Mentor and Tezzaron optimize Calibre 3DSTACK for 2.5/3D-ICs
May 20, 2013
Mentor Graphics Corp. and Tezzaron Semiconductor Corp. today announced they are collaborating to integrate the Mentor Calibre 3DSTACK product into Tezzaron’s 3D-IC offerings. |
Yole Developpement conducts 2.5D, 3DIC and TSV interconnect patent investigation
May 15, 2013
Yole Développement announced its 2.5D, 3DIC and TSV Interconnect Patent Investigation report. For this analysis of 3D packaging technology patents, more than 1800 patent families have been screened. |
Global semiconductor sales outpace last year through Q1 of 2013
May 14, 2013
Sales in March 2013 were up slightly compared to February 2013 and March 2012. |
MOSIS collaborates with imec, Tyndall and ePIXfab on silicon photonics
May 2, 2013
MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with imec, Ireland's Tyndall National Institute and ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs. |
Amkor Technology appoints Steve Kelley president and CEO
May 1, 2013
Amkor Technology, Inc. today announced that Stephen D. Kelley has been appointed to serve as president and chief executive officer and as a director of the company, effective May 8, 2013. |
GlobalFoundries 2.5 / 3D at 20nm
May 1, 2013
A year ago, GlobalFoundries (GF) CTO Bartlett announced the installation of TSV production tools for the company's 20nm technology platform and announced that "the first full flow silicon with TSVs was expected to start running at Fab 8 (Saratoga, NY) in Q3 2012 with mass production expected...
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Rudolph purchases assets from Tamar Technology
Apr 29, 2013
Rudolph Technologies, Inc. announced today that it has purchased selected assets, including a patent portfolio, relating to metrology capability from Tamar Technology, Newbury Park, Calif. |
ESI acquires Semiconductor Systems business of GSI Group
Apr 10, 2013
Electro Scientific Industries, Inc. today announced it had signed a definitive agreement to acquire the Semiconductor Systems business of GSI Group, Inc., a supplier of precision photonics, laser-based solutions and precision motion devices to the medical, industrial, scientific, and electr...
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Silex and BroadPak partnership produces 2.5D IC packaging capabilities
Apr 9, 2013
Silex Microsystems and BroadPak today announced the immediate availability of their jointly developed silicon interposer solution in high-volume manufacturing. |
GLOBALFOUNDRIES demonstrates 3D TSV capabilities on 20nm technology
Apr 2, 2013
GLOBALFOUNDRIES today announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications. |
Blog: Dimensional scaling and the SRAM bit-cell
Mar 21, 2013
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. and Benjamin S. Louie of Zeno Semiconductor blog about dimensional scaling as it relates to EUV and future per transistor device cost. |
FlipChip International and EZconn Czech a.s. announce partnership
Mar 18, 2013
FlipChip International (FCI), a developer of flip chip bumping, Wafer Level and embedded die packaging and EZconn Czech a.s. announced a partnership agreement today. |
EV Group ships 300mm wafer bonding system to leading Chinese semiconductor foundry
Mar 13, 2013
Foundry to use wafers for 3D IC and advanced packaging volume production applications. |
AGC and nMode launch subsidiary to develop advanced packaging technology
Mar 12, 2013
Tokyo-based Asahi Glass Co., Ltd. and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1 million to co-found a subsidiary business, Triton Micro Technologies , to develop via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass.
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Flip-Chip expected to grow at a steady 9% pace, reaching $35 billion by 2018
Mar 4, 2013
Flip-Chip is big on value: in 2012, it was a $20B market, making it the biggest market in the middle-end area, and Yole Développement expects it to continue growing at a 9% clip, ultimately reaching $35 billion by 2018. |
Filling the fabs of the future
Mar 1, 2013
At press time, the sessions for The ConFab 2013 (www.theconfab.com) are being finalized. |
3D IC with TSV: Status and developments
Mar 1, 2013
While the drivers for 3D ICs remain performance and form factor, the time line for its adoption keeps shifting out into the future. Several technical challenges and infrastructure issues such are delaying high volume manufacturing of TSV technology for 3D ICs. Until these issues can be resolved, ...
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Vertical through-wafer insulation: Enabling integration and innovation
Mar 1, 2013
Through-wafer insulation has been used to develop technologies such as Sil-Via TSV and Zero-Crosstalk. PETER HIMES, Silex Microsystems AB, Järfälla SWEDEN |
Researchers create semiconductor 'nano-shish-kebabs' with potential for 3-D technologies
Feb 20, 2013
Researchers at North Carolina State University have developed a new type of nanoscale structure that resembles a “nano-shish-kebab,” consisting of multiple two-dimensional nanosheets that appear to be impaled upon a one-dimensional nanowire. |
Global 3D IC market report reveals major challenges
Feb 18, 2013
TechNavio's analysts forecast the global 3D IC market to grow at a CAGR of 19.7 percent over the period 2012-2016. However, the thermal conductivity issues could pose a challenge to the growth of this market. |