ADVANCED PACKAGING

Semiconductor packaging technologies and 3D and wafer-level package architectures.

3D Integration

Wafer Level Packaging

Materials

PACKAGING NEWS & FEATURES

X-FAB Silicon Foundries adopts SFT software

02/03/2012 X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT's R3D (Resistive 3D) software for its 0.18µm high-voltage process (XH018), providing improvements in reliability and e...

3M debuts high-capacitance ECM for IC packaging, RF, other apps

02/02/2012

3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI).

Multitest launches MT9510 x16 test tool with Asian sale

02/01/2012

Multitest launched its tri-temp 16-site pick-and-place platform, MT9510 x16, with an installation at a high-volume chip test site in Asia.

STATS ChipPAC shutters Thailand semiconductor packaging plant after floods

01/31/2012

STATS ChipPAC decided not to resume semiconductor assembly operations in its Thailand plant, owing to extensive equipment and facility damages sustained during the disastrous floods in 2011.

CEA-Leti launches 3D semiconductor packaging platform

01/31/2012 CEA-Leti launched a major new platform, Open 3D, that provides industrial and academic partners with a global offer of mature 3D packaging technologies for their advanced semiconductor products and...

Tanaka establishes copper bonding wire production in Taiwan

01/31/2012

Tanaka Denshi Kogyo K.K., of Tanaka Precious Metals, will establish a production subsidiary for manufacturing copper bonding wire in Taiwan, with manufacturing ramp on February 1.

Keithley Instruments upgrades semiconductor test software suite

01/26/2012 Keithley Instruments Inc. upgraded the capabilities of its Automated Characterization Suite Test Environment to ACS Version 4.4. The software is used with several Keithley instrument and system con...

3D MID sensor fabricated with Ticona laser-activated LCP circuits

01/25/2012 2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic circuits. The Vectra E840i forms circuit...

Presto Engineering semiconductor service hub opens in Israel

01/24/2012

Presto Engineering, integrated semiconductor test and product engineering services provider, opened its newest Hub to serve the semiconductor design community, in Israel.

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LIVE NEWS STREAM

Fujitsu Semiconductor Expands Use of Calibre for Advanced IC Physical Verification and Design for Manufacturing.

WILSONVILLE, Ore: Mentor Graphics Corporation (NASDAQ: MENT) todayannounced that Fujitsu Semiconductor Limited has expanded its use ofthe Calibre(r...

Sanmina-SCI Calls for Partial Redemption of 8.125% Senior Subordinated Notes Due 2016

Sanmina-SCI Corporation (NASDAQ: SANM) is calling today for redemption on March 1, 2012 $150.0 million in aggregate principal amount of its 8.125% ...

Inventors, Entrepreneurs, and Makers of All Things Technical and Scientific Will Find Amazing Ideas and Tools to Make Their Dreams Reality at USA Science & Engineering Festival

The USA Science & Engineering Festival hosted by Lockheed Martin offers a special appeal for budding entrepreneurs, inventors, engineers and pr...

-Crestron Labs Cooks Up Next Gen Technology at ISE 2012

ENP Newswire - 31 January 2012 Release date- 30012012 - Crestron Labs, the research arm of the engineering department is cooking up the latest cutt...

Fujitsu Semiconductor expands use of Calibre platform

The selection was driven by the Calibre product's accuracy and performance, which address design complexity at advanced nodes, as well as new Calib...

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FINANCIALS

PACKAGING VIDEOS

PACKAGING WHITE PAPERS

Preventing the Destructive Potential of Partial Discharge on HV Optic Devices

The Partial Discharge phenomenon has been plaguing the electrical and electronic industries for many years, by damaging equipment and increasing pr...

Enabling Thinner Packages through Novel Materials Innovations

According to a new industry report, thinned wafers will comprise the majority of wafers in the device market by 2016. (1) The study indicates that ...

New Pressureless, High UPH Silver Sintering Technology Charges Up Power Device Manufacturers

Silver sintering is not a new technology. In fact, it has been around for some time. What is new, however, is a groundbreaking material innovation ...