PACKAGING VIDEOS
PACKAGING PODCASTS
EVG doubles process module space in XT Frame platform
12/05/2011
EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the XT Frame equipment platform for better process throughput and tool...
|
AMAT BSI image sensor CVD tool operates at low processing temps
12/05/2011
Applied Materials Inc. (AMAT) launched the Applied Producer Optiva chemical vapor deposition (CVD) system for back-side-illuminated (BSI) image sen...
|
SUSS Microtech adds Brewer Science ZoneBond to wafer bonders
12/05/2011
Brewer Science Inc. will offer the ZoneBOND process on equipment supplier SUSS MicroTec's XBC300 and XBS300 wafer bonding platforms. |
IBM fabs Micron memory cube with TSV tech
12/02/2011
Using the advanced through-silicon via (TSV) fabrication process at IBM (NYSE:IBM), Micron Technology Inc. (NASDAQ:MU) will begin producing its Hyb...
|
IR orders NEXX metallization systems for IGBT fab
12/01/2011
International Rectifier (IR) purchased multiple Apollo physical vapor deposition (PVD) systems from packaging equipment maker NEXX Systems for its ...
|
PACKAGING WEBCASTS
There is no current content available.