Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.

The 2012 IMAPS Device Packaging Conference will take place March 6-8 in Fountain Hills, AZ, with Amkor's Dr. Robert Darveaux presenting "Escalating Challenges in Developing Complex Solutions for Next Generation Package and Interconnect Technologies."

CMOS image sensors in 2011 continued to push CCD sensors into a smaller, isolated section of the market. CMOS image sensors are growing on use in mobile electronics and emerging applications, shows analyst firm IHS, and will find more adoption as back-side illumination costs come down.

Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.

Amkor (NASDAQ:AMKR) shared that it cut costs through workforce reductions in Q4 2012, and announced a voluntary retirement program in Japan to continue this initiative.

The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.

Kyocera America, Inc. doubled its flip chip assembly capacity for microelectronic devices with a $3.5 million Class-10,000 cleanroom, offering lead-free processes in San Diego.

STATS ChipPAC decided not to resume semiconductor assembly operations in its Thailand plant, owing to extensive equipment and facility damages sustained during the disastrous floods in 2011.

While Apple's release of the iPhone 4S in Q4 2011 "unleashed tremendous pent-up demand" from consumers, Samsung used its broad range of smartphones to take the top spot, reports IHS.

The USPTO is looking to increase the diversity of honorees for its annual National Medal of Technology and Innovation (NMTI), honoring "this nation's creative geniuses."

Si-Ware Systems debuted the SiMOST platform to fab and package single-chip optical systems with validated MEMS components. Multiple MOEMS structures can be patterned and etched on SOI wafers using DRIE. The structures are then wafer-level packaged and diced.

Silex Microsystems joined Energy-efficient Piezo-MEMS Tunable RF Front-End Antenna Systems for Mobile Devices to develop TSVs, PZT thin films, and other technologies for high-performance RF systems targeting mobile devices.

Minco Technology Labs, hi-rel semiconductor die processing, packaging and test provider, appointed board member Bill Bradford as president and CEO.

Samsung Electronics began producing embedded multi-chip package (eMCP) memory for use in entry- to mid-level smartphones. The products use low power double-data-rate 2 (LPDDR2) 30nm DRAM and 20nm NAND flash memory.

For the first time, Apple Inc. has publicly published a list of over 150 companies that the electronics giant says represent 97% of its procurement expenditures for materials, manufacturing, and assembly of products worldwide.

Increased I/O density, power/performance reqs, and other factors are increasing use of flip chip, 2.5D and 3D technologies, a boon to packaging subcontractors. But they face a challenge from foundries, and must navigate under-utilization of wire bonding capacity.

Packaging house Inari Berhad signed an MOU to acquire Amertron Global, which operates in the Philippines and China providing microelectronics and optoelectronics manufacturing services.

STATS ChipPAC held the groundbreaking ceremony for a new factory in Singapore, which will enable STATS ChipPAC to expand its manufacturing capabilities for advanced wafer level technologies.