ADVANCED PACKAGING

LATEST ISSUE

05/01/2013
Volume 56, Issue 3

PACKAGING ARTICLES

Photonics societies launch the National Photonics Initiative to increase R&D and economy

05/23/2013

Photonics societies across the United States today announced the launch of the National Photonics Initiative.

Invensas demos new high bandwidth packaging solution for mobile devices at 2013 ECTC

05/22/2013 Invensas Corporation, a subsidiary of Tessera Technologies, Inc., will showcase its latest mobility solution, an ultra-high bandwidth Bond Via Array (BVATM) Package-on-Package (PoP) product, at the...

IDC predicts semiconductor market to experience 3-4% revenue growth in 2013

05/22/2013

IDC expects the semiconductor market to return to growth in 2013 with revenues forecast to increase by 3.5 percent this year.

North American semiconductor equipment industry posts April 2013 book-to-bill ratio of 1.08

05/22/2013

North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in April 2013 (three-month average basis) and a book-to-bill ratio of 1.08.

HEADLINES

Si2 Announces Board of Directors for 2013-2014; Annual Open Reception slated for Monday at DAC

The Silicon Integration Initiative (Si2) announced the election of their Board of Directors for the 2013-2014 term, who will be introduced at the A...

US Contract Notice: National Aeronautics and Space Administration Issues Solicitation for "D--MENTOR GRAPHICS SOFTWARE LICENSE MAINTENANCE RENEWALS"

National Aeronautics and Space Administration, Goddard Space Flight Center Officer has issued requirement for "D--MENTOR GRAPHICS SOFTWARE LICENSE...

Mentor and Tezzaron collaborate to integrate 3DSTACK

India, May 22 -- Mentor Graphics and Tezzaron Semiconductor announced they are collaborating to integrate the Mentor Calibre 3DSTACK product into T...

US Patent granted to Mentor Graphics Corporation (Oregon) on May 21 titled as "High speed clock control"

United States Patent and Trademark Office has granted patent no. 8,448,008, on May 21, 2013, to Mentor Graphics Corporation (Oregon), titled as "H...

WEALTHMAKERS.COM Issues Bullish Research Reports on AXFN, CTWS, JNS, KONE, MENT, SHEN

May 23, 2013WEALTHMAKERS.COM / www.wealthmakers.com , a Wall Street research and trading firm providing unbiased statistical stock market predictio...

Xirrus Founder Dirk Gates to Speak at Ethernet Innovation Summit, Joining Gordon Bell, Robert Metcalfe, and Andy Bechtolsheim; Gates, the Inventor of Pocket LAN Adapter, PC Ethernet Cards, and Wireless PC card, and Founder of Xirrus and Previously Xircom, Joins Fellow Industry Luminaries to Celebrate the 40th Anniversary of Ethernet's Invention

Xirrus(R), the leader in high-performance Wi-Fi, today announced that Dirk Gates, the company's executive chairman and founder, will speak at the ...

FINANCIALS

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner...
Sponsored by

WEBCASTS

Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
Sponsored by

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...
Sponsored by

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NEW PRODUCTS

3M announces QDEF; to bring 50% more color to LCD devices

May 21, 2013 3M announced today it is in the final stages of scale-up for its new 3M Quantum Dot Enhancement Film (QDEF). The new film allow...

COMSOL Multiphysics 4.3b offers new additions to simulation platform

May 16, 2013 COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL s...

Spectra-Physics introduces industrial picosecond laser

May 10, 2013 Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision ...

Multitest announces ecoAmp for high-power applications

May 8, 2013 Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive ...

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