LED PACKAGING AND TESTING
MAGAZINE
05/01/2013
Volume 56, Issue 3
LED BLOG
LED PACKAGING & TESTING ARTICLES
LED ingot market to reach $325M by 2015
05/07/2013
The LED industry gained a foothold for growth in the parts and materials industry after LED technology was applied to the TV backlight unit (BLU).
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Samsung introduces new, high efficacy chip on board LED packages
04/22/2013
Samsung Electronics Co., Ltd. announced today that it is introducing a new 129lm/W high efficiency, chip-on-board (COB) family of LED packages, LC0...
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Plessey is first to release GaN on silicon LEDs
04/08/2013
Plessey today announced that samples of its Gallium Nitride (GaN) on silicon LED products are today available. These entry level products are the f...
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University of Cambridge researchers seek to further reduce cost and improve efficiency with GaN LEDs
04/05/2013
A new £1million (or US$1,530,700) growth facility will allow University of Cambridge researchers to further reduce the cost and improve the efficie...
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Samsung launches Zhaga-compliant LED linear modules with 145lm/W efficacy
04/04/2013
Samsung Electronics Co Ltd of Seoul, South Korea has introduced a new lineup of Zhaga-compliant LED H-Series linear modules with high efficacy and ...
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Veeco MOCVD chosen for CEA-Leti and Aledia’s new nano-LED venture
04/03/2013
Veeco Instruments Inc. announced today that CEA-Leti, a research lab based in Grenoble, France, has selected Veeco’s TurboDisc K465i Metal Organic ...
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HEADLINES
ON Semiconductor Introduces Industry Leading, Best in Class System Level Performance Expansion to IGBT Portfolio
New IGBT devices expand current ratings and deliver efficient, high-speed switching capabilities for power applications such as UPS, hot pots, rice...
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Weak PC sales slow semiconductor market
Weak sales of PCs, mobile phones and digital televisions (DTVs) have led to declining revenue in the worldwide semiconductor market, according to I...
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Production of Cassava Chips, Pellets for Exports
The purpose of this write-up is to educate/enlighten Nigerians and potential investors on the commercial viability of cassava chips and pellets pro...
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-ON Semiconductor Introduces Industry Leading, Best in Class System Level Performance Expansion to IGBT Portfolio
ENP Newswire - 17 May 2013Release date- 15052013 - Power Conversion Intelligent Motion, NUREMBERG, Germany - ON Semiconductor (Nasdaq: ONNN), drivi...
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-Imec and Renesas collaborate on ultra-low power short range radios
ENP Newswire - 17 May 2013Release date- 16052013 - Leuven (Belgium) - Imec and Renesas Electronics Corporation, a premier supplier of advanced semi...
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FINANCIAL
TECHNOLOGY PAPERS
Rapid Defect Indentification with Layout-Aware Diagnosis
Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other...
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Flip Chip Devices get Flat and Happy
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner...
Sponsored by
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Automated Test Creation for Mixed Signal IP using IJTAG
The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and co...
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WEBCASTS
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...
Sponsored by
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450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
Sponsored by
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Innovation in Semiconductor Manufacturing Instrumentation
As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...
Sponsored by
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VIDEOS
EVENTS
2013 IEEE International Electron Devices Meeting (IEDM)+1 301 527 0900 ext. 103
+1 301 527 0994
December 6, 2013
- December 13, 2013
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2013 IEEE 44th Semiconductor Interface Specialists Conference (SISC)+1 512 471 8560
December 4, 2013
- December 7, 2013
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Materials Science & Technology 2013 Conference & Exhibition |
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2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS) |
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2013 IEEE Bipolar/BiCMOS Circuits and Technology Meeting - BCTM+1 781-937-1535
+1 781-937-1702
October 7, 2013
- October 10, 2013
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2013 IEEE International SOI Conference |
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2013 European Microwave Integrated Circuit Conference (EuMIC) |
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2013 IEEE Compound Semiconductor Integrated Circuits Symposium (CSICS)+1 978-684-5435
October 6, 2013
- October 9, 2013
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FEATURED PRODUCTS
