Invensas debuts high-I/O PoP semiconductor packaging design
May 22, 2012
Invensas Corporation, Tessera subsidiary, debuted bond via array (BVA) technology, an ultra-high-I/O PoP semiconductor packaging alternat...
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Amkor plans semiconductor packaging and test facility in Korea
May 19, 2012
Amkor Technology Inc. (NASDAQ:AMKR) plans to build a state-of-the-art factory and global research and development center in the Incheon F...
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"3.5D interposer technology could someday replace PCBs" -- TSMC's Doug Yu
May 15, 2012
TSMC’s Doug Yu challenged the current nomenclature and pronounced that interposer technology should be called “3.5D” instead of 2.5D, sin...
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Lithography challenges for leading edge 3D packaging applications
May 7, 2012
The lithography challenges associated with TSV fabrication for various devices structures are investigated. Warren W. Flack, Manish...
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David McCann of GLOBALFOUNDRIES to speak at The ConFab 2012
May 3, 2012
Solid State Technology is proud to announce that David McCann will speak at The ConFab 2012. David, the Senior Director for Packaging R&a...
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The Micron Memory Cube consortium
May 1, 2012
Micron has joined with Samsung to create the "Hybrid Memory Cube (HMC) Consortium" with fellow founding members Altera, Open Si...
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Direct chip bonding, all-SiC design increase power density in Mitsubishi Electric inverter
May 23, 2012
Mitsubishi Electric Corporation developed a prototype forced-air-cooled three-phase 400V output inverter with all-silicon carbide (SiC) power modules and dir...
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APNT's new thermal interface materials meet power semiconductors' reqs
May 23, 2012
Applied Nanotech Holdings Inc. uncrated the THERCOBOND family of highly thermally conductive bonding and printed materials for power electronics and photonic...
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Indium expands electronics materials manufacturing with new facility in NY
May 22, 2012
Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materia...
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Dow Electronic Materials promotes Muni to direct advanced packaging products
May 21, 2012
Bhavesh Muni took the helm as global business director for the Advanced Packaging Technologies business of Dow Electronic Materials, covering Dow's semicondu...
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IC packaging substrates heading for $8.67B in 2012
May 18, 2012
In 2012, the global IC substrate market will reach a value of USD8.67 billion, according to Research in China’s “Global and Chinese IC Substrate Industry Rep...
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Keeping Packages Cool and Reliability High
Ever-increasing functionality and ever-decreasing device footprints have presented semiconductor packaging manufacturers with quite a dilemma: how to manage ...
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PVD Solutions for Next Generation MEMS and Sensors
As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with ...
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FREE WEBCAST: Lens Tilt in Small Auto-Focus CamerasThis webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors. Sponsored by
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FREE WEBCAST: Light and Color Measurement of Today's LED TechnologyThe seminar is an ideal fit for anyone interested in characterizing and communicating the light and color properties of LED’s accurately. Sponsored by
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