Present at ESTC 2012 in Amsterdam
02/21/2012
Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assem...
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Amkor plans IMAPS Device Packaging keynote
02/21/2012
The 2012 IMAPS Device Packaging Conference will take place March 6-8 in Fountain Hills, AZ, with Amkor's Dr. Robert Darveaux presenting "Escalating Challenges in Developing Complex Solutions f...
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Join iNEMI's electronics manufacturing supply chain workshop at IPC APEX
02/17/2012
iNEMI will hold the industry kick-off for its 2013 Roadmap in an open workshop immediately following IPC APEX EXPO in San Diego, CA, March 1-2. |
Georgia Tech produces 130um 3D organic semiconductor package
02/16/2012
Georgia Tech’s Packaging Research Center built a 3D organic package at 130µm thickness at 30µm pitch using ultra-short Cu-Cu interconnections, chip-last integration, and bonding below 200°C. |
Universities: Enter to win a Finetech die bonder
02/15/2012
Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. |
Hesse & Knipps opens wedge bonder demo lab on West Coast
02/15/2012
Backend packaging equipment supplier Hesse & Knipps Inc. opened a West Coast Demo and Applications Laboratory at its manufacturer rep Chalman Technologies. |
LEDs, power semiconductors packaged with high-thermal-conductivity die attach adhesives
02/15/2012
Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for LEDs and small power semiconductor die packaging. |
Amkor continues cost reductions with voluntary retirement in Japan
02/10/2012
Amkor (NASDAQ:AMKR) shared that it cut costs through workforce reductions in Q4 2012, and announced a voluntary retirement program in Japan to continue this initiative. |
Synova Laser MicroJet wafer dicing tools to be made by Makino
02/09/2012
Synova SA formed an OEM agreement with its partner Makino Milling Machine Co. Ltd., wherein Makino will manufacture Laser MicroJet (LMJ) tools based on Synova technology. |
Preventing the Destructive Potential of Partial Discharge on HV Optic Devices
The Partial Discharge phenomenon has been plaguing the electrical and electronic industries for many years, by damaging equipment and increasing pr...
Sponsored by
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Enabling Thinner Packages through Novel Materials Innovations
According to a new industry report, thinned wafers will comprise the majority of wafers in the device market by 2016. (1) The study indicates that ...
Sponsored by
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Silver Price Control: New Materials Technology Helps Mitigate Silver’s Rising Cost
With the relentless rise in silver prices over the past couple of years has come a packaging production cost challenge for device manufacturers: ho...
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FREE WEBCAST: Lens Tilt in Small Auto-Focus CamerasThis webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors. Sponsored by
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FREE WEBCAST: Light and Color Measurement of Today's LED TechnologyThe seminar is an ideal fit for anyone interested in characterizing and communicating the light and color properties of LED’s accurately. Sponsored by
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2012 IPC APEX EXPOSan Diego, CA
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IMAPS Device PackagingScottsdale, AZ
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IDTechEx Printed Electronics Europe 2012Berlin, Germany
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VOICE 2012San Jose, CA
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ITRI brings 3D packaging expertise to Rambus partnership
12/15/2011
Licensing company Rambus Inc. (Nasdaq:RMBS) is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan on the development of in...
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IPC, JEDEC devise package strain test
12/15/2011
IPC and JEDEC created “IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects” to help identify safe levels o...
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Bond shear inspection and 300mm wafer handling integration enables Class-2 cleanliness
12/15/2011
CHAD Industries integrated its WaferMate300-1 automated wafer handling workcell with Nordson DAGE's 4300 Bond Shear inspection tool, allowing for h...
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Underfill, wafer-level dielectrics, Cu-compatible resins among packaging material winners
12/14/2011
Semiconductor packaging materials will be a $22.8 billion market this year, and should grow to $25.7 billion by 2015, says SEMI and TechSearch Inte...
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