More Materials and Equipment Articles

Yole Developpement conducts 2.5D, 3DIC and TSV interconnect patent investigation

May 15, 2013

Yole Développement announced its 2.5D, 3DIC and TSV Interconnect Patent Investigation report. For this analysis of 3D packaging technology patents, more than 1800 patent families have been screened.

Global semiconductor sales outpace last year through Q1 of 2013

May 14, 2013

Sales in March 2013 were up slightly compared to February 2013 and March 2012.

Silex joins ENIAC project to develop new solutions for TSV and wafer bonding

May 13, 2013

Silex Microsystems, the world’s largest pure-play MEMS foundry, today announced that it has joined an international European Union-funded program aimed at developing a new MEMS manufacturing platform based on advanced inkjet-based printing technologies.

MOSIS collaborates with imec, Tyndall and ePIXfab on silicon photonics

May 2, 2013

MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with imec, Ireland's Tyndall National Institute and ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs.

Amkor Technology appoints Steve Kelley president and CEO

May 1, 2013

Amkor Technology, Inc. today announced that Stephen D. Kelley has been appointed to serve as president and chief executive officer and as a director of the company, effective May 8, 2013.

Manufacturing flexible displays: The challenges of handling plastic

May 1, 2013

The first flexible high-resolution displays will be produced using materials handling techniques that have been developed to allow the use of existing thin transistor fabrication facilities. NICK COLANERI, Flexible Display Center, Arizona State University, Phoenix, AZ

Current and future defectivity issues for equipment components and materials

May 1, 2013

The Nanodefect Center is tackling the big challenges in particle detection, characterization and mitigation for critical supply chain components and materials. VIBHU JINDAL, SEMATECH, Albany, NY

SEMI reports March book-to-bill ratio of 1.14

Apr 19, 2013

North America-based manufacturers of semiconductor equipment posted $1.14 billion in orders worldwide in March 2013 (three-month average basis) and a book-to-bill ratio of 1.14, according to the March Book-to-Bill Report published today by SEMI.

More than one-third of companies completely unprepared for US Conflict-Materials rules

Apr 18, 2013 With time running out until U.S. component manufacturers are legally required to disclose their usage of conflict minerals to the federal government, many companies are woefully unprepared for the new regulations, with more than one-third of firms indicating they haven’t even commenced compliance...

Alliance Memory introduces new high-speed CMOS synchronous DRAMs

Apr 9, 2013

Alliance Memory today extended its 128M and 256M lines of high-speed CMOS synchronous DRAMs (SDRAM) with new devices in a 54-ball 8 mm by 8mm by 1.2mm TFBGA package.

Silex and BroadPak partnership produces 2.5D IC packaging capabilities

Apr 9, 2013

Silex Microsystems and BroadPak today announced the immediate availability of their jointly developed silicon interposer solution in high-volume manufacturing.

PCB growth rate to slow to 2.7% in 2013

Mar 15, 2013

In 2012, global PCB industry saw a jump in terms of output value, benefitting in a large part from the rapid growth in the shipment of Apple and Samsung. However, there is no such possibility of a huge jump in 2013, as the report states the expected growth rate will slow down to 2.7%.

Signetics introduces an alternative to standard plastic ball grid array packages

Mar 12, 2013

Signetics Corporation today introduced their new MapBGA package to the industry. This alternative to standard PBGA packaging has improved reliability and design flexibility due to its unique assembly process.

AGC and nMode launch subsidiary to develop advanced packaging technology

Mar 12, 2013 Tokyo-based Asahi Glass Co., Ltd. and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1 million to co-found a subsidiary business, Triton Micro Technologies , to develop via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass.

Fab Spending Forecast: Equipment spending is expected to remain flat in 2013

Mar 6, 2013

Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.

China's top 10 packaging and assembling facilities

Mar 1, 2013

Packaging and assembly are key segments of the growing semiconductor supply chain in China.

India's efforts to appeal to semiconductor manufacturers

Feb 28, 2013 This week, India’s Finance Minister P Chidambaram offered incentives to chip makers to set up headquarters in India, in an effort to encourage local electronics manufacturing. However, the response from the industry has been less than positive. Many believe that is it is a good start, but far fro...

Brooks Instrument to launch new mass flow controller at SEMICON China

Feb 28, 2013

Brooks Instrument, a provider of flow measurement and control instrumentation to the microelectronics industry, will launch the GF135 pressure transient insensitive (PTI) mass flow controller at SEMICON China, March 19-21 at Shanghai New International Expo Center.

New Product: Engineered Material Systems introduces die attach for temperature-sensitive applications

Feb 26, 2013

Engineered Material Systems, a global supplier of electronic materials for circuit assembly applications, debuts its DB-1568-1 low-temperature cure die attach adhesive for attaching semiconductor die in temperature-sensitive devices.

Rise of smartphones reshapes competitive order in the cellphone chip market

Feb 25, 2013

The competitive landscape of the cellphone core integrated circuit (IC) business has completely transformed over the past five years, with Qualcomm Inc. and Samsung capitalizing on the rise of smartphones and 4G.

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