More 3D Integration Articles
Interposer consortium ready to expand at Georgia Tech PRC
Apr 26, 2012
After pioneering low-cost wafer- and panel-based glass and silicon interposers in Phase 1 of its SiGI consortium, Georgia Tech Packaging Research Center is beginning Phase 2 in June. |
GLOBALFOUNDRIES installs TSV fab tools for 20nm stacked die
Apr 26, 2012
At its Fab 8, GLOBALFOUNDRIES is installing a special set of production tools to create TSV in 20nm wafers. 3D die stacking of leading-edge chips will enable mobile and consumer electronics. |
SEMATECH highlights from VLSI-TSA
Apr 26, 2012
SEMATECH experts reported on innovative processes for advanced CMOS logic and memory device technologies and 3D TSV manufacturing at the International VLSI Technology, System and Applications Symposium (VLSI-TSA). |
STATS ChipPAC adds Pasquale Pistorio, STMicroelectronics leader, to Board
Apr 23, 2012
Semiconductor packaging service provider STATS ChipPAC Ltd. (SGX-ST:STATSChP) appointed Pasquale Pistorio as a member of the Board of Directors, effective immediately. |
ASMC will focus on productivity and technology challenges
Apr 18, 2012
The 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2012) will be held May 15-17 in Saratoga Springs, New York. The conference will feature presentations of more than 85 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event...
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Conference Report: MRS Spring 2012, Day 3
Apr 12, 2012
Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- κ dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible...
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Economy, fabless relationships, 450mm and more on deck at The ConFab 2012
Apr 11, 2012
The ConFab 2012, an invitation-only global conference and business meeting on semiconductor manufacturing, June 3-6 in Las Vegas, selected speakers and sessions for 2012. |
Georgia Tech targets thin 3D packaging with new consortium
Apr 11, 2012
Georgia Tech's Packaging Research Center proposes a new consortium on 3D semiconductor packaging called 3D ThinPack for ultra-miniaturized 3D heterogeneous, RF, digital and power modules in partnership with global companies. |
Conference report: MRS Spring 2012, Day 2
Apr 11, 2012
Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the second day: OLED TFT displays, single transistor DRAMs, silicon photonic wires, CNTs, 3D optical interconnects, graphene for RF and sensing, transparent ZnO, epidermal electronic systems, stretchable ...
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ALD enables 3D capacitors for CEA-Leti and IPDiA
Apr 10, 2012
CEA-Leti and passive component maker IPDiA developed an atomic layer deposition (ALD) process to apply medium-k dielectric layers on a metal-insulator-metal capacitor architecture, enabling 3D capacitors. |
Endicott Interconnect names David Van Rossum new CFO
Apr 10, 2012
Endicott Interconnect Technologies has appointed David W. Van Rossum to the position of Chief Financial Officer, effective immediately. |
MOSAID multi-chip package stacks 16 NAND Flash die on 1 channel
Apr 5, 2012
MOSAID Technologies Inc. is sampling a 16-die stack NAND Flash device operating on a single high-performance channel, the 5126Gb HLNAND. |
Georgia Tech increases interposer development work
Apr 4, 2012
Georgia Tech's Packaging Research Center is adding ultra-fine-pitch interconnect, thermal reliability, and more to its work on silicon and glass interposers for 2.5D semiconductor packaging. |
Common Platform Technology Forum looks to the future
Apr 1, 2012
The 2012 Common Platform Technology Forum took place March 14 at the Santa Clara Convention Center, with registration topping 1200 attendees by noon. |
Interposer ecosystem examined
Apr 1, 2012
Dr. Phil Garrou, Contributing Editor |
Advanced packaging in the new decade
Apr 1, 2012
E. Jan Vardaman, Techsearch International |
Amkor licenses 3D packaging tech to SHINKO
Mar 30, 2012
Amkor Technology Inc. granted SHINKO ELECTRIC INDUSTRIES CO., LTD. (Tokyo:6967) a non-exclusive license to its proprietary Through Mold Via (TMV) semiconductor packaging technology. |
Synopsys launches 3D packaging EDA line-up
Mar 26, 2012
Synopsys is combining several products into a 3D-IC initiative for semiconductor designers moving to stacked-die silicon systems in 3D packaging. The 3D-IC initiative will bring in leading IC design and manufacturing companies to work with Synopsys on a comprehensive EDA solution. |
SEMICON Europa 2012 seeks presenters
Mar 23, 2012
SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30. |
Apple A5X processor teardown: Bigger die, higher heat?
Mar 22, 2012
Apple’s ARM-based processors have created a point of hardware differentiation in applications processors. With the A5X, Apple is going with a much larger die at the 45nm node (shared across the 2 prior generations), shares Chipworks. It's also turned off the PoP track. |