ADVANCED PACKAGING
LATEST ISSUE
05/01/2013
Volume 56, Issue 3
PACKAGING ARTICLES
Vishay Intertechnology enhances precision thin film chip resistor arrays
05/16/2013
Vishay Intertechnology, Inc. today announced that the company has enhanced its ACAS 0606 AT and ACAS 0612 AT precision thin film chip resistor arrays with tighter absolute tolerance, relative toler...
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EU announces achievements of three-year power microelectronics program
05/16/2013
LAST POWER, the European Union-sponsored program aimed at developing a cost-effective and reliable technology for power electronics, today announced its three-year program achievements. |
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Yole Developpement conducts 2.5D, 3DIC and TSV interconnect patent investigation
05/15/2013
Yole Développement announced its 2.5D, 3DIC and TSV Interconnect Patent Investigation report. For this analysis of 3D packaging technology patents, more than 1800 patent families have been screened.
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Opportunities for electronics manufacturing services in medical industry are increasing
05/15/2013
Original equipment manufacturers (OEMs) are increasingly turning to electronics manufacturing service (EMS) providers to better handle the escalating volumes of electronic content in the medical in...
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HEADLINES
Lantronix to Present at B. Riley 14th Annual Investor Conference and Sidoti Semi-Annual Microcap Conference
Lantronix, Inc. ("the Company") (NASDAQ: LTRX), a leading global provider of smart M2M connectivity solutions, today announced that the Company's ...
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IDC to Host Deep Dive Discussion Session on Transparent Computing and Natural Interfaces with Microsoft, HP, and Intel at SMART TECHnology World Conference, May 30-31; Limited-seating, interactive discussion session for executives to address what it takes to implement touch, voice, gesture, and other interactive computing technologies in intelligent systems
International Data Corporation ( IDC ) and GTIA L.L.C. today announced that three experts on transparent computing from the Microsoft Xbox, HP Cons...
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NCKU, ASE Host R & D Application Forum to Promote Collaboration
20E3 innovative technology R & D Application Forum co-organized by National Cheng Kung University (NCKU), Tainan, and Advanced Semiconductor En...
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Vietnam targets to earn 40 bln USD from electronics exports by 2017
Vietnam set a target to earn 40 billion U.S. dollars from electronics exports by 2017, over nearly 20 billion dollars in 2012. The remarks...
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-Lockheed Martin Team Delivers Major New Crime-Solving Capabilities Via FBI's Next Generation Identification System
ENP Newswire - 17 May 2013Release date- 15052013 - ROCKVILLE, Md., - The FBI's Next Generation Identification (NGI) Increment 3 was deployed on May...
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EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System For Micro- and Nano-Electronics Production
Flexible System Integrates Spin/Spray Coating and Wet Processing for MEMS, Advanced Packaging and Compound Semiconductor ApplicationsSINGAPORE,&nbs...
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FINANCIALS
TECHNOLOGY PAPERS
Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other...
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Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner...
Sponsored by
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WEBCASTS
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...
Sponsored by
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450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
Sponsored by
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Innovation in Semiconductor Manufacturing Instrumentation
As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...
Sponsored by
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VIDEOS
EVENTS
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NEW PRODUCTS
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COMSOL Multiphysics 4.3b offers new additions to simulation platform
May 16, 2013
COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL s...
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Spectra-Physics introduces industrial picosecond laser
May 10, 2013
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...
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Multitest announces ecoAmp for high-power applications
May 8, 2013
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...
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EV Group rolls out EVG120 processing system
May 7, 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, t...
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