WAFER LEVEL PACKAGING
PACKAGING BLOGS
IFTLE 151 2013 IMAPS Device Packaging Conf part 1 - Amkor
Sun Jun 16 11:30:00 CDT 2013
IFTLE 150 ICEP Osaka part 1
Mon Jun 10 10:22:00 CDT 2013
Tackling Design for Yield Questions at DAC
Wed May 22 15:39:00 CDT 2013
Join The ConFab discussion
Tue Feb 26 11:27:00 CST 2013
WAFER LEVEL PACKAGING ARTICLES
TSMC keynoter suggests WLSI at IITC
Jun 14, 2013
In a keynote at the IEEE International Interconnect Technology Conference (IITC), Douglas Yu from TSMC talked about Moore’s Law scaling becoming increasingly difficult. |
"Generation Mobile": Advanced Packaging Technology at SEMICON West
Jun 6, 2013
Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function. |
Fab equipment spending: 23% growth for 2014
Jun 4, 2013
Fab equipment spending will grow two percent year-over-year (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of th...
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NVIDIA's GPUs; Patent analysis
Jun 3, 2013
NVIDIA has publically updated their roadmap with the announcement of the GPU family that will follow 2014's Maxwell family. That new family is Volta which will use stacked DRAM,...
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Dow Corning and SÜSS MicroTec report new temporary bonding solution for 2.5D and 3D IC packaging
May 29, 2013
The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at ECTC 2013, with the report of an advanced new temporary bonding so...
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OMRON develops MEMS non-contact thermal sensor utilizing wafer-level vacuum packaging
May 29, 2013
OMRON Corporation today announced that they have finished development work on the world's first infrared sensor manufactured with wafer-level vacuum packaging technology to crea...
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HEADLINES
Australia: Apple Owns Trademark for 'MADE FOR IPHONE' and 'MOBILE TELEPHONE,STYLISED'
Australia, June 19 -- Apple Inc., California, U.S., owns the trademark (1529590) for 'MADE FOR IPHONE' and 'MOBILE TELEPHONE,STYLISED' from Dec. 5, 2012, thr...
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Australia: Apple Owns Trademark for 'MADE FOR IPOD' and 'AUDIO-VISUAL'
Australia, June 19 -- Apple Inc., California, U.S., owns the trademark (1529588) for 'MADE FOR IPOD' and 'AUDIO-VISUAL' from Dec. 5, 2012, through Dec. 5, 2022.
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ITT Exelis receives multimillion dollar contract from Lockheed Martin F-35 program
ITT Exelis (NYSE: XLS) has been awarded a multi-million dollar contract from Lockheed Martin to fabricate composite blade seal components for all variants of...
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United Kingdom Intellectual Property Office Publishes Application for Trademark "LOOK INSIDE" to Intel for Multiple Goods and Services
South Wales, United Kingdom, June 18 -- Intel Corp., California, United States of America, has filed the trademark "LOOK INSIDE" on March 12 for multiple goo...
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Apple Looking At Bigger IPhone Screens, Multiple Colours: Sources
Karachi, June 16 -- Apple Inc is exploring launching iPhones with bigger screens, as well as cheaper models in a range of colours, over the next year, said f...
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Addressing new silicon test challenges with IJTAG; DESIGN FOR TEST; Statistical data
The continued exponential growth in semiconductor device functionality and performance relies not only on continued transistor scaling as defined...
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