PACKAGING AND TESTING
MEMS BLOG
Who's Driving The MEMS Evolution Revolution - Part 1 of 3
April 25, 2013
Karen’s blog from MEMS Executive Congress: Part 2
March 27, 2013
MEMS PACKAGING & TESTING ARTICLES
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Combo MEMS inertial sensors report brisk growth in automotive market
05/13/2013
Combo MEMS sensors for automotive applications are off to another exhilarating ride this year as revenue continues to climb, spurred by rapidly acc...
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Leading MEMS microphone suppliers ride Apple’s gravy train to the top
05/01/2013
Once again demonstrating Apple’s power to ordain winners in the electronics supply chain, the top suppliers last year of microelectromechanical sys...
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Kurt Petersen, MEMS industry pioneer and technology vision, joins IMT board of directors
04/30/2013
IMT, the largest pure-play MEMS foundry in the US, announced today the appointment of MEMS industry pioneer and technology visionary Dr. Kurt Peter...
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TSMC’s MEMS foundry enjoys 80% growth
04/26/2013
TSMC’s MEMS foundry business enjoyed approximately 80 percent growth, achieving approximately $42 million in sales in 2012, which bumpe...
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HEADLINES
Eyelit Inc. Announces Impressive First Quarter Results for its Award-winning Manufacturing Execution (MES) Software; Innovative new software and expansion spark over 30% year-over-year revenue growth for the first quarter of 2013
Eyelit Inc., a manufacturing software provider for visibility, control, and coordination of manufacturing operations for the aerospace & defense, discret...
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SPTS Ships 1000th DRIE Process Module; Milestone shipment extends company's leadership in DRIE
SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced the company...
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SPTS Ships 1000th DRIE Process Module; Milestone shipment extends company's leadership in DRIE
SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced the company h...
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Quality Process Equipment Manufacturer, Yield Engineering Systems, Inc.; YES, Exhibiting at Wafer Level Packaging Tradeshow in May.
Livermore, CA (PRWEB) April 30, 2013
Yield Engineering Systems, Inc. (YES) announced today that they will be exhibiting at The 63rd Electronic Compone...
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MEMS FINANCIALS
TECHNOLOGY PAPERS
Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other...
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Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner...
Sponsored by
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Automated Test Creation for Mixed Signal IP using IJTAG
The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and co...
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WEBCASTS
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL process s...
Sponsored by:
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450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business developme...
Sponsored by:
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Innovation in Semiconductor Manufacturing Instrumentation
As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more demanding of al...
Sponsored by:
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