MATERIALS AND EQUIPMENT

MATERIALS & EQUIPMENT

Chip substrate factory begins producing thermal-control substrates in Russia

Feb 22, 2012 MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as...

Present at ESTC 2012 in Amsterdam

Feb 21, 2012 Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LE...

Join iNEMI's electronics manufacturing supply chain workshop at IPC APEX

Feb 17, 2012

iNEMI will hold the industry kick-off for its 2013 Roadmap in an open workshop immediately following IPC APEX EXPO in San Diego, CA, March 1-2.

Shin-Etsu LED encapsulant material

Shin-Etsu Chemical releases low-RI LED encapsulants

Feb 17, 2012 Shin-Etsu Chemical Co. Ltd.'s new KER-7000 Series silicone encapsulating materials offer a low (1.38) refractive index (RI) for HB-LED packaging with lower g...

Universities: Enter to win a Finetech die bonder

Feb 15, 2012

Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges.

PACKAGING INDUSTRY NEWS

ISSCC round-up: 2.5D packaging for IVRs, smallest NAND flash chip, more

Feb 22, 2012 International Solid-State Circuits Conference (ISSCC) is going on now, gathering semiconductor design and device architecture p...

IRPS set for April in Anaheim

Feb 21, 2012 The IEEE International Reliability Physics Symposium (IRPS) is set for April 15, 2012 – April 19, 2012, in Anaheim, CA.

Amkor plans IMAPS Device Packaging keynote

Feb 21, 2012 The 2012 IMAPS Device Packaging Conference will take place March 6-8 in Fountain Hills, AZ, with Amkor's Dr. Robert Darveaux pr...

Semiconductor industry expectations for 2012: Take the WWK survey

Feb 17, 2012 Wright Williams & Kelly, Inc. (WWK) opened its 2012 semiconductor industry survey on equipment and process timing. Only par...

Georgia Tech produces 130um 3D organic semiconductor package

Feb 16, 2012 Georgia Tech’s Packaging Research Center built a 3D organic package at 130µm thickness at 30µm pitch using ultra-short Cu-Cu in...
CMOS image sensors vs CCDs. SOURCE: IHS.

CMOS image sensors keep pushing CCDs out of the picture

Feb 13, 2012 CMOS image sensors in 2011 continued to push CCD sensors into a smaller, isolated section of the market. CMOS image sensors are...

FINANCIALS

PACKAGING VIDEOS

EIQ2 SST

PACKAGING WHITE PAPERS

Preventing the Destructive Potential of Partial Discharge on HV Optic Devices

The Partial Discharge phenomenon has been plaguing the electrical and electronic industries for many years, by damaging equipment and increasing production c...
Sponsored by

Enabling Thinner Packages through Novel Materials Innovations

According to a new industry report, thinned wafers will comprise the majority of wafers in the device market by 2016. (1) The study indicates that memory and...
Sponsored by

Silver Price Control: New Materials Technology Helps Mitigate Silver’s Rising Cost

With the relentless rise in silver prices over the past couple of years has come a packaging production cost challenge for device manufacturers: how to manag...

PACKAGING WEBCASTS

FREE WEBCAST: Lens Tilt in Small Auto-Focus Cameras

This webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors.

FREE WEBCAST: Light and Color Measurement of Today's LED Technology

The seminar is an ideal fit for anyone interested in characterizing and communicating the light and color properties of LED’s accurately.

MOST READ

© 2011. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS