SATS providers order BTU reflow ovens in Asia
02/07/2012
BTU International Inc. won multiple orders for PYRAMAX solder reflow ovens from semiconductor assembly and test subcontractors (SATS) in Asia. |
Kyocera doubles flip-chip assembly with new cleanroom in US
02/07/2012
Kyocera America, Inc. doubled its flip chip assembly capacity for microelectronic devices with a $3.5 million Class-10,000 cleanroom, offering lead-free processes in San Diego. |
Rudolph sells metrology tool for back-end wafer packaging processes
02/06/2012
Rudolph Technologies (NASDAQ:RTEC) delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing. |
SUSS wafer bonder/debonder features up to 6 modules in new generation
02/06/2012
SUSS MicroTec launched the XBC300 Gen2 high-volume 3D wafer processing tool for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers. |
X-FAB Silicon Foundries adopts SFT software
02/03/2012
X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT's R3D (Resistive 3D) software for its 0.18µm high-voltage process (XH018), providing improvements in reliability and e...
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3M debuts high-capacitance ECM for IC packaging, RF, other apps
02/02/2012
3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI). |
Multitest launches MT9510 x16 test tool with Asian sale
02/01/2012
Multitest launched its tri-temp 16-site pick-and-place platform, MT9510 x16, with an installation at a high-volume chip test site in Asia. |
STATS ChipPAC shutters Thailand semiconductor packaging plant after floods
01/31/2012
STATS ChipPAC decided not to resume semiconductor assembly operations in its Thailand plant, owing to extensive equipment and facility damages sustained during the disastrous floods in 2011. |
CEA-Leti launches 3D semiconductor packaging platform
01/31/2012
CEA-Leti launched a major new platform, Open 3D, that provides industrial and academic partners with a global offer of mature 3D packaging technologies for their advanced semiconductor products and...
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Nominations for EDA Consortium Board of Directors Are Closing Soon
The EDA Consortium (EDAC) is seeking nominations for the Board of Directors for the two-year term beginning May 31, 2012.
Voting member c...
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REP. BILL SHUSTER HOLDS A HEARING ON DOD CONTRACTING AND REGULATORY ISSUES
HOUSE COMMITTEE ON ARMED SERVICES, DEFENSE BUSINESS PANEL HOLDS A HEARING ON DOD CONTRACTING AND REGULATORY ISSUES
FEBRUARY 6, 2012
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Microsemi Participates in New Research Project to Reduce CO Emissions; Industry Consortium Tasked with Developing Silicon on Insulator Sensors for Harsh Environments
Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performanc...
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Digital receipt use grows, but some cling to security of paper
As more retailers embrace the use of digital, or electronic, receipts in the name of green efficiency -- and possibly even safety -- they also ha...
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Mentor Graphics Assigned Patent
ALEXANDRIA, Va., Feb. 8 -- Mentor Graphics, Wilsonville, Ore., has been assigned a patent (8,112,686) developed by Friedrich Hapke, Winsen, Germa...
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Preventing the Destructive Potential of Partial Discharge on HV Optic Devices
The Partial Discharge phenomenon has been plaguing the electrical and electronic industries for many years, by damaging equipment and increasing pr...
Sponsored by
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Enabling Thinner Packages through Novel Materials Innovations
According to a new industry report, thinned wafers will comprise the majority of wafers in the device market by 2016. (1) The study indicates that ...
Sponsored by
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New Pressureless, High UPH Silver Sintering Technology Charges Up Power Device Manufacturers
Silver sintering is not a new technology. In fact, it has been around for some time. What is new, however, is a groundbreaking material innovation ...
Sponsored by
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FREE WEBCAST: Lens Tilt in Small Auto-Focus CamerasThis webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors. Sponsored by
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FREE WEBCAST: Light and Color Measurement of Today's LED TechnologyThe seminar is an ideal fit for anyone interested in characterizing and communicating the light and color properties of LED’s accurately. Sponsored by
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Flexible Electronics and Displays Conference and ExhibitionPhoenix, AZ
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2012 IPC APEX EXPOSan Diego, CA
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IDTechEx Printed Electronics Europe 2012Berlin, Germany
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VOICE 2012San Jose, CA
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ITRI brings 3D packaging expertise to Rambus partnership
12/15/2011
Licensing company Rambus Inc. (Nasdaq:RMBS) is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan on the development of in...
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IPC, JEDEC devise package strain test
12/15/2011
IPC and JEDEC created “IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects” to help identify safe levels o...
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Bond shear inspection and 300mm wafer handling integration enables Class-2 cleanliness
12/15/2011
CHAD Industries integrated its WaferMate300-1 automated wafer handling workcell with Nordson DAGE's 4300 Bond Shear inspection tool, allowing for h...
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Underfill, wafer-level dielectrics, Cu-compatible resins among packaging material winners
12/14/2011
Semiconductor packaging materials will be a $22.8 billion market this year, and should grow to $25.7 billion by 2015, says SEMI and TechSearch Inte...
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