MATERIALS AND EQUIPMENT
PACKAGING BLOGS
MATERIALS & EQUIPMENT
Invensas demos new high bandwidth packaging solution for mobile devices at 2013 ECTC
May 22, 2013
Invensas Corporation, a subsidiary of Tessera Technologies, Inc., will showcase its latest mobility solution, an ultra-high bandwidth Bond Via Array (BVATM) ...
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North American semiconductor equipment industry posts April 2013 book-to-bill ratio of 1.08
May 22, 2013
North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in April 2013 (three-month average basis) and a book-to...
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Yole Developpement conducts 2.5D, 3DIC and TSV interconnect patent investigation
May 15, 2013
Yole Développement announced its 2.5D, 3DIC and TSV Interconnect Patent Investigation report. For this analysis of 3D packaging technology patents, more than...
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Global semiconductor sales outpace last year through Q1 of 2013
May 14, 2013
Sales in March 2013 were up slightly compared to February 2013 and March 2012. |
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Silex joins ENIAC project to develop new solutions for TSV and wafer bonding
May 13, 2013
Silex Microsystems, the world’s largest pure-play MEMS foundry, today announced that it has joined an international European Union-funded program aimed at de...
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HEADLINES
Advanced Packaging Industry -- Global & China Vendor Analysis 2013 in New Research Report at ReportsnReports.com; Company overview; Report; Industry overview
Dallas, Texas (PRWEB) May 20, 2013In 2012, global semiconductor sales fell 2.7%; semiconductor equipment spending dropped by 15...
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Dow Electronic Materials Receives Supplier Excellence Award from ASE
New Delhi, May 16 -- Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today announced that it ...
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FOUR TO RECEIVE HONORARY DEGREES FROM BINGHAMTON UNIVERSITY
The following information was released by Binghamton University (SUNY):Four honorary degrees will be awarded during Binghamton ...
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Cymbet EnerChip Solid State Batteries Verified 100% Biocompatible.
Nuremberg, Germany (PRWEB) May 14, 2013Cymbet Corporation announced today at the PCIM Europe show the successful results of in ...
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NRHA packaging & merchandising awards program: celebrating the industry's best merchandising and packaging; NRHA PACKAGING AND MERCHANDISING AWARDS 2013
[ILLUSTRATION OMITTED]The North American Retail Hardware Association (NRHA) is proud to announce the results of the fourth annu...
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AMKOR TECHNOLOGY REPORTS ACQUISITION BY DIRECTOR ZUG (Arizona)
WASHINGTON, May 10 -- Amkor Technology Inc. (AMKR), Chandler, Ariz., has filed a Form 4 with the Securities and Exchange Commis...
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