TSMC keynoter suggests WLSI at IITC
Jun 14, 2013
In a keynote at the IEEE International Interconnect Technology Conference (IITC), Douglas Yu from TSMC talked about Moore’s Law scaling becoming increasingly difficult. |
CEA-Leti wins Avantex Innovation Prize for E-Thread technology
Jun 10, 2013
CEA-Leti announced today that researchers Dominique Vicard and Jean Brun received the Avantex Innovation Prize for the use of the E-Thread technology in textiles. |
Fab equipment spending: 23% growth for 2014
Jun 4, 2013
Fab equipment spending will grow two percent year-over-year (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast. |
Statistical variation monitoring for production control
Jun 3, 2013
The sources of parametric variation are reviewed, with an eye on why these issues become worse as the technology is scaled and how this variation can be monitored and controlled. TIMOTHY TURNER, College of Nanoscale Science & Engineering (CNSE), Albany, NY. |
A new era in equipment product development
Jun 3, 2013
Over the past few years the semiconductor market has provided some breathing space on the development of next generation manufacturing equipment. |
News Products
Jun 3, 2013
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Combo MEMS inertial sensors report brisk growth in automotive market
Jun 3, 2013
Combo MEMS sensors for automotive applications are off to another exhilarating ride this year as revenue continues to climb, spurred by rapidly accelerating use in car safety systems, according to an IHS iSuppli MEMS and Sensors Report from information and analytics provider IHS. |
GLOBALFOUNDRIES introduces certified design flows for multi-die integration using 2.5D IC technology
May 31, 2013
The foundry plans to unveil a comprehensive set of certified design flows to support 2.5D IC product development with its most advanced manufacturing processes at next week’s 50th Design Automation Conference (DAC) in Austin, Texas. |
Dow Corning and SÜSS MicroTec report new temporary bonding solution for 2.5D and 3D IC packaging
May 29, 2013
The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at ECTC 2013, with the report of an advanced new temporary bonding solution for 3D TSV semiconductor packaging. |
Signetics announces plans to increase their flip chip package assembly capacity
May 28, 2013
Signetics Corporation today announced that it has again approved capex plans that will further expand their capacity for flip chip package assembly at their factory in Paju, South Korea. |
New power management IC helps reduce thermal stress on processors in phones and tablets
May 28, 2013
ams AG, a provider of high performance analog ICs and sensors, today introduced the AS3721, a power management IC (PMIC) with an innovative remote-feedback circuit that helps reduce the thermal stress of applications processors in smartphones and tablets. |
Invensas demos new high bandwidth packaging solution for mobile devices at 2013 ECTC
May 22, 2013
Invensas Corporation, a subsidiary of Tessera Technologies, Inc., will showcase its latest mobility solution, an ultra-high bandwidth Bond Via Array (BVATM) Package-on-Package (PoP) product, at the upcoming IEEE Electronic Components & Technology Conference (ECTC) in Las Vegas, NV on May 28 -...
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North American semiconductor equipment industry posts April 2013 book-to-bill ratio of 1.08
May 22, 2013
North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in April 2013 (three-month average basis) and a book-to-bill ratio of 1.08. |
Yole Developpement conducts 2.5D, 3DIC and TSV interconnect patent investigation
May 15, 2013
Yole Développement announced its 2.5D, 3DIC and TSV Interconnect Patent Investigation report. For this analysis of 3D packaging technology patents, more than 1800 patent families have been screened. |
Global semiconductor sales outpace last year through Q1 of 2013
May 14, 2013
Sales in March 2013 were up slightly compared to February 2013 and March 2012. |
Silex joins ENIAC project to develop new solutions for TSV and wafer bonding
May 13, 2013
Silex Microsystems, the world’s largest pure-play MEMS foundry, today announced that it has joined an international European Union-funded program aimed at developing a new MEMS manufacturing platform based on advanced inkjet-based printing technologies. |
MOSIS collaborates with imec, Tyndall and ePIXfab on silicon photonics
May 2, 2013
MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with imec, Ireland's Tyndall National Institute and ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs. |
Amkor Technology appoints Steve Kelley president and CEO
May 1, 2013
Amkor Technology, Inc. today announced that Stephen D. Kelley has been appointed to serve as president and chief executive officer and as a director of the company, effective May 8, 2013. |
Manufacturing flexible displays: The challenges of handling plastic
May 1, 2013
The first flexible high-resolution displays will be produced using materials handling techniques that have been developed to allow the use of existing thin transistor fabrication facilities. NICK COLANERI, Flexible Display Center, Arizona State University, Phoenix, AZ |
Current and future defectivity issues for equipment components and materials
May 1, 2013
The Nanodefect Center is tackling the big challenges in particle detection, characterization and mitigation for critical supply chain components and materials. VIBHU JINDAL, SEMATECH, Albany, NY |