PACKAGING VIDEOS
PACKAGING PODCASTS
Multitest passes BGA test evaluation at IDM
11/04/2011
Multitest's Mercury contactor passed a "thorough BGA test evaluation," landing on the qualified contactors list for all business units of...
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BSI image sensors avoid distortion with Ziptronix bonding process
11/03/2011
Ziptronix ZiBond direct bonding process contribute minimum distortion in backside illuminated (BSI) image sensors because of its low-temperature pr...
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Amkor awards top suppliers in 2011
11/03/2011
Amkor Technology Inc. (NASDAQ:AMKR) honored 7 companies with its 2011 Supplier Award, for substrates, materials, and equipment. |
Halogen-free underfill uncrated at Henkel
11/02/2011
Henkel will launch several new electronics assembly materials at Productronica, November 15-18 in Munich, Germany. The new HYSOL underfill is...
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Henkel debuts automotive sensor packaging adhesive
11/02/2011
Henkel will launch several new electronics assembly materials at Productronica. The ABLESTIK ICP-4000 has been qualified to bond components to meta...
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