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GLOBALFOUNDRIES enhances 55nm CMOS logic process
February 28, 2013
55nm LPe 1V is optimized for ultra-low power, reduced cost and improved design flexibility. |
India's efforts to appeal to semiconductor manufacturers
February 28, 2013
This week, India’s Finance Minister P Chidambaram offered incentives to chip makers to set up headquarters in India, in an effort to encourage local electronics manufacturing. However, the response from the industry has been less than positive. Many believe that is it is a good start, but far fro...
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A single European semiconductor strategy is on its way
February 28, 2013
STM, Imec, CEA-LETI, ASML, Soitec and EU representatives discussed directions at ISS Europe 2013 in Italy. |
Brooks Instrument to launch new mass flow controller at SEMICON China
February 28, 2013
Brooks Instrument, a provider of flow measurement and control instrumentation to the microelectronics industry, will launch the GF135 pressure transient insensitive (PTI) mass flow controller at SEMICON China, March 19-21 at Shanghai New International Expo Center. |
Researcher finds faster, more efficient technique for creating high-density ceramics
February 27, 2013
A researcher from North Carolina State University has developed a technique for creating high-density ceramic materials that requires far lower temperatures than current techniques – and takes less than a second, as opposed to hours. Ceramics are used in a wide variety of technologies, including ...
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Altera to build FPGAs on Intel’s 14nm tri-gate technology
February 27, 2013
Intel announced Monday a major move to expand its foundry business. Altera Corporation and Intel Corporation have entered into an agreement for the future manufacture of Altera FPGAs on Intel's 14nm tri-gate transistor technology. |
Emerging technologies create strong opportunity for automotive ICs
February 27, 2013
New automotive technologies that go beyond touchscreens, satellite radio, and voice-activated GPS commands are being tested and improved, and will soon begin to appear in many more new car models, resulting in solid growth for the automotive IC market through 2016. |
LFoundry to acquire Micron manufacturing plant
February 27, 2013
LFoundry, an analog mixed signal and specialized technologies foundry, today announced that it has entered into an agreement with Micron Technology, Inc. (NASDAQ: MU) to acquire Micron Technology Italia, Srl. and all of its semiconductor fabrication facility assets in Avezzano, Italy. |
STMicroelectronics is first $1 billion MEMS company
February 27, 2013
Yole Développement’s research has credited STMicroelectronics for capitalizing on the booming demand for MEMS in mobile devices by shipping 58% more MEMS units in 2012, to become the first company to reach $1 billion in MEMS sales. |
GaN Systems expands with new UK location
February 26, 2013
New marketing and technical support center opened in Reading, UK. |
Qualcomm processor first to use TSMC’s 28 HPM advanced process technology
February 26, 2013
Snapdragon 800 processor on 28nm HPM process delivers high performance and low power for mobile devices. |
Messe Düsseldorf and ESNA Coorperation to address fast-growing printed electronics market
February 26, 2013
Messe Düsseldorf and ESNA have formed a cooperation to address the printed electronics market by organizing a new tradeshow, PEPSO. |
New Product: Engineered Material Systems introduces die attach for temperature-sensitive applications
February 26, 2013
Engineered Material Systems, a global supplier of electronic materials for circuit assembly applications, debuts its DB-1568-1 low-temperature cure die attach adhesive for attaching semiconductor die in temperature-sensitive devices. |
Infographic: Computers with human senses
February 26, 2013
We are entering the era of cognitive systems, where electronic devices will mimic the human senses—in their own way, to see, smell, touch, taste and hear. IBM assembled this infographic to illustrate what they call the “5 in 5,” five innovations that will change our lives within five years. |
New Product: KLA-Tencor announces two new litho/etch process control tools
February 26, 2013
New metrology and inspection products facilitate advanced patterning techniques for manufacturing sub-20nm memory and microprocessor chips. |
Rise of smartphones reshapes competitive order in the cellphone chip market
February 25, 2013
The competitive landscape of the cellphone core integrated circuit (IC) business has completely transformed over the past five years, with Qualcomm Inc. and Samsung capitalizing on the rise of smartphones and 4G. |
Toshiba develops CMOS image sensor for small and low power applications
February 25, 2013
Toshiba Corporation announced the development of a CMOS image sensor with a small area and low power pixel readout circuits. A sample sensor embedded with the readout circuits shows double the performance of a conventional one. Toshiba presented this development at ISSCC 2013 in San Francisco, CA...
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Scientists develop multicolor LEDs without heavy metals
February 25, 2013
Silicon nanocrystals have a size of a few nanometers and possess a high luminous potential. Scientists of Karlsruhe Institute of Technology (KIT) and the University of Toronto/Canada have now succeeded in manufacturing silicon-based light-emitting diodes (SiLEDs). They are free of heavy metals an...
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Toshiba develops low power technology for embedded SRAM
February 22, 2013
-27% active power reduction and 85% standby power reduction is confirmed at International Solid-State Circuits Conference 2013. |
Painting with catalysts: Nano-engineered materials for detoxifying water
February 22, 2013
Only light, aerial oxygen, and a catalyst are needed to remove pollutants from water. Ruhr-Universitat Bochum researchers led by Professor Radim Beránek are collaborating with colleagues from seven different countries in order to develop a photocatalyst that is efficient enough to be profitable.
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