PACKAGING

PACKAGING NEWS & FEATURES

Present at ESTC 2012 in Amsterdam

02/21/2012 Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assem...

Amkor plans IMAPS Device Packaging keynote

02/21/2012 The 2012 IMAPS Device Packaging Conference will take place March 6-8 in Fountain Hills, AZ, with Amkor's Dr. Robert Darveaux presenting "Escalating Challenges in Developing Complex Solutions f...

Join iNEMI's electronics manufacturing supply chain workshop at IPC APEX

02/17/2012

iNEMI will hold the industry kick-off for its 2013 Roadmap in an open workshop immediately following IPC APEX EXPO in San Diego, CA, March 1-2.

Georgia Tech produces 130um 3D organic semiconductor package

02/16/2012

Georgia Tech’s Packaging Research Center built a 3D organic package at 130µm thickness at 30µm pitch using ultra-short Cu-Cu interconnections, chip-last integration, and bonding below 200°C.

Universities: Enter to win a Finetech die bonder

02/15/2012

Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges.

Hesse & Knipps opens wedge bonder demo lab on West Coast

02/15/2012

Backend packaging equipment supplier Hesse & Knipps Inc. opened a West Coast Demo and Applications Laboratory at its manufacturer rep Chalman Technologies.

LEDs, power semiconductors packaged with high-thermal-conductivity die attach adhesives

02/15/2012

Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for LEDs and small power semiconductor die packaging.

Amkor continues cost reductions with voluntary retirement in Japan

02/10/2012

Amkor (NASDAQ:AMKR) shared that it cut costs through workforce reductions in Q4 2012, and announced a voluntary retirement program in Japan to continue this initiative.

Synova Laser MicroJet wafer dicing tools to be made by Makino

02/09/2012

Synova SA formed an OEM agreement with its partner Makino Milling Machine Co. Ltd., wherein Makino will manufacture Laser MicroJet (LMJ) tools based on Synova technology.

LIVE NEWS STREAM

Luxtera Ships One-Millionth Silicon CMOS Photonics Enabled 10Gbit Channel; Milestone signifies the emergence of Silicon Photonics as the next generation interconnect with 10 Petabits of transceiver bandwidth shipped

Luxtera: News Highlights: Luxtera's one-millionth commercially consumed Silicon CMOS Photonic channel represents the maturity of the comp...

MEDIA ALERT: EVE to Highlight Hardware/Software Co-Verification at DVCon 2012; ZeBu-Blade2 for Fast ASIC/SoC Desktop Emulation to Be Featured

At DVCon 2012 Booth #602 WHO: EVE, the leader in hardware/software co-verification WHAT: Will exhibit at DVCon 2012 in Booth #602 ...

LONGBOW LLC Delivers First Production Block III Apache Data Link System to the U.S. Army

The LONGBOW Limited Liability Company, a joint venture between Lockheed Martin (NYSE: LMT) and Northrop Grumman (NYSE: NOC), recently delivered t...

Wind River Accelerates Development for Samsung Android Smartphones; NEWS HIGHLIGHTS; * Wind River's testing software helps Samsung manage complexities of Android software testing and accelerate delivery of high-quality devices to market.; * Wind River is also working with additional device manufacturers on Android-based smartphones, joining Samsung and others such as Clarion, Fujitsu, Leadcore and Renesas as recent customer wins.; * Wind River can deliver Android expertise and technologies for a wide range of Android implementations.

Wind River , a world leader in embedded and mobile software, announced Samsung Electronics Co., Ltd. is using Wind River's Android testing ...

Digi-Key Corporation Now Stocking Panasonic PAN1321i Bluetooth RF Modules

Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry's largest selection of el...

FINANCIALS

PACKAGING VIDEOS

EIQ2 SST

PACKAGING WHITE PAPERS

Preventing the Destructive Potential of Partial Discharge on HV Optic Devices

The Partial Discharge phenomenon has been plaguing the electrical and electronic industries for many years, by damaging equipment and increasing pr...
Sponsored by

Enabling Thinner Packages through Novel Materials Innovations

According to a new industry report, thinned wafers will comprise the majority of wafers in the device market by 2016. (1) The study indicates that ...
Sponsored by

Silver Price Control: New Materials Technology Helps Mitigate Silver’s Rising Cost

With the relentless rise in silver prices over the past couple of years has come a packaging production cost challenge for device manufacturers: ho...

PACKAGING WEBCASTS

FREE WEBCAST: Lens Tilt in Small Auto-Focus Cameras

This webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors.

FREE WEBCAST: Light and Color Measurement of Today's LED Technology

The seminar is an ideal fit for anyone interested in characterizing and communicating the light and color properties of LED’s accurately.

PACKAGING EVENTS

2012 IPC APEX EXPO

San Diego, CA
February 28, 2012 - March 1, 2012

IMAPS Device Packaging

Scottsdale, AZ
March 4, 2012 - March 8, 2012

IDTechEx Printed Electronics Europe 2012

Berlin, Germany
April 3, 2012 - April 4, 2012

VOICE 2012

San Jose, CA
April 24, 2012 - April 26, 2012

PACKAGING PODCASTS

ITRI brings 3D packaging expertise to Rambus partnership

12/15/2011 Licensing company Rambus Inc. (Nasdaq:RMBS) is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan on the development of in...

IPC, JEDEC devise package strain test

12/15/2011 IPC and JEDEC created “IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects” to help identify safe levels o...

Bond shear inspection and 300mm wafer handling integration enables Class-2 cleanliness

12/15/2011 CHAD Industries integrated its WaferMate300-1 automated wafer handling workcell with Nordson DAGE's 4300 Bond Shear inspection tool, allowing for h...

Underfill, wafer-level dielectrics, Cu-compatible resins among packaging material winners

12/14/2011 Semiconductor packaging materials will be a $22.8 billion market this year, and should grow to $25.7 billion by 2015, says SEMI and TechSearch Inte...

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