PACKAGING VIDEOS
PACKAGING PODCASTS
LED maker shrinks heatsinks with air holes
11/10/2011
LED lighting maker Gem Hsin Electronics reduced the size of heatsinks in its LED products by drilling miniscule holes beneath LEDs. The holes allow...
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Thin-film chip boosts LED optical output without changing footprint
11/10/2011
OSRAM Opto Semiconductors increased its IR Power Topled with lens optical output by 80% over the standard version by integrating a thin-film chip. ...
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WLP start-up combines SunPower solar silicon fab with Cypress semiconductor interconnect
11/09/2011
Deca Technologies, a new company backed by Cypress Semiconductor and SunPower, will combine solar wafer manufacturing methods with semiconductor ma...
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3D Direct Write technology for microelectronics packaging
11/08/2011
Invenios developed a 3D Direct Write laser patterning technology for microelectronics packaging that integrates optical, mechatronic, and housing f...
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MEMS packaging and test project aims for space
11/08/2011
The Heterogeneous Technology Alliance in Europe is developing new packaging and test methods for MEMS targeting space missions. |
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