MEMS APPLICATIONS

MEMS APPLICATIONS ARTICLES

Necessary attributes of a MEMS engineer for new product development

Jun 10, 2013

In the development of new MEMS products, the team is the most important factor.

Fab equipment spending: 23% growth for 2014

Jun 4, 2013 Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to t...

Top 30 MEMS companies of 2012

Jun 3, 2013

The fast growing market for sensors for smart phones is re-shuffling the ranks of MEMS suppliers.

STMicroelectronics announces winners of the iNEMO Design Contest 2013

May 17, 2013 The winning teams successfully conceptualized, developed and built demonstrable prototypes of entirely new applications using ST's iNEMO MEMS sensor-fusion m...

Opportunities for electronics manufacturing services in medical industry are increasing

May 15, 2013 Original equipment manufacturers (OEMs) are increasingly turning to electronics manufacturing service (EMS) providers to better handle the escalating volumes...

HEADLINES

Teledyne DALSA Announces MEMS Integrated Design for Inertial Sensors (MIDIS(TM)) Platform; High performance, low-cost inertial sensor platform for consumer, automotive and sports/health applications

Editors Note: There is a photo associated with this press release.Teledyne DALSA Semiconductor, a Teledyne Technologies company and a world-leading pure-play...

SEMICON Russia 2013 Opens Next Week; Spotlight on Latest Developments of the Russian Microelectronics Sector

The Semiconductor Equipment and Materials International issued the following news release:SEMICON Russia 2013 opens next week (June 4-6), starting with a sem...

MEMS FINANCIALS

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner...
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Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and co...

WEBCASTS

Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL process s...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business developme...
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Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more demanding of al...
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