Chemists at Ohio State University have developed the technology for making a one-atom-thick sheet of germanium, and found that it conducts electrons more than ten times faster than silicon and five times faster than conventional germanium.

Proposed increases in funds for scientific R&D and a greater emphasis on STEM education in the 2014 budget proposal announced by the White House this week reflect the President’s commitment to science and engineering, SPIE leaders said.

IBM announced plans on Thursday to invest $1 billion in flash memory research and development and launch a series of systems that will use solid state drives.

In another sign of the worldwide shift in preferred personal devices, PC shipments posted the steepest decline ever in a single quarter, according to the International Data Corporation Worldwide Quarterly PC Tracker (IDC).

Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia.

Natcore Technology Inc. announced major strides in advancing its black silicon solar cells to commercial levels of efficiency and, as part of its development process, has discovered that its technology could finally provide a low-cost selective emitter application.

NikkoIA announces the production of several innovative organic image sensors, confirming the potential of its technology, and validates the technology building blocks that can be immediately implemented to build its product lines.

Alliance Memory today extended its 128M and 256M lines of high-speed CMOS synchronous DRAMs (SDRAM) with new devices in a 54-ball 8 mm by 8mm by 1.2mm TFBGA package.

The global semiconductor materials market decreased 2 percent in 2012 compared to 2011 while worldwide semiconductor revenues declined 3 percent. Revenues of $47.11 mark the first decline in the semiconductor materials market in three years.

Silex Microsystems and BroadPak today announced the immediate availability of their jointly developed silicon interposer solution in high-volume manufacturing.

Cadence Design Systems, Inc. today announced an ongoing multi-year agreement with TSMC to develop the design infrastructure for 16-nanometer FinFET technology, targeting advanced node designs for mobile, networking, servers and FPGA applications.

Fulfilling the promise of performance and power scaling at 16nm, ARM and Cadence today announced details behind their collaboration to implement the first ARM Cortex-A57 processor on TSMC's 16nm FinFET manufacturing process.

University of Manchester graphene researchers have been awarded a £3.5 million (or approximately US$5 million) funding boost that could bring desalination plants, safer food packaging and enhanced disease detection closer to reality.

It’s no secret that Samsung is up against Apple in many ways, in products, sales and innovation. However, even in the face of Apple’s patent infringement lawsuits, Samsung is still climbing the charts.

The Temescal Division of Ferrotec Corporation today announced the Temescal UEFC-5700, a ultra-high efficiency electron beam metallization system for lift-off compound semiconductor applications.