WAFER LEVEL PACKAGING
PACKAGING BLOGS
WAFER LEVEL PACKAGING ARTICLES
Mentor and Tezzaron optimize Calibre 3DSTACK for 2.5/3D-ICs
May 20, 2013
Mentor Graphics Corp. and Tezzaron Semiconductor Corp. today announced they are collaborating to integrate the Mentor Calibre 3DSTACK product into Tezzaron’s 3D-IC offerings.
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Yole Developpement conducts 2.5D, 3DIC and TSV interconnect patent investigation
May 15, 2013
Yole Développement announced its 2.5D, 3DIC and TSV Interconnect Patent Investigation report. For this analysis of 3D packaging technology patents, more than 1800 patent familie...
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Global semiconductor sales outpace last year through Q1 of 2013
May 14, 2013
Sales in March 2013 were up slightly compared to February 2013 and March 2012. |
Silex joins ENIAC project to develop new solutions for TSV and wafer bonding
May 13, 2013
Silex Microsystems, the world’s largest pure-play MEMS foundry, today announced that it has joined an international European Union-funded program aimed at developing a new MEMS ...
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MOSIS collaborates with imec, Tyndall and ePIXfab on silicon photonics
May 2, 2013
MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with imec, Ireland's Tyndall National Institute and ePIXfab, the Eur...
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EI’s SiP successful in hit-to-kill interceptor test
May 2, 2013
Endicott Interconnect Technologies, Inc. (EI) announced that its System-In-Package (SiP) technology performed successfully in a military test of a small hit-to-kill interceptor ...
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HEADLINES
Going Underground with Microelectronics; Torrey Hills Technologies, LLC Receives Federal Tibbetts Award for Game-Changing Coal Mine Safety Innovation
Torrey Hills Technologies, LLC (THT) was named as a winner of the 2013 Tibbetts Award at the White House today for the commercialization of its game-changing...
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Advanced Semiconductor Engineering, Inc. Announces Monthly Net Revenues
Advanced Semiconductor Engineering, Inc. (NYSE: ASX, TAIEX: 2311, "ASE" or the "Company"), announces its unaudited consolidated net revenues for April ...
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Worldwide semiconductor assembly and test services market grew 2.1% in 2012
CHENNAI: The worldwide semiconductor assembly and test services (SATS) market totaled $24.5 billion in 2012, a 2.1% increase from 2011, according to final ...
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Worldwide semiconductor assembly and test services market grew 2.1% in 2012
CHENNAI: The worldwide semiconductor assembly and test services (SATS) market totaled $24.5 billion in 2012, a 2.1% increase from 2011, according to final re...
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How to Design 2.5/3D Chips: The Future of Electronics; To harness the full capacity of 2.5/3D technology, the engineers need to understand that they will no longer be designing a chip or a circuit individually but a whole system at one shot!
Janani Gopalakrishnan Vikram
As 2D chips are getting crowded, 2.5D and 3D chips seem to be the way ahead-to extend Moore's Law. Both involve stacking ...
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How to Design 2.5/3D Chips: The Future of Electronics; To harness the full capacity of 2.5/3D technology, the engineers need to understand that they will no longer be designing a chip or a circuit individually but a whole system at one shot!
Janani Gopalakrishnan VikramAs 2D chips are getting crowded, 2.5D and 3D chips seem to be the way ahead-to extend Moore's Law. Both involve stacking chips, o...
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