ADVANCED PACKAGING
LATEST ISSUE
Volume 56, Issue 4
PACKAGING ARTICLES
Rockchip launches new tablet SoCs on GLOBALFOUNDRIES’ 28nm HKMG process technology
06/18/2013
The combination of Rockchip’s design and GLOBALFOUNDRIES’ 28nm HKMG process technology resulted in a mainstream tablet System-on-Chip (SoC) capable of operating at up to 1.8 GHz performance, while ...
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Market for hard drives in video surveillance to hit billion-dollar mark by 2017
06/18/2013
Revenue for both internal and external HDDs in video-surveillance applications will rise from $638.7 million this year to $1.0 billion by 2017, a remarkable 57 percent increase. |
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Multitest VP to discuss quality in 3D assembly at SEMICON West
06/18/2013
Multitest’s James Quinn will present during the 2013 SEMICON West exhibition and conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. |
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Imec presents 4K2K CMOS image sensor together with Panasonic
06/18/2013
The co-developed imager sensor chip targets high speed, high resolution imaging applications such as next generation HDTV. |
HEADLINES
Mentor Graphics and Tezzaron to integrate Calibre 3DSTACK with 3D-ICs
The new integration will focus on fast, automated verification of die-to-die interactions in 2.5D and 3D stacked die configurations by verifying in...
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CNH selects Mentor VeSys software platform
The VeSys platform is a suite of wiring and harness design software tools optimized for rapid deployment and low IT footprint. Capital is an advanc...
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EV Group And Dynaloy Jointly Develop Complete Single-Wafer Cleaning Solution For 3D-IC/TSV, Advanced Packaging, MEMS And Compound Semiconductor Applications; CoatsClean(TM) combines process, equipment and formulation technology to deliver innovative, low cost-of-ownership approach to single-wafer photoresist and residue removal
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, and Dynaloy, LLC, an international manufacturer of chemicals f...
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Blue Pearl Software opens new office in Texas
Richard Gary has sales and sales management experience. Over the years, he has provided support for his local customers while he worked for compani...
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United Kingdom Intellectual Property Office Publishes Application for Trademark "LOOK INSIDE" to Intel for Multiple Goods and Services
South Wales, United Kingdom, June 18 -- Intel Corp., California, United States of America, has filed the trademark "LOOK INSIDE" on March 12 for mu...
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Appointment of Independent Non-Executive Director and Re-designation of Director
Semiconductor Manufacturing International Corporation ("SMIC(http://www.smics.com/eng/index.php)"; NYSE: SMI; SEHK: 981), China's largest and most ...
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FINANCIALS
TECHNOLOGY PAPERS
Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other...
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Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner...
Sponsored by
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WEBCASTS
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...
Sponsored by
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450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
Sponsored by
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Innovation in Semiconductor Manufacturing Instrumentation
As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...
Sponsored by
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VIDEOS
EVENTS
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NEW PRODUCTS
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All-in-one microscope for advanced imaging, recording and measurement
June 7, 2013
Building on its extensive microscope lineup, KEYENCE Corporation has released a new multipurpose microscope. |
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Olympus launches LEXT OLS4100 laser confocal microscope
June 7, 2013
New 3D measuring system offers auto brightness and high-speed stitching. |
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3M announces QDEF; to bring 50% more color to LCD devices
May 21, 2013
3M announced today it is in the final stages of scale-up for its new 3M Quantum Dot Enhancement Film (QDEF). The new film allow...
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COMSOL Multiphysics 4.3b offers new additions to simulation platform
May 16, 2013
COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL s...
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FEATURED PRODUCTS
