Powertech Technology Inc. (PTI) has approved a tender offer of NT$25.28 per share for the common shares of Greatek with a minimum acquisition target of 30% of outstanding shares.

Licensing company Rambus Inc. (Nasdaq:RMBS) is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan on the development of interconnect and 3D packaging technologies.

SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA.

Honeywell Microelectronics will use Tezzaron's 3D stacking on Honeywell’s S150 process on radiation-hardened (rad-hard) aerospace electronics components.

imec is presenting a record number of 17 papers at the IEEE International Electron Device Meeting (IEDM), ending today in Washington, DC.

Arteris Inc., network-on-chip (NoC) interconnect IP company, will incorporate its FlexNoC NoC interconnect IP into an SoC die on silicon interposer test chip with TSMC.

Singapore's A*STAR IME and 3D IC developer Tezzaron Semiconductor signed a research collaboration agreement to develop and exploit advanced through silicon interposer (TSI) technology.

At the recent Global Interposer Technology workshop at Georgia Tech, Xilinx and TSMC discussed 2.5D chip packaging technologies and others touted the potential of glass as an interposer substrate material, reports Dr. Phil Garrou.

Using the advanced through-silicon via (TSV) fabrication process at IBM (NYSE:IBM), Micron Technology Inc. (NASDAQ:MU) will begin producing its Hybrid Memory Cube. The companies claim that this is the first CMOS design to go commercial with TSV interconnects.

Leti’s recent work includes nanophotonics communications devices, which use 3D chip interconnect. ElectroIQ.com caught up with Hughes Metras, director, North America, for Leti, at the IEEE San Francisco Bay Area Nanotechnology Council half-day symposium to discuss latest work.

The Design Automation Conference (DAC) is soliciting semiconductor industry experts for participation in invited sessions, panels, and other events at the 49th DAC, June 3-7, 2012 in San Francisco, CA.

Nanotechnology accelerator SVTC Technologies partnered with SUSS MicroTec on wafer-level packaging for MEMS, and 3D IC bonding technology development.

OSRAM Opto Semiconductors increased its IR Power Topled with lens optical output by 80% over the standard version by integrating a thin-film chip. The IR LED maintains the same surface area and drive current.

SEMATECH has created an online 3D Standards Dashboard, allowing 3D semiconductor and MEMS interconnect professionals to exchange standards activity information.

Dr. Giles Humpston, Tessera, presents the free, on-demand webcast Lens Tilt in Small Auto-Focus Cameras. Dr. Humpston covers the dominant auto-focus miniature camera technology today -- VCM -- and an improved technology based on MEMS, which is being commercialized now.

Silex Microsystems licensed its Silex Sil-Via through-silicon-via (TSV) packaging platform to Nanoshift for use in early development of complex MEMS products.