IEDM unveils 2012 program highlights
Sep 17, 2012
The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8. |
Singapore IME, MOSIS to offer silicon photonics wafer prototyping service
Sep 4, 2012
Singapore's Institute of Microelectronics (IME) and MOSIS have signed a memorandum of understanding (MOU) to offer a multiple-project wafer service targeting silicon integrated photonics. |
Technology licensing company Rambus restructures, creates CTO role
Aug 23, 2012
Rambus Inc. (NASDAQ:RMBS), a technology licensing company, will undergo a restructuring and related cost saving measures to cut its expenses by$30-35 million annually. |
Attend the MEMS & NANO live seminar program in the UK
Aug 23, 2012
The MEMS & NANO free 2-day conference, presented by JEMI, Nanotechnology KTN, and MANCEF, will cover advances in MEMS and nanoscale processes for electronics, industrial and biomedical applications. |
Wafer-level optics maker orders Heidelberg Instruments lithography tool
Aug 21, 2012
Heptagon, wafer-level optics maker, ordered an advanced DWL 2000 maskless lithography system from Heidelberg Instruments. The tool has sophisticated Gray Scale Exposure capability. |
How to participate in SensorsCon 2013
Aug 20, 2012
The second annual SensorsCon 2013, the conference for Sensors Technology, Design and Applications, March 6, 2013, Techmart Center, Santa Clara, CA, is accepting applications for exhibitors, sponsors and speakers. |
Focus on MEMS at SEMICON Taiwan
Aug 20, 2012
SEMICON Taiwan 2012, held September 5-7, will feature both Taiwan MEMS suppliers and global MEMS elites -- including Asia Pacific Microsystems, Freescale, InvenSense, and STMicroelectronics -- who will discuss innovation in MEMS design, manufacture, packaging, testing and equipment. |
Tessera changes CFO, Neely brings high-tech experience
Aug 16, 2012
Tessera appointed Rick Neely, Jr. as EVP and CFO, responsible for the company’s finance, accounting, financial planning, and investor relations, after Michael Anthofer resigned the post. |
Attend MEMS Executive Congress: Keynotes on MEMS in our world
Aug 13, 2012
MEMS Executive Congress 2012 in Scottsdale, AZ, will host keynotes from Ajith Amerasekera, TI Fellow, IEEE Fellow, in Texas Instruments’ Kilby Labs, who will discuss how immersive intelligent systems will change the management of our cities, buildings, personal life, health, transportation, safet...
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Laser nanofabrication for mass production at the nanoscale
Aug 10, 2012
Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.
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NIST promotes lab-on-chip testing standard dev
Aug 8, 2012
Standardized testing and measurement methods, NIST argues, will enable MEMS lab-on-chip manufacturers to accurately determine important physical characteristics of LOC devices such as dimensions, electrical surface properties, and fluid flow rates and temperatures. These must be calculable at all...
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Knowles, Vectron partner with SiTime to grow MEMS timing devices
Aug 2, 2012
Vectron International and Knowles Electronics entered into a strategic partnership with SiTime Corporation, aiming to grow MEMS timing components in the frequency control products market. |
MEMS researcher among President Obama’s outstanding scientists
Jul 27, 2012
President Obama bestowed the Presidential Early Career Awards for Scientists and Engineers upon 96 researchers. It is the highest honor from the US government for science and engineering professionals in the early stages of their independent research careers. |
New MEMS, 3D IC packaging working group chairs at GSA
Jul 24, 2012
Global Semiconductor Alliance (GSA) recently named Jay Esfandyari, STMicroelectronics, as its MEMS Working Group chairman and Ken Potts, Cadence Design Systems, as the 3D IC Working Group chairman. |
Yole updates World MEMS Players database for 2012
Jul 24, 2012
Yole updated its MEMS industry database, World MEMS Players 2012. The product includes contact information for MEMS players, geographical breakdown of the industry, and various MEMS device categories. |
Goodrich expands MEMS fab in US for commercial and military aerospace systems
Jul 23, 2012
Goodrich Corporation (NYSE: GR) added 46,00sq.ft. to its high-tech manufacturing facility in Burnsville, MN, with advanced production, design and development areas for MEMS. |
Self-calibrating MEMS override manufacturing variations
Jul 18, 2012
Purdue researchers have demonstrated self-calibrating MEMS, which enable higher accuracy for existing and new MEMS applications and could eliminate 30% of manufacturing costs by skipping test processes. |
Kionix adds to top-level leadership in products, sales
Jul 16, 2012
Kionix Inc., maker of MEMS accelerometers, added Paul Bryan as EVP of product management and strategy, and promoted Drake Margiotta in sales. |
Oxford Instruments increases throughput on plasma etch and deposition tool
Jul 16, 2012
Oxford Instruments launched the PlasmaPro 100 etch and deposition tool for manufacturing MEMS, HB-LED, semiconductors, and other applications. |
Terry Brewer chats about SEMI and semiconductors at SEMICON West
Jul 13, 2012
Terry Brewer, one of the newest members of SEMI's North American advisory board, talks about semiconductor industry consolidation, as well as new technologies and materials in the industry. He shares how SEMI is reacting to this evolution. |