Partnership forms to commercialize advanced photonic chip innovations
Nov 29, 2011
The Institute of Microelectronics, a research institute of Singapore's A*STAR, plans to commercialize key innovations in silicon photonic chips designed to support high-speed, h...
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OSRAM envelops LED chip in reflective package
Nov 29, 2011
OSRAM Opto Semiconductors introduced the Oslon Square LED for lighting applications, packaged enclosed in a reflective layer to boost light output. |
DAC seeks speakers bureau experts
Nov 23, 2011
The Design Automation Conference (DAC) is soliciting semiconductor industry experts for participation in invited sessions, panels, and other events at the 49th DAC, June 3-7, 20...
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STATS ChipPAC expands wafer-level chipscale packaging in Taiwan
Nov 17, 2011
STATS ChipPAC Ltd. completed the expansion of its 300mm wafer bump and wafer-level chipscale packaging (WLCSP) operation in Taiwan. |
Report examines fan-out wafer-level packaging momentum, assembly pricing trends
Nov 16, 2011
Fan-out wafer-level packaging (FO-WLP) is gaining momentum as an option for devices with large numbers of I/Os, vs. going finer-pitch to keep using conventional fan-in technolog...
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SUSS MicroTec sends equipment to SVTC in MEMS, 3D IC dev partnership
Nov 15, 2011
Nanotechnology accelerator SVTC Technologies partnered with SUSS MicroTec on wafer-level packaging for MEMS, and 3D IC bonding technology development. |
Keithley Instruments upgrades semiconductor test software suite
Jan 26, 2012
Keithley Instruments Inc. upgraded the capabilities of its Automated Characterization Suite Test Environment to ACS Version 4.4. The software is used with se...
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BSE Group achieves milestones in semiconductor equipment financing biz
Jan 26, 2012
Test Advantage Capital Group, a business of BSE Group, surpassed $150M in its portfolio of semiconductor manufacturing equipment under management. Boston Sem...
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Metallization processes for standardized wide-IO memory applications
Jan 26, 2012
A new generation of nanotechnology-based wet-process films provides process simplification, performance boost and cost reduction beyond TSVs. Claudio Truzzi,...
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3D MID sensor fabricated with Ticona laser-activated LCP circuits
Jan 25, 2012
2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic ...
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Presto Engineering semiconductor service hub opens in Israel
Jan 24, 2012
Presto Engineering, integrated semiconductor test and product engineering services provider, opened its newest Hub to serve the semiconductor design communit...
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Preventing the Destructive Potential of Partial Discharge on HV Optic Devices
The Partial Discharge phenomenon has been plaguing the electrical and electronic industries for many years, by damaging equipment and increasing production c...
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Enabling Thinner Packages through Novel Materials Innovations
According to a new industry report, thinned wafers will comprise the majority of wafers in the device market by 2016. (1) The study indicates that memory and...
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New Pressureless, High UPH Silver Sintering Technology Charges Up Power Device Manufacturers
Silver sintering is not a new technology. In fact, it has been around for some time. What is new, however, is a groundbreaking material innovation that now a...
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FREE WEBCAST: Lens Tilt in Small Auto-Focus CamerasThis webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors. Sponsored by
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FREE WEBCAST: Light and Color Measurement of Today's LED TechnologyThe seminar is an ideal fit for anyone interested in characterizing and communicating the light and color properties of LED’s accurately. Sponsored by
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