Multitest VP to discuss quality in 3D assembly at SEMICON West
06/18/2013
Multitest’s James Quinn will present during the 2013 SEMICON West exhibition and conference, scheduled to take place July 9-11, 2013 at the Moscone...
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EVG and Dynaloy develop single-wafer cleaning solution
06/17/2013
Single-wafer cleaning solution is suitable for 3D-IC/TSV, advanced packaging, MEMS and compound semiconductor applications. |
SEMI releases report on first quarter 2013 manufacturing equipment billings
06/11/2013
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.31 billion in the first quarter of 2013. |
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Bosch and STM hold joint honors as No. 1 MEMS suppliers for 2012
06/11/2013
For the first time ever, no clear winner has emerged to claim top honors in the MEMS business for 2012, with Bosch of Germany and French-Italian ST...
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Alchimer to collaborate with imec on advanced nano-interconnect technologies
06/11/2013
In an industry where finer features are driving market needs, current deposition processes are no longer sufficient to address challenges like inte...
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Necessary attributes of a MEMS engineer for new product development
06/10/2013
In the development of new MEMS products, the team is the most important factor. |
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"Generation Mobile": Advanced Packaging Technology at SEMICON West
06/06/2013
Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form ...
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OSHA cites Carson Helicopters Inc., of Perkasie, for safety violations
Carson Helicopters Inc. of Perkasie has been cited by the U.S. Labor Department's Occupational Safety and Health Administration (OSHA) for eight al...
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Could drones become 1st line of defense against pipeline leaks?
Though so-called drones have been at the center of recent controversies over U.S. military policy decisions, unmanned aircraft may have a far more ...
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NEC Display Introduces New PH1400U Digital Projector
NEC Display Solutions of America, a provider of commercial LCD display and projector solutions, announced the new PH1400U digital projector with 3-...
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Escort Adds New Flagship Radar Detector
The Passport Max, which is shipping at a suggested $549, uses digital signal processing (DSP) technology said to allow the detector to lower backgr...
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Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other...
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Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner...
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Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...
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450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
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Innovation in Semiconductor Manufacturing Instrumentation
As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...
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All-in-one microscope for advanced imaging, recording and measurement
June 7, 2013
Building on its extensive microscope lineup, KEYENCE Corporation has released a new multipurpose microscope. |
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Olympus launches LEXT OLS4100 laser confocal microscope
June 7, 2013
New 3D measuring system offers auto brightness and high-speed stitching. |
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3M announces QDEF; to bring 50% more color to LCD devices
May 21, 2013
3M announced today it is in the final stages of scale-up for its new 3M Quantum Dot Enhancement Film (QDEF). The new film allow...
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COMSOL Multiphysics 4.3b offers new additions to simulation platform
May 16, 2013
COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL s...
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