-level packaging with through metal vias. |
ASMC will focus on productivity and technology challenges
Apr 18, 2012
The 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2012) will be held May 15-17 in Saratoga Springs, New York. The conference will feature presentations of more than 85 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event...
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ChipMOS expands semiconductor assembly and test services with new building in Taiwan
Apr 16, 2012
ChipMOS TECHNOLOGIES INC. (ChipMOS Taiwan), purchased a 393,173sq.ft. building adjacent to its existing facility in Southern Taiwan Science Park. |
Advanced semiconductor packaging start-up Deca could take over SPWR fab
Apr 16, 2012
WLCSP start-up Deca Technologies might take over SunPower Corp.'s Fab 1, when the solar photovoltaics supplier consolidates its Philippine manufacturing operations to Fab 2 this quarter. |
Conference Report: MRS Spring 2012, Day 3
Apr 12, 2012
Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- κ dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible...
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Georgia Tech targets thin 3D packaging with new consortium
Apr 11, 2012
Georgia Tech's Packaging Research Center proposes a new consortium on 3D semiconductor packaging called 3D ThinPack for ultra-miniaturized 3D heterogeneous, RF, digital and power modules in partnership with global companies. |
