Cooling Thin Consumer Electronic Devices
Today’s modern electronic devices are more dense and capable than ever before. Cooling these devices is important not only for the reliability and stability of the electronic circuitry, but also for the comfort of the user and the integrity of the display technology. System-on-chip (SOC) technology has aggregated the functionality of many disparate devices into fewer monolithic circuits. ...
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Delivering Optimized High Performance Computing Through Advanced Interconnects
The most important element in the microelectronics performance, be it low power, electrical performance or reliability, is the interconnect from the chip to the package. As the power to drive the signal is reduced to meet thermal performance and extend battery life, the interconnect has to be short, highly conducting and reliable. The wire-bond cannot be used for high IO and high performance; e...
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The Coolest Compounds
Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today’s electronic circuitry. In tandem with the great growth of the technological sector comes the need for a new generation of innovative, highly advanced solutions capable of reliable performance in the ever increasing temperatures of electronic devices. Master Bond’s...
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Keeping Packages Cool and Reliability High
May 2, 2012
Ever-increasing functionality and ever-decreasing device footprints have presented semiconductor packaging manufacturers with quite a dilemma: how to manage the dimensional demands without exceeding thermal limits. As advanced devices get packed with greater function in a smaller space, operating temperature levels increase. If the temperatures are too high, package - and therefore product - re...
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Enabling Thinner Packages through Novel Materials Innovations
October 31, 2011
According to a new industry report, thinned wafers will comprise the majority of wafers in the device market by 2016. (1) The study indicates that memory and logic chips will account for the largest percentage of thinned wafers used, with memory stacks projected to be packaged at 25 microns thick in just four short years. Wire bonding will also remain a dominant technology, says the report, but...
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Powering The Solar Revolution
October 18, 2011
Powering the Solar Revolution Resource CD Agilent powers the solar revolution with industry leading solutions and technical/application knowledge. Order Agilent’s Powering the Solar Revolution CD and access application notes, technical articles, recorded presentations, video demos and product/solution information at your fingertips. Learn More. Sponsored by
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