IC package revenues outgrow unit shipments through 2016
05/29/2012
Increased demand for product functionality is driving up IC packaging revenue faster -- a 9.8% compound annual growth rate (CAGR) -- than IC unit growth -- 7.3% CAGR 2010-2016, says New Venture Res...
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Semiconductor packaging house orders 14 Rudolph Technologies inspection tools
05/29/2012
Rudolph Technologies Inc. will deliver 14 NSX Series 320 inspection systems to a large outsourced semiconductor assembly and test (OSAT) provider. |
ASE opens Phase 3 semiconductor packaging and test facility in Weihai
05/29/2012
Advanced Semiconductor Engineering Incorporated (ASE) opened its Phase 3 manufacturing facility in Weihai, Shangdong province, China, boosting discrete packaging and test capacity. |
Top suppliers of semiconductor assembly and test equipment: VLSIresearch survey
05/25/2012
THE BEST rankings from VLSIresearch identify the highest-rated suppliers of wafer processing, assembly, and test equipment. The top 2 test equipment suppliers were just fractions apart in the ranki...
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MEMS Symposium Report: Chasing 1 Trillion
05/24/2012
The 10th Annual MEMS Technology Symposium sponsored by MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 23 at the San Jose Holiday Inn. This year’s theme was “Sensors: ...
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Direct chip bonding, all-SiC design increase power density in Mitsubishi Electric inverter
05/23/2012
Mitsubishi Electric Corporation developed a prototype forced-air-cooled three-phase 400V output inverter with all-silicon carbide (SiC) power modules and direct lead bonding that has a power densit...
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APNT's new thermal interface materials meet power semiconductors' reqs
05/23/2012
Applied Nanotech Holdings Inc. uncrated the THERCOBOND family of highly thermally conductive bonding and printed materials for power electronics and photonics packaging. |
Indium expands electronics materials manufacturing with new facility in NY
05/22/2012
Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds. |
Invensas debuts high-I/O PoP semiconductor packaging design
05/22/2012
Invensas Corporation, Tessera subsidiary, debuted bond via array (BVA) technology, an ultra-high-I/O PoP semiconductor packaging alternative to wide-I/O TSV packaging. |
Dow Electronic Materials promotes Muni to direct advanced packaging products
05/21/2012
Bhavesh Muni took the helm as global business director for the Advanced Packaging Technologies business of Dow Electronic Materials, covering Dow's semiconductor packaging materials product portfol...
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Amkor plans semiconductor packaging and test facility in Korea
05/19/2012
Amkor Technology Inc. (NASDAQ:AMKR) plans to build a state-of-the-art factory and global research and development center in the Incheon Free Economic Zone, which is located in the greater metropoli...
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IC packaging substrates heading for $8.67B in 2012
05/18/2012
In 2012, the global IC substrate market will reach a value of USD8.67 billion, according to Research in China’s “Global and Chinese IC Substrate Industry Report, 2011-2012.” As IC operating frequen...
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Silicon Labs offers bare die from 1 wafer and up
05/16/2012
Mixed-signal IC maker Silicon Laboratories Inc. (NASDAQ: SLAB) introduced a microcontroller (MCU) die sales program with a minimum order quantity of 1 wafer. |
Wire bonder debuts with Cu wire optimization, automatic rethreading from ASM Pacific Technology
05/16/2012
The ASM iHawk Xpress Opto Wire Bonder from backend semiconductor assembly equipment supplier ASM Pacific Technology offers new innovations in transport, copper-wire bonding, and automatic rethreadi...
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Keeping Packages Cool and Reliability High
Ever-increasing functionality and ever-decreasing device footprints have presented semiconductor packaging manufacturers with quite a dilemma: how ...
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PVD Solutions for Next Generation MEMS and Sensors
As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with ...
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FREE WEBCAST: Lens Tilt in Small Auto-Focus CamerasThis webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors. Sponsored by
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FREE WEBCAST: Light and Color Measurement of Today's LED TechnologyThe seminar is an ideal fit for anyone interested in characterizing and communicating the light and color properties of LED’s accurately. Sponsored by
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ESTC 2012Amsterdam, the Netherlands
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Global Interposer Technology Workshop at GA TechAtlanta, GA
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ITRI brings 3D packaging expertise to Rambus partnership
12/15/2011
Licensing company Rambus Inc. (Nasdaq:RMBS) is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan on the development of in...
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IPC, JEDEC devise package strain test
12/15/2011
IPC and JEDEC created “IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects” to help identify safe levels o...
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Bond shear inspection and 300mm wafer handling integration enables Class-2 cleanliness
12/15/2011
CHAD Industries integrated its WaferMate300-1 automated wafer handling workcell with Nordson DAGE's 4300 Bond Shear inspection tool, allowing for h...
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Underfill, wafer-level dielectrics, Cu-compatible resins among packaging material winners
12/14/2011
Semiconductor packaging materials will be a $22.8 billion market this year, and should grow to $25.7 billion by 2015, says SEMI and TechSearch Inte...
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