ISSCC round-up: 2.5D packaging for IVRs, smallest NAND flash chip, more
Feb 22, 2012
International Solid-State Circuits Conference (ISSCC) is going on now, gathering semiconductor design and device architecture presentatio...
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Present at ESTC 2012 in Amsterdam
Feb 21, 2012
Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic pac...
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Semiconductor industry expectations for 2012: Take the WWK survey
Feb 17, 2012
Wright Williams & Kelly, Inc. (WWK) opened its 2012 semiconductor industry survey on equipment and process timing. Only participants ...
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Georgia Tech produces 130um 3D organic semiconductor package
Feb 16, 2012
Georgia Tech’s Packaging Research Center built a 3D organic package at 130µm thickness at 30µm pitch using ultra-short Cu-Cu interconnect...
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European microelectronics fab database tracks major changes over past 5 years
Feb 13, 2012
Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European m...
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2011 ITRS: DRAM, 3D Flash, MEMS, nano scaling steal the show
Feb 8, 2012
The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highligh...
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Chip substrate factory begins producing thermal-control substrates in Russia
Feb 22, 2012
MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as...
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IRPS set for April in Anaheim
Feb 21, 2012
The IEEE International Reliability Physics Symposium (IRPS) is set for April 15, 2012 – April 19, 2012, in Anaheim, CA. |
Amkor plans IMAPS Device Packaging keynote
Feb 21, 2012
The 2012 IMAPS Device Packaging Conference will take place March 6-8 in Fountain Hills, AZ, with Amkor's Dr. Robert Darveaux presenting "Escalating Chal...
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Join iNEMI's electronics manufacturing supply chain workshop at IPC APEX
Feb 17, 2012
iNEMI will hold the industry kick-off for its 2013 Roadmap in an open workshop immediately following IPC APEX EXPO in San Diego, CA, March 1-2. |
Shin-Etsu Chemical releases low-RI LED encapsulants
Feb 17, 2012
Shin-Etsu Chemical Co. Ltd.'s new KER-7000 Series silicone encapsulating materials offer a low (1.38) refractive index (RI) for HB-LED packaging with lower g...
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Preventing the Destructive Potential of Partial Discharge on HV Optic Devices
The Partial Discharge phenomenon has been plaguing the electrical and electronic industries for many years, by damaging equipment and increasing production c...
Sponsored by
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Enabling Thinner Packages through Novel Materials Innovations
According to a new industry report, thinned wafers will comprise the majority of wafers in the device market by 2016. (1) The study indicates that memory and...
Sponsored by
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Silver Price Control: New Materials Technology Helps Mitigate Silver’s Rising Cost
With the relentless rise in silver prices over the past couple of years has come a packaging production cost challenge for device manufacturers: how to manag...
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FREE WEBCAST: Lens Tilt in Small Auto-Focus CamerasThis webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors. Sponsored by
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FREE WEBCAST: Light and Color Measurement of Today's LED TechnologyThe seminar is an ideal fit for anyone interested in characterizing and communicating the light and color properties of LED’s accurately. Sponsored by
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