BeSpoon and CEA-Leti establish world-record distance measurement on a single chip
April 17, 2013
BeSpoon, a fabless semiconductor company, and CEA-Leti have demonstrated an IR-UWB integrated circuit able to measure distances within a few centimeters’ accuracy, and have established a world-record operating range at 880m (standard regulation) and 3,641m (emergency situations). |
Thin-layer germanium may replace silicon in semiconductors
April 15, 2013
Chemists at Ohio State University have developed the technology for making a one-atom-thick sheet of germanium, and found that it conducts electrons more than ten times faster than silicon and five times faster than conventional germanium. |
SPIE leaders encouraged by increased science funding in Obama budget proposal
April 15, 2013
Proposed increases in funds for scientific R&D and a greater emphasis on STEM education in the 2014 budget proposal announced by the White House this week reflect the President’s commitment to science and engineering, SPIE leaders said. |
IBM announces $1B investment in flash memory R&D
April 12, 2013
IBM announced plans on Thursday to invest $1 billion in flash memory research and development and launch a series of systems that will use solid state drives. |
Cracking the potential of the glass wafer market
April 11, 2013
Over the last few years, glass has gained considerable interest from the semiconductor industry due to its very attractive electrical, physical and chemical properties, as well as its prospects for a relevant and cost-efficient solution. The application scope of glass substrates in the semiconduc...
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Personal computer shipments post worst quarter on record, says IDC
April 11, 2013
In another sign of the worldwide shift in preferred personal devices, PC shipments posted the steepest decline ever in a single quarter, according to the International Data Corporation Worldwide Quarterly PC Tracker (IDC). |
Memory, foundry and LED markets drive fab spending in southeast Asia
April 11, 2013
Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia. |
Natcore announces advancements and new applications in black silicon
April 11, 2013
Natcore Technology Inc. announced major strides in advancing its black silicon solar cells to commercial levels of efficiency and, as part of its development process, has discovered that its technology could finally provide a low-cost selective emitter application. |
NikkoIA SAS announces production of new organic image sensors
April 10, 2013
NikkoIA announces the production of several innovative organic image sensors, confirming the potential of its technology, and validates the technology building blocks that can be immediately implemented to build its product lines. |
ESI acquires Semiconductor Systems business of GSI Group
April 10, 2013
Electro Scientific Industries, Inc. today announced it had signed a definitive agreement to acquire the Semiconductor Systems business of GSI Group, Inc., a supplier of precision photonics, laser-based solutions and precision motion devices to the medical, industrial, scientific, and electr...
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Alliance Memory introduces new high-speed CMOS synchronous DRAMs
April 9, 2013
Alliance Memory today extended its 128M and 256M lines of high-speed CMOS synchronous DRAMs (SDRAM) with new devices in a 54-ball 8 mm by 8mm by 1.2mm TFBGA package. |
SEMI reports 2012 global semiconductor materials sales of $47.1 billion
April 9, 2013
The global semiconductor materials market decreased 2 percent in 2012 compared to 2011 while worldwide semiconductor revenues declined 3 percent. Revenues of $47.11 mark the first decline in the semiconductor materials market in three years. |
Silex and BroadPak partnership produces 2.5D IC packaging capabilities
April 9, 2013
Silex Microsystems and BroadPak today announced the immediate availability of their jointly developed silicon interposer solution in high-volume manufacturing. |
Cadence and TSMC to collaborate on design infrastructure for 16nm FinFET process technology
April 8, 2013
Cadence Design Systems, Inc. today announced an ongoing multi-year agreement with TSMC to develop the design infrastructure for 16-nanometer FinFET technology, targeting advanced node designs for mobile, networking, servers and FPGA applications. |
Implementation of next-generation device technology to be discussed at The ConFab 2013
April 5, 2013
Solid State Technology is excited to announce that Mark Thirsk, managing partner at Linx Consulting, will be discussing the cost and technology needed to implement next-generation device technology at The ConFab 2013. Thirsk has over 20 years of experience in the chemical industry, working with a...
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ARM and Cadence to partner to implement 64-bit processor on TSMC 16nm FinFET process
April 4, 2013
Fulfilling the promise of performance and power scaling at 16nm, ARM and Cadence today announced details behind their collaboration to implement the first ARM Cortex-A57 processor on TSMC's 16nm FinFET manufacturing process. |
Manchester leads the way in graphene membrane research
April 4, 2013
University of Manchester graphene researchers have been awarded a £3.5 million (or approximately US$5 million) funding boost that could bring desalination plants, safer food packaging and enhanced disease detection closer to reality. |
How Samsung is climbing the charts
April 4, 2013
It’s no secret that Samsung is up against Apple in many ways, in products, sales and innovation. However, even in the face of Apple’s patent infringement lawsuits, Samsung is still climbing the charts. |
Ferrotec Temescal introduces electron beam metallization system
April 3, 2013
The Temescal Division of Ferrotec Corporation today announced the Temescal UEFC-5700, a ultra-high efficiency electron beam metallization system for lift-off compound semiconductor applications. |
Cleanzone 2013 focuses on technology and life sciences
April 3, 2013
The second Cleanzone on October 22 and 23, 2013 in Frankfurt am Main is off to a promising start with a stronger profile. Last year, the trade fair and congress made a successful debut as the new international industry meeting point for cleanroom technology. It is targeted towards all companies a...
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