LED PACKAGING & TESTING NEWS

Indium expands electronics materials manufacturing with new facility in NY

May 22, 2012

Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.

Dow acquires LED phosphor technology IP in Lightscape Materials buy

May 16, 2012

Lightscape Materials offers IP in specialty phosphor technology, which Dow will add to its LED technologies portfolio. Lightscape co-founders Gerard Frederickson and Yongchi Tian will join Dow’s LED Technologies team.

Kulicke & Soffa expands Singapore HQ, bolsters bonder tool R&D and manufacturing

May 16, 2012

Kulicke & Soffa broke ground on its Singapore global headquarters expansion, near the current leased headquarters location. A state-of-the-art facility in Serangoon will bolster the company’s R&D and manufacturing capabilities, and host service and support functions.

The low utilization/MOCVD uptick phenomenon, LED efficacy and price, more from Lightfair

May 14, 2012

Barclays Capital analysts attended Lightfair International and gleaned several trends in LEDs and OLEDs for lighting, including an interesting phenomenon around MOCVD utilization rates and new orders.

GE integrates LED thermal management for 100W bulb within A-19 form factor

May 9, 2012

GE’s 27-watt Energy Smart LED bulb is in a standard “A-19” bulb shape, manufactured with a proprietary synthetic jet technology enabled by Nuventix’ collaboration.

LED efficiency boosted by quantum dot and formic acid combo

May 9, 2012

Vanderbilt University researchers have used formic acid to develop white-light quantum dots' fluorescent efficiency to 45%, enabling UV LED efficiency of 40 lumens/watt.

LED maker SunSun Lighting raises $30M from investors

May 9, 2012 SunSun Lighting, a provider of high-performance, energy-efficient and low-cost LED lighting technologies, received $30 million in Series B financing from GSR Ventures and Oak Investment Partners and additional commitments from its original angel investors. Allan Kwan, a China-based advisor for Oa...

HB-LED makers drive economic improvement with alternative substrates, automation, and yield

May 8, 2012

SEMI’s Paula Doe covers the “commodity market” of LEDs, including capacity utilization at LED fabs, automation in manufacturing that could improve yields, LEDs fabbed on silicon and GaN instead of sapphire wafers, and more.

Lower-cost LED backlights darken CCFL's future

May 7, 2012

Low-cost direct LED-backlit LCD TVs were introduced in March 2011, targeting share in the entry/mainstream LCD TV market currently dominated by CCFL-backlit TVs. They will eliminate CCFLs by 2014, says DisplaySearch.

SATS provider Carsem begins LED packaging and test

May 4, 2012

Semiconductor packaging and test services provider Carsem will assemble and test LED packages, partnering with a key customer and applying semiconductor packaging technologies for better LEDs.

Intematix remote phosphor enables 100W-equivalent LED bulbs

May 3, 2012

Intematix debuted ChromaLit Contour remote phosphor architecture. ChromaLit Contour is shaped to enable internal and external convection airflow, cooling LEDs in 60, 75 and 100W-equivalent omni-directional lights.

Cree LED test suite TEMPO 24 incorporates IES LM-79

May 1, 2012

Cree Inc. added TEMPO 24 tests to its Cree Services for LED luminaires. TEMPO 24 combines the IES LM-79-08 photometric test with nearly a dozen other LED performance tests.

What have we done for you lately?

May 1, 2012 This page is usually reserved for a guest editorial by someone in the industry that wants to rant a little bit about the lack of standards in any given area, the need to get young students interested in engineering and the sciences, why fab safety is so important, or answering the call to innovat...

LED manufacturer Lumichip expands in Finland, opens development center

Apr 27, 2012

Lumichip Limited, an LED manufacturer, expanded its commercial operations in Finland and opened a new development center in Espoo, Finland.

Ultratech brings former member back to Board

Apr 19, 2012

Ultratech, lithography and laser-processing system supplier to semiconductor manufacturers and packaging providers, added Michael C. Child to its Board of Directors. Child served on Ultratech’s Board in the 1990s.

Intematix remote phosphor targets high-lumen small-size LED lights

Apr 16, 2012

Intematix released ChromaLit XT remote phosphor technology for high-lumen LEDs in small form factors, enabling blue LED packages instead of binned white LEDs.

Cree LED achieves 254 lumen/watt on SiC, optimized chip/packaging tech

Apr 13, 2012

Cree Inc. (Nasdaq:CREE) achieved 254 lumen/watt on a white-light, power LED in research. The correlated color temperature is 4408 K.

SABIC LED resins offer improved color under heat exposure

Apr 4, 2012

SABIC’s Innovative Plastics business released 3 Lexan LUX resin grades for LED applications such as light guides and lenses. They are transparent and use a new formulation to improve initial color, color stability, and light transmission during heat aging.

Low cost AlN substrate technology for HBLED and power semiconductors

Apr 1, 2012

A technology has been developed that allows A1N to be sintered at lower temperatures. This allows the material to be sintered and flat fired in a continuous furnace very similar to furnaces used for alumina. Jonathan Harris, CMC Laboratories, Tempe, AZ

Driving down HB-LED package costs

Apr 1, 2012

Griff Resor, Resor Associates,

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