GT Advanced Technologies today announced that it has acquired substantially all of the business of Thermal Technology LLC for purchase consideration.

Researchers at the University of Illinois at Chicago have developed a way to introduce precisely four copper ions into each and every quantum dot.

Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision micromachining applications.

The LED industry gained a foothold for growth in the parts and materials industry after LED technology was applied to the TV backlight unit (BLU).

The 59^th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking original work in microelectronics research and development. The paper submission deadline is Monday, June 24, 2013.

Semiconductor and LED manufacturers are interested in automating the film frame handling process as a means to increase throughput and yield in their BEOL processes. BOB FUNG and JACK YAO, Owens Design, Fremont, CA

Yole Développement announced its new report "UV LEDs: Technology & Application Trends" which presents UV LED new applications and associated market metrics for the period 2012-2020, and a deep analysis of UV LED technology and UV LED lighting industry.

At the International Semiconductor Strategy Symposium (ISS Europe), the European semiconductor industry affirmed its ability to innovate.

After reaching a worrisome high in the third quarter of 2012, global semiconductor inventories held by chip suppliers fell at a surprisingly fast rate in the fourth quarter, led by dramatic reductions for market leader Intel Corp.

Rensselaer Polytechnic Institute student Ming Ma has developed a new method to manufacture light-emitting diodes (LEDs) that are brighter, more energy efficient, and have superior technical properties than those on the market today.

Engineered Material Systems debuted its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.

Hitachi Cable, Ltd. announced today that it has developed a new mass-production technology for GaN-templates, in which a high-quality gallium nitride (GaN) single-crystal thin film is grown on a sapphire substrate.

Demand for 4-inch or larger AMOLED panels has continued to increase in the fourth quarter of 2012 thanks to strong growth in the market for high-end smartphones with large screens, such as the Galaxy S and Note series by Samsung Electronics.

The critical processes and technologies necessary to continue Moore’s Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing.

AG Semiconductor Services today announced that Michael (Mike) Mardesich has joined the company in the role of senior director of sales.

Recent progress in the engineering of plasmonic structures has enabled new kinds of nanometer-scale optoelectronic devices as well as high-resolution optical sensing.

In recent years, TFT-LCD technology has dominated the display panel market, everything from small, medium and large screens, to the point where all other rival display technologies such as e-paper, PDP, and CRT have steadily been losing their positioning.