ADVANCED PACKAGING

PACKAGING NEWS & FEATURES

IC package revenues outgrow unit shipments through 2016

05/29/2012 Increased demand for product functionality is driving up IC packaging revenue faster -- a 9.8% compound annual growth rate (CAGR) -- than IC unit growth -- 7.3% CAGR 2010-2016, says New Venture Res...

Semiconductor packaging house orders 14 Rudolph Technologies inspection tools

05/29/2012

Rudolph Technologies Inc. will deliver 14 NSX Series 320 inspection systems to a large outsourced semiconductor assembly and test (OSAT) provider.

ASE opens Phase 3 semiconductor packaging and test facility in Weihai

05/29/2012

Advanced Semiconductor Engineering Incorporated (ASE) opened its Phase 3 manufacturing facility in Weihai, Shangdong province, China, boosting discrete packaging and test capacity.

Top suppliers of semiconductor assembly and test equipment: VLSIresearch survey

05/25/2012 THE BEST rankings from VLSIresearch identify the highest-rated suppliers of wafer processing, assembly, and test equipment. The top 2 test equipment suppliers were just fractions apart in the ranki...

MEMS Symposium Report: Chasing 1 Trillion

05/24/2012 The 10th Annual MEMS Technology Symposium sponsored by MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 23 at the San Jose Holiday Inn. This year’s theme was “Sensors: ...

Direct chip bonding, all-SiC design increase power density in Mitsubishi Electric inverter

05/23/2012 Mitsubishi Electric Corporation developed a prototype forced-air-cooled three-phase 400V output inverter with all-silicon carbide (SiC) power modules and direct lead bonding that has a power densit...

APNT's new thermal interface materials meet power semiconductors' reqs

05/23/2012

Applied Nanotech Holdings Inc. uncrated the THERCOBOND family of highly thermally conductive bonding and printed materials for power electronics and photonics packaging.

Indium expands electronics materials manufacturing with new facility in NY

05/22/2012

Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.

Invensas debuts high-I/O PoP semiconductor packaging design

05/22/2012

Invensas Corporation, Tessera subsidiary, debuted bond via array (BVA) technology, an ultra-high-I/O PoP semiconductor packaging alternative to wide-I/O TSV packaging.

Dow Electronic Materials promotes Muni to direct advanced packaging products

05/21/2012 Bhavesh Muni took the helm as global business director for the Advanced Packaging Technologies business of Dow Electronic Materials, covering Dow's semiconductor packaging materials product portfol...

Amkor plans semiconductor packaging and test facility in Korea

05/19/2012 Amkor Technology Inc. (NASDAQ:AMKR) plans to build a state-of-the-art factory and global research and development center in the Incheon Free Economic Zone, which is located in the greater metropoli...

IC packaging substrates heading for $8.67B in 2012

05/18/2012 In 2012, the global IC substrate market will reach a value of USD8.67 billion, according to Research in China’s “Global and Chinese IC Substrate Industry Report, 2011-2012.” As IC operating frequen...

Silicon Labs offers bare die from 1 wafer and up

05/16/2012

Mixed-signal IC maker Silicon Laboratories Inc. (NASDAQ: SLAB) introduced a microcontroller (MCU) die sales program with a minimum order quantity of 1 wafer.

Wire bonder debuts with Cu wire optimization, automatic rethreading from ASM Pacific Technology

05/16/2012 The ASM iHawk Xpress Opto Wire Bonder from backend semiconductor assembly equipment supplier ASM Pacific Technology offers new innovations in transport, copper-wire bonding, and automatic rethreadi...

LIVE NEWS STREAM

New Demonstration Center & Expanded Spare Parts Depot to Further Support Palomar Technologies Die Bonder & Wire Bonder Customers in Asia-Pacific Region; New Palomar Asia demonstration laboratory outfitted with applications and process development capabilities for both wire bond and die attach.

Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the successf...

Photo Release -- Alpha and Omega Semiconductor Shrinks Board Space With Chip Scale Packaging Technology; New Power MOSFET Reduces Area by 70% and Package Height by 50%

SUNNYVALE, Calif., May 29, 2012 (GLOBE NEWSWIRE) -- Alpha and Omega Semiconductor Limited (AOS) (Nasdaq:AOSL), a designer, developer and global s...

Drive for Innovation Stops at Parvus to Celebrate Electronics Innovation; Parvus Selected to Showcase Advancements in Rugged Electronic Design

Parvus Corporation today announced that it was selected as a "pit stop" for Avnet Express' Drive for Innovation to showcase the advancements Pa...

National Security Agency Awards Sanmina-SCI Top Secret Classification For Integrated Secure Wireless Intercommunications (ISWICS); NSA Type 1 Certification Protects Confidentiality of Voice and Data

Sanmina-SCI Corporation (Nasdaq: SANM), a leading manufacturing and engineering company making some of the world's most complex and innovative op...

Unisource Global Solutions Receives Two Prestigious Awards Recognizing Sustainable Packaging

Unisource Global Solutions (UGS) - a world leader in developing and commercializing innovative, globally sustainable packaging solutions and a di...

FINANCIALS

PACKAGING WHITE PAPERS

Keeping Packages Cool and Reliability High

Ever-increasing functionality and ever-decreasing device footprints have presented semiconductor packaging manufacturers with quite a dilemma: how ...
Sponsored by

PACKAGING WEBCASTS

PVD Solutions for Next Generation MEMS and Sensors

As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with ...
Sponsored by

FREE WEBCAST: Lens Tilt in Small Auto-Focus Cameras

This webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors.

FREE WEBCAST: Light and Color Measurement of Today's LED Technology

The seminar is an ideal fit for anyone interested in characterizing and communicating the light and color properties of LED’s accurately.

PACKAGING VIDEOS

EIQ2 SST

PACKAGING EVENTS

ESTC 2012

Amsterdam, the Netherlands
September 17, 2012 - September 20, 2012

Global Interposer Technology Workshop at GA Tech

Atlanta, GA
November 14, 2012 - November 16, 2012

PACKAGING PODCASTS

ITRI brings 3D packaging expertise to Rambus partnership

12/15/2011 Licensing company Rambus Inc. (Nasdaq:RMBS) is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan on the development of in...

IPC, JEDEC devise package strain test

12/15/2011 IPC and JEDEC created “IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects” to help identify safe levels o...

Bond shear inspection and 300mm wafer handling integration enables Class-2 cleanliness

12/15/2011 CHAD Industries integrated its WaferMate300-1 automated wafer handling workcell with Nordson DAGE's 4300 Bond Shear inspection tool, allowing for h...

Underfill, wafer-level dielectrics, Cu-compatible resins among packaging material winners

12/14/2011 Semiconductor packaging materials will be a $22.8 billion market this year, and should grow to $25.7 billion by 2015, says SEMI and TechSearch Inte...


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