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EVG and Dynaloy develop single-wafer cleaning solution
06/17/2013
Single-wafer cleaning solution is suitable for 3D-IC/TSV, advanced packaging, MEMS and compound semiconductor applications. |
SEMI releases report on first quarter 2013 manufacturing equipment billings
06/11/2013
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.31 billion in the first quarter of 2013. |
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Bosch and STM hold joint honors as No. 1 MEMS suppliers for 2012
06/11/2013
For the first time ever, no clear winner has emerged to claim top honors in the MEMS business for 2012, with Bosch of Germany and French-Italian ST...
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Alchimer to collaborate with imec on advanced nano-interconnect technologies
06/11/2013
In an industry where finer features are driving market needs, current deposition processes are no longer sufficient to address challenges like inte...
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Necessary attributes of a MEMS engineer for new product development
06/10/2013
In the development of new MEMS products, the team is the most important factor. |
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"Generation Mobile": Advanced Packaging Technology at SEMICON West
06/06/2013
Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form ...
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Leti Innovation Days to present preview of future developments in nanotechnologies
06/06/2013
CEA-Leti will present recent advances and a preview of future developments in micro- and nanotechnologies, followed by workshops on key technical f...
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NEC Display Introduces New PH1400U Digital Projector
NEC Display Solutions of America, a provider of commercial LCD display and projector solutions, announced the new PH1400U digital projector with 3-...
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NEC Display Solutions Adds Digital Projector to PH Series
NEC Display Solutions of America, a provider of LCD display and projector solutions, announced the new PH1400U digital projector with 3-chip DLP sy...
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Cox Communications Selects BSS Solution from NetCracker
NetCracker Technology announced that Cox Communications has selected NetCracker to provide a multi-year managed services business support system so...
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Analog Devices Unveils New RF and Microwave Innovations
Analog Devices (ADI) introduced three RF and microwave ICs designed for high-performance transmitters and receivers used in high-dynamic-range appl...
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Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other...
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Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner...
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Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...
Sponsored by
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450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
Sponsored by
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Innovation in Semiconductor Manufacturing Instrumentation
As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...
Sponsored by
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All-in-one microscope for advanced imaging, recording and measurement
June 7, 2013
Building on its extensive microscope lineup, KEYENCE Corporation has released a new multipurpose microscope. |
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Olympus launches LEXT OLS4100 laser confocal microscope
June 7, 2013
New 3D measuring system offers auto brightness and high-speed stitching. |
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3M announces QDEF; to bring 50% more color to LCD devices
May 21, 2013
3M announced today it is in the final stages of scale-up for its new 3M Quantum Dot Enhancement Film (QDEF). The new film allow...
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COMSOL Multiphysics 4.3b offers new additions to simulation platform
May 16, 2013
COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL s...
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