Direct chip bonding, all-SiC design increase power density in Mitsubishi Electric inverter
May 23, 2012
Mitsubishi Electric Corporation developed a prototype forced-air-cooled three-phase 400V output inverter with all-silicon carbide (SiC) power modules and direct lead bonding tha...
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Amkor plans semiconductor packaging and test facility in Korea
May 19, 2012
Amkor Technology Inc. (NASDAQ:AMKR) plans to build a state-of-the-art factory and global research and development center in the Incheon Free Economic Zone, which is located in t...
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Silicon Labs offers bare die from 1 wafer and up
May 16, 2012
Mixed-signal IC maker Silicon Laboratories Inc. (NASDAQ: SLAB) introduced a microcontroller (MCU) die sales program with a minimum order quantity of 1 wafer. |
CMOS image sensor suppliers ramp up 300mm capacity
May 11, 2012
CMOS image sensors (CIS) are breaking sales records again, after several years without upward momentum, reports IC Insights. New portable systems and embedded imaging are liftin...
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SATS provider Carsem begins LED packaging and test
May 4, 2012
Semiconductor packaging and test services provider Carsem will assemble and test LED packages, partnering with a key customer and applying semiconductor packaging technologies f...
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Micropelt raises EUR6.5M for wafer-based energy harvesting technology
May 3, 2012
Micropelt has raised EUR6.5 million for the roll-out and global expansion of its thin-film thermoelectric energy harvesting technology: EUR5 million by Ludgate Environmental Fun...
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Keithley Instruments upgrades semiconductor test software suite
Jan 26, 2012
Keithley Instruments Inc. upgraded the capabilities of its Automated Characterization Suite Test Environment to ACS Version 4.4. The software is used with se...
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BSE Group achieves milestones in semiconductor equipment financing biz
Jan 26, 2012
Test Advantage Capital Group, a business of BSE Group, surpassed $150M in its portfolio of semiconductor manufacturing equipment under management. Boston Sem...
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Metallization processes for standardized wide-IO memory applications
Jan 26, 2012
A new generation of nanotechnology-based wet-process films provides process simplification, performance boost and cost reduction beyond TSVs. Claudio Truzzi,...
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3D MID sensor fabricated with Ticona laser-activated LCP circuits
Jan 25, 2012
2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic ...
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Presto Engineering semiconductor service hub opens in Israel
Jan 24, 2012
Presto Engineering, integrated semiconductor test and product engineering services provider, opened its newest Hub to serve the semiconductor design communit...
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Keeping Packages Cool and Reliability High
Ever-increasing functionality and ever-decreasing device footprints have presented semiconductor packaging manufacturers with quite a dilemma: how to manage ...
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PVD Solutions for Next Generation MEMS and Sensors
As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with ...
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FREE WEBCAST: Lens Tilt in Small Auto-Focus CamerasThis webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors. Sponsored by
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FREE WEBCAST: Light and Color Measurement of Today's LED TechnologyThe seminar is an ideal fit for anyone interested in characterizing and communicating the light and color properties of LED’s accurately. Sponsored by
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