MORE PACKAGING ARTICLES

Photonics societies launch the National Photonics Initiative to increase R&D and economy

May 23, 2013

Photonics societies across the United States today announced the launch of the National Photonics Initiative.

Invensas demos new high bandwidth packaging solution for mobile devices at 2013 ECTC

May 22, 2013 Invensas Corporation, a subsidiary of Tessera Technologies, Inc., will showcase its latest mobility solution, an ultra-high bandwidth Bond Via Array (BVATM) Package-on-Package (PoP) product, at the upcoming IEEE Electronic Components & Technology Conference (ECTC) in Las Vegas, NV on May 28 -...

IDC predicts semiconductor market to experience 3-4% revenue growth in 2013

May 22, 2013

IDC expects the semiconductor market to return to growth in 2013 with revenues forecast to increase by 3.5 percent this year.

North American semiconductor equipment industry posts April 2013 book-to-bill ratio of 1.08

May 22, 2013

North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in April 2013 (three-month average basis) and a book-to-bill ratio of 1.08.

NSF and SRC to fund research to create failure-resistant systems and circuits

May 21, 2013

Leaders of the National Science Foundation (NSF) and the Semiconductor Research Corporation (SRC) today announced 18 new projects funded through a joint initiative to address research challenges in the design of failure-resistant circuits and systems.

Mouser Electronics’ president and CEO celebrates 40 years of service

May 21, 2013 In 1973, Pong was cutting edge in the world of video games, music came on eight-track tapes, TV viewing was limited to three networks and Glenn Smith was a college kid who went to work part-time in the warehouse of what was little more than a mom and pop electronics catalog start-up in San Diego.

Qualcomm and Samsung pass AMD in MPU ranking

May 21, 2013

Slow notebook and desktop PC sales and strong growth in mobile processors for smartphones and tablet PCs continues to lower Intel's marketshare as well.

Toshiba to start mass production of next generation NAND flash memory

May 21, 2013

Toshiba Corporation today announced that the company has developed second generation 19nm process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month.

Mentor and Tezzaron optimize Calibre 3DSTACK for 2.5/3D-ICs

May 20, 2013

Mentor Graphics Corp. and Tezzaron Semiconductor Corp. today announced they are collaborating to integrate the Mentor Calibre 3DSTACK product into Tezzaron’s 3D-IC offerings.

How Intel can enable a successful $200 PC in the age of the media tablet

May 20, 2013

Can PC makers produce ultrathin, touch-screen PCs that are appealing to consumers—and that are priced at just $200?

Vishay Intertechnology enhances precision thin film chip resistor arrays

May 16, 2013

Vishay Intertechnology, Inc. today announced that the company has enhanced its ACAS 0606 AT and ACAS 0612 AT precision thin film chip resistor arrays with tighter absolute tolerance, relative tolerance, and relative TCR for the new S, T, and U accuracy grades.

EU announces achievements of three-year power microelectronics program

May 16, 2013

LAST POWER, the European Union-sponsored program aimed at developing a cost-effective and reliable technology for power electronics, today announced its three-year program achievements.

Yole Developpement conducts 2.5D, 3DIC and TSV interconnect patent investigation

May 15, 2013

Yole Développement announced its 2.5D, 3DIC and TSV Interconnect Patent Investigation report. For this analysis of 3D packaging technology patents, more than 1800 patent families have been screened.

Opportunities for electronics manufacturing services in medical industry are increasing

May 15, 2013

Original equipment manufacturers (OEMs) are increasingly turning to electronics manufacturing service (EMS) providers to better handle the escalating volumes of electronic content in the medical industry.

Global semiconductor sales outpace last year through Q1 of 2013

May 14, 2013

Sales in March 2013 were up slightly compared to February 2013 and March 2012.

Chip Memory Technologies Inc. reveals unique embedded NV memory solution

May 14, 2013

Chip Memory Technology Inc. (CMT), a new embedded memory technology developer, has emerged from stealth mode to reveal company details and its latest product.

HELIOS develops supply chain for integrating photonics with CMOS circuit

May 14, 2013

The €8.5 million European Commission project developed a complete design and fabrication supply chain for integrating a photonic layer with a CMOS circuit, using microelectronics fabrication processes.

Silex joins ENIAC project to develop new solutions for TSV and wafer bonding

May 13, 2013

Silex Microsystems, the world’s largest pure-play MEMS foundry, today announced that it has joined an international European Union-funded program aimed at developing a new MEMS manufacturing platform based on advanced inkjet-based printing technologies.

Top industrial electronics semiconductor suppliers suffer declining revenue in 2012

May 9, 2013

The eight leading suppliers of industrial electronics suffered revenue declines in 2012, reflecting weak conditions for the beleaguered market.

Despite overall power electronics 2012 downturn, SiC kept on growing

May 8, 2013

Starting late in 2011, the power electronics downturn in 2012 was quite severe, exhibiting -20 percent negative growth. However, the SiC device market kept on growing with a +38 percent increase year to year.


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