APNT's new thermal interface materials meet power semiconductors' reqs
May 23, 2012
Applied Nanotech Holdings Inc. uncrated the THERCOBOND family of highly thermally conductive bonding and printed materials for power electronics and photonic...
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Indium expands electronics materials manufacturing with new facility in NY
May 22, 2012
Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materia...
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Dow Electronic Materials promotes Muni to direct advanced packaging products
May 21, 2012
Bhavesh Muni took the helm as global business director for the Advanced Packaging Technologies business of Dow Electronic Materials, covering Dow's semicondu...
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IC packaging substrates heading for $8.67B in 2012
May 18, 2012
In 2012, the global IC substrate market will reach a value of USD8.67 billion, according to Research in China’s “Global and Chinese IC Substrate Industry Rep...
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Wire bonder debuts with Cu wire optimization, automatic rethreading from ASM Pacific Technology
May 16, 2012
The ASM iHawk Xpress Opto Wire Bonder from backend semiconductor assembly equipment supplier ASM Pacific Technology offers new innovations in transport, copp...
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Kulicke & Soffa expands Singapore HQ, bolsters bonder tool R&D and manufacturing
May 16, 2012
Kulicke & Soffa broke ground on its Singapore global headquarters expansion, near the current leased headquarters location. A state-of-the-art facility i...
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Direct chip bonding, all-SiC design increase power density in Mitsubishi Electric inverter
May 23, 2012
Mitsubishi Electric Corporation developed a prototype forced-air-cooled three-phase 400V output inverter with all-silicon carbi...
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Invensas debuts high-I/O PoP semiconductor packaging design
May 22, 2012
Invensas Corporation, Tessera subsidiary, debuted bond via array (BVA) technology, an ultra-high-I/O PoP semiconductor packagin...
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Amkor plans semiconductor packaging and test facility in Korea
May 19, 2012
Amkor Technology Inc. (NASDAQ:AMKR) plans to build a state-of-the-art factory and global research and development center in the...
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Silicon Labs offers bare die from 1 wafer and up
May 16, 2012
Mixed-signal IC maker Silicon Laboratories Inc. (NASDAQ: SLAB) introduced a microcontroller (MCU) die sales program with a mini...
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"3.5D interposer technology could someday replace PCBs" -- TSMC's Doug Yu
May 15, 2012
TSMC’s Doug Yu challenged the current nomenclature and pronounced that interposer technology should be called “3.5D” instead of...
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CMOS image sensor suppliers ramp up 300mm capacity
May 11, 2012
CMOS image sensors (CIS) are breaking sales records again, after several years without upward momentum, reports IC Insights. Ne...
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Keeping Packages Cool and Reliability High
Ever-increasing functionality and ever-decreasing device footprints have presented semiconductor packaging manufacturers with quite a dilemma: how to manage ...
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PVD Solutions for Next Generation MEMS and Sensors
As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with ...
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FREE WEBCAST: Lens Tilt in Small Auto-Focus CamerasThis webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors. Sponsored by
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FREE WEBCAST: Light and Color Measurement of Today's LED TechnologyThe seminar is an ideal fit for anyone interested in characterizing and communicating the light and color properties of LED’s accurately. Sponsored by
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