PACKAGING VIDEOS
PACKAGING PODCASTS
ST eliminates wafer probes for on-wafer die test
12/14/2011
|
SEMICON West 2012: Submit an abstract today
12/12/2011
SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA. |
Mentor Graphics integrates T3Ster and FloTHERM for power device thermal management
12/12/2011
Mentor Graphics Corporation (NASDAQ:MENT) has combined technologies for thermal characterization and simulation with T3Ster hardware test products ...
|
MX's RDL, copper wire bonding processes take aim at packaging costs
12/12/2011
MagnaChip Semiconductor Corporation now offers a redistribution layer (RDL) metal process for wafer bumping and an I/O structure and process that i...
|
Honeywell taps Tezzaron Semiconductor to stack rad-hard die
12/09/2011
Honeywell Microelectronics will use Tezzaron's 3D stacking on Honeywell’s S150 process on radiation-hardened (rad-hard) aerospace electronics compo...
|
PACKAGING WEBCASTS
There is no current content available.