Si-Ware Systems (SWS) launched its Inertial Sensor Development Platform, the SWS61111, a tool that can be used to evaluate an inertial sensor, such as a gyroscope or accelerometer, to understand sensor behavior and performance with complete interface electronics.

Audio Precision released a pulse density modulation (PDM) audio interface option on its APx500 for direct I/O, modulation, and decimation on MEMS microphones and other PDM devices.

The College of Nanoscale Science and Engineering's (CNSE) Smart System Technology and Commercialization Center of Excellence (STC), Canandaigua, NY, was designated as a Trusted Foundry by the US Department of Defense's Defense Microelectronics Agency.

Hexagon Metrology released the Optiv Classic 321GL tp benchtop vision-measuring metrology system for the North American market. It suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more.

Silex Microsystems brought its Met-Via full-wafer-thickness TSV technology into Chip Architectures by Joint Associated Labs for European Diagnostics, where it is being used to create cost-effective molded chip-level packaging with through metal vias.

Research and Markets released the "ST L3G3250A 3-axis MEMS Gyroscope Reverse Costing Analysis" report, providing a teardown of STMicroelectronics’ MEMS gyroscope in an LGA package.

The MEMS packaging sector is growing 2x faster (~20% CAGR) by unit shipments than the larger IC packaging industry, shows Yole Développement in its report “MEMS Packaging.”

Karen Lightman, the Managing Director of the MEMS Industry Group, blogs from the MEMS Executive Congress Europe, which was held March 20th, in Zurich, Switzerland.

Microfluidic systems designer and maker Dolomite released Pico-Glide, a surface coating agent that facilitates advanced droplet microfluidics developed by Sphere Fluidics.

Sensors in Design 2012 was opened March 28 at the San Jose McEnery Convention Center, in conjunction with Design West. Blogger Mike Fury reports.

Akustica, known for its monolithic single-chip digital MEMS devices, introduced its first analog 2-chip MEMS microphone for mobile handsets, the AKU340.

ACUTRONIC released standard, off-the-shelf 2-axis rate tables to test several MEMS devices simultaneously. The 21-series is primarily made for MEMS manufacturers.

Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.

iNEMI began 2 collaborative efforts related to micro electro mechanical system (MEMS) technology, specifically reliability and test, and will host a workshop on MEMS in May.