More 3D Integration Articles

Tezzaron takes over SVTC's Austin fab amid layoff reports

Oct 1, 2012

Tezzaron Semiconductor is taking over SVTC Technologies' wafer fab in Austin, TX, amid reports that the semiconductor/MEMS development organization is cutting back activities in Austin and in California.

Supply chain readiness in an era of accelerated change

Oct 1, 2012

The structure of the industry is rapidly changing — and how it will respond to the simultaneous challenges of Moore's Law scaling, 450mm wafer production, 3D-ICs, and industry consolidation is very much unknown.

Horizontal channels key to ultra-small 3D NAND

Sep 20, 2012

The first working 3D NAND flash memory at sub-40nm feature sizes will be described by Macronix researchers at this year’s International Electron Devices Meeting (IEDM).

RRAM synapses mimic the brain

Sep 20, 2012

At this year’s IEDM, a team led by Korea’s Gwangju Institute of Science and Technology will detail a high-speed pattern-recognition system comprising CMOS “neurons” and an array of resistive-RAM (RRAM)-based “synapses,” which demonstrated STDP, a brain-like function.

On-board heaters can self-heal flash memories

Sep 20, 2012

At the upcoming International Electron Device Meeting, Macronix researchers will describe how they built flash memories that could heal themselves by means of tiny onboard heaters that provide thermal annealing just at the spots where it is needed.

SPTS unveils low-temp PECVD cluster tool for 3D ICs

Sep 19, 2012

SPTS' Delta fxP cluster system achieves low-temperature deposition of TEOS oxides and nitrides for via-reveal passivation in 3D IC packaging, solving two key problems of low temperatures and bonding adhesive outgassing.

IEDM unveils 2012 program highlights

Sep 17, 2012

The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.

A*STAR and Hitachi to collaborate on 3D ICs

Sep 13, 2012

Singapore’s A*STAR’s Institute of Microelectronics (IME), and Hitachi Chemical Co., will be collaborating on a joint research program to develop high performance material technologies for thin wafer processing for 3D IC packaging.

NIST tips "hybrid" metrology method to test chips

Sep 13, 2012

The National Institute of Standards and Technology (NIST) says it's combined scanning techniques and statistical data to both more precisely and less expensively measure features on a chip -- and two big chip firms are already on board.

EVG updates modular coater/developer with OmniSpray, NanoSpray coating options

Sep 10, 2012

EV Group's updated modular EVG150 high-volume coater/developer adds new modules for conformal coating of high topography surfaces, and coating surfaces with vertical sidewall angles, such as through-silicon vias (TSV).

Singapore IME, MOSIS to offer silicon photonics wafer prototyping service

Sep 4, 2012

Singapore's Institute of Microelectronics (IME) and MOSIS have signed a memorandum of understanding (MOU) to offer a multiple-project wafer service targeting silicon integrated photonics.

Advances in wafer underfill processing

Sep 1, 2012

At ECTC 2012, Toray presented results of their study on suppressing wafer level underfill (WUF) material entrapment at copper pillar/pad joints.

STATS ChipPAC expands TSV work into mid-end-of-line

Aug 29, 2012 STATS ChipPAC says it has expanded its through-silicon via (TSV) capabilities with a 300mm mid-end manufacturing operation targeting mid-end-of-line semiconductor manufacturing, including microbump technology down to 40μm, temporary bond/de-bonding, backside via reveal, isolation, and metallizati...

Bonding and cleaving at low temperatures

Aug 28, 2012

Brian Cronquist, MonolithIC 3D Inc.'s VP of Technology and IP reports on recent progress on low temperature (less than 400°C) bonding and cleaving processes.

Technology licensing company Rambus restructures, creates CTO role

Aug 23, 2012

Rambus Inc. (NASDAQ:RMBS), a technology licensing company, will undergo a restructuring and related cost saving measures to cut its expenses by$30-35 million annually.

Present on semiconductor metrology and more at ASMC 2013

Aug 22, 2012

ASMC 2013, the leading international technical conference for exploring solutions to improve collective microelectronics manufacturing expertise, has issued a call for papers.

Tessera receives initial Amkor payment in court award

Aug 21, 2012

Tessera received an initial payment of approximately $20 million from semiconductor packaging company Amkor, related to the interim award issued by the International Court of Arbitration of the International Chamber of Commerce (ICC).

Hybrid Memory Cube interface specification draft includes protocol, short-reach PHY interconnection

Aug 15, 2012

The Hybrid Memory Cube Consortium released the initial draft of the Hybrid Memory Cube (HMC) interface specification, with the final version planned for end of 2012.

Laser nanofabrication for mass production at the nanoscale

Aug 10, 2012 Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.

Supply chain readiness in an era of accelerated change

Aug 10, 2012

In this SEMI News and Views blog, Karen Savala covers EUV lithography, 450mm wafers, and 3D IC developments, based on her recent presentation at SEMICON West, “Supply Chain Readiness in an Era of Accelerated Change.”

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