Present at ESTC 2012 in Amsterdam
Feb 21, 2012
Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexibl...
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Amkor plans IMAPS Device Packaging keynote
Feb 21, 2012
The 2012 IMAPS Device Packaging Conference will take place March 6-8 in Fountain Hills, AZ, with Amkor's Dr. Robert Darveaux presenting "Escalating Challenges in Developing...
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CMOS image sensors keep pushing CCDs out of the picture
Feb 13, 2012
CMOS image sensors in 2011 continued to push CCD sensors into a smaller, isolated section of the market. CMOS image sensors are growing on use in mobile electronics and emerging...
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European microelectronics fab database tracks major changes over past 5 years
Feb 13, 2012
Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufact...
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Amkor continues cost reductions with voluntary retirement in Japan
Feb 10, 2012
Amkor (NASDAQ:AMKR) shared that it cut costs through workforce reductions in Q4 2012, and announced a voluntary retirement program in Japan to continue this initiative. |
2011 ITRS: DRAM, 3D Flash, MEMS, nano scaling steal the show
Feb 8, 2012
The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash mem...
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Keithley Instruments upgrades semiconductor test software suite
Jan 26, 2012
Keithley Instruments Inc. upgraded the capabilities of its Automated Characterization Suite Test Environment to ACS Version 4.4. The software is used with se...
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BSE Group achieves milestones in semiconductor equipment financing biz
Jan 26, 2012
Test Advantage Capital Group, a business of BSE Group, surpassed $150M in its portfolio of semiconductor manufacturing equipment under management. Boston Sem...
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Metallization processes for standardized wide-IO memory applications
Jan 26, 2012
A new generation of nanotechnology-based wet-process films provides process simplification, performance boost and cost reduction beyond TSVs. Claudio Truzzi,...
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3D MID sensor fabricated with Ticona laser-activated LCP circuits
Jan 25, 2012
2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic ...
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Presto Engineering semiconductor service hub opens in Israel
Jan 24, 2012
Presto Engineering, integrated semiconductor test and product engineering services provider, opened its newest Hub to serve the semiconductor design communit...
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Preventing the Destructive Potential of Partial Discharge on HV Optic Devices
The Partial Discharge phenomenon has been plaguing the electrical and electronic industries for many years, by damaging equipment and increasing production c...
Sponsored by
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Enabling Thinner Packages through Novel Materials Innovations
According to a new industry report, thinned wafers will comprise the majority of wafers in the device market by 2016. (1) The study indicates that memory and...
Sponsored by
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Silver Price Control: New Materials Technology Helps Mitigate Silver’s Rising Cost
With the relentless rise in silver prices over the past couple of years has come a packaging production cost challenge for device manufacturers: how to manag...
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FREE WEBCAST: Lens Tilt in Small Auto-Focus CamerasThis webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors. Sponsored by
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FREE WEBCAST: Light and Color Measurement of Today's LED TechnologyThe seminar is an ideal fit for anyone interested in characterizing and communicating the light and color properties of LED’s accurately. Sponsored by
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