More 3D Integration Articles

IMAPS 2012: A review

Nov 1, 2012

The 45th Symposium on Microelectronics (IMAPS 2012) was held September 9-13 in San Diego. Here's a quick review of some of the 3D and advanced packaging papers presented at the meeting.

eWLB as a cost effective platform for 2D–3D packaging solutions

Oct 25, 2012

ICECool puts 3D thermal issues back in focus

Oct 22, 2012

With the approach of full commercial production of 3DIC products, Dr. Phil Garrou shifts his attention to thermal performance questions and proposed thermal solutions for the future.

SPTS Technologies, Fraunhofer IZM researching lower-temp films for TSVs

Oct 18, 2012

Fraunhofer IZM's All Silicon System Integration Dresden (ASSID) center will add SPTS' etch and PECVD process capabilities to investigate low-temperature dielectric films for through-silicon vias (TSV) in 3D IC packaging.

SEMI adds session, extends abstract deadline for China chip conference

Oct 16, 2012

SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.

GSA forms technology steering committee to guide working groups

Oct 16, 2012

The Global Semiconductor Alliance (GSA) says it has formed a Technology Steering Committee to help address key business and technology areas of interest to its members, and "encourage the advancement and adoption of leading technology and practices."

Why SATS consolidation needs to happen

Oct 12, 2012

The advent of leading-edge semiconductor packaging technologies dictates efficient use of capital, and only the top-tier semiconductor assembly and test services (SATS) companies will have the financial wherewithal to develop required expertise and capacity, says one analyst.

Nanium ships 200 millionth eWLB component

Oct 10, 2012

Nanium says it has shipped its 200 millionth embedded wafer-level ball grid array technology (eWLB) component, a 10% year-over-year productivity increase that reflects full conversion to the company's eWLB overmold technology that allows thinner and more robust packages.

Europe to unite research efforts in Silicon Europe cluster alliance

Oct 8, 2012

Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”

GlobalFoundries to fab Sand 9's MEMS timing products

Oct 2, 2012

Sand 9 is partnering with GlobalFoundries for high-volume manufacturing of its microelectromechanical systems (MEMS) timing technology, which incorporates silicon-on-insulator (SOI) and through-silicon vias (TSV).

Tezzaron takes over SVTC's Austin fab amid layoff reports

Oct 1, 2012

Tezzaron Semiconductor is taking over SVTC Technologies' wafer fab in Austin, TX, amid reports that the semiconductor/MEMS development organization is cutting back activities in Austin and in California.

Supply chain readiness in an era of accelerated change

Oct 1, 2012

The structure of the industry is rapidly changing — and how it will respond to the simultaneous challenges of Moore's Law scaling, 450mm wafer production, 3D-ICs, and industry consolidation is very much unknown.

Horizontal channels key to ultra-small 3D NAND

Sep 20, 2012

The first working 3D NAND flash memory at sub-40nm feature sizes will be described by Macronix researchers at this year’s International Electron Devices Meeting (IEDM).

RRAM synapses mimic the brain

Sep 20, 2012

At this year’s IEDM, a team led by Korea’s Gwangju Institute of Science and Technology will detail a high-speed pattern-recognition system comprising CMOS “neurons” and an array of resistive-RAM (RRAM)-based “synapses,” which demonstrated STDP, a brain-like function.

On-board heaters can self-heal flash memories

Sep 20, 2012

At the upcoming International Electron Device Meeting, Macronix researchers will describe how they built flash memories that could heal themselves by means of tiny onboard heaters that provide thermal annealing just at the spots where it is needed.

SPTS unveils low-temp PECVD cluster tool for 3D ICs

Sep 19, 2012

SPTS' Delta fxP cluster system achieves low-temperature deposition of TEOS oxides and nitrides for via-reveal passivation in 3D IC packaging, solving two key problems of low temperatures and bonding adhesive outgassing.

IEDM unveils 2012 program highlights

Sep 17, 2012

The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.

A*STAR and Hitachi to collaborate on 3D ICs

Sep 13, 2012

Singapore’s A*STAR’s Institute of Microelectronics (IME), and Hitachi Chemical Co., will be collaborating on a joint research program to develop high performance material technologies for thin wafer processing for 3D IC packaging.

NIST tips "hybrid" metrology method to test chips

Sep 13, 2012

The National Institute of Standards and Technology (NIST) says it's combined scanning techniques and statistical data to both more precisely and less expensively measure features on a chip -- and two big chip firms are already on board.

EVG updates modular coater/developer with OmniSpray, NanoSpray coating options

Sep 10, 2012

EV Group's updated modular EVG150 high-volume coater/developer adds new modules for conformal coating of high topography surfaces, and coating surfaces with vertical sidewall angles, such as through-silicon vias (TSV).


FEATURED PRODUCTS


© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS