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Soldering Articles
New Solders and Soldering Products (Oct 20, 2009)

Following are the new solders, fluxes, reflow ovens and profilers, wave soldering systems, conveyors, rework tools, and more for reliable, repeatable soldering by hand, selective soldering system, wave, or reflow oven.

A Shift in the Perception of Reflow Profiling (Oct 13, 2009)

Paul Austen, ECD, explains why information gathering and reflow profile characterization can be wasted practices without the verification step to maintain proper oven operation. Reflow oven profiles can be out of spec due to flux residue build up, belt speed changes, and other small changes that deliver significant alterations to the assembly being processed.

Applied Research within Universities for SMT Industry Competitiveness (Sep 14, 2009)

S. Manian Ramkumar, Ph.D., Center for Electronics Manufacturing and Assembly, Rochester Institute of Technology (RIT), discusses recent industry-university collaborative research on PoP, QFN, and mixed lead-free alloy SMT processing.

Parallel Processes: Simultaneous Lead and Lead-free Soldering with a Single Reflow System (Sep 8, 2009)

With many electronics manufacturers still running leaded and lead-free assembly jobs, reflow ovens are tasked to run both solder-type profiles. Hans Bell, Ph.D., of Rehm Thermal Systems, shows how implementing both processes simultaneously with a single reflow soldering system can be approached with leaded and lead-free reflow profiles set up next to each other within a thermal system with two conveyor lanes.

Combining Tin/Lead and Lead-free: A 5 Step Hybrid Manufacturing Process (Aug 27, 2009)
Scott Mazur, Benchmark Electronics
The RoHS transition has impacted the entire electronics industry. Supply chain management is challenging, with only RoHS-compliant parts being offered and new classification for PCBAs. Hybrid printed circuit assemblies (PCAs) use tin/lead solder and contain lead-free plastic BGAs or other lead-free components. Maximum reflow temperatures for the leaded and lead-free components often require reflow profile controls.
Surface Mount Technology Industry News
Terepac, IMEC Partner for Low-cost Flexible Electronics (Oct 22, 2009)

Terepac Corporation and research center IMEC will collaborate on novel packaging technologies for flexible electronics. The initial driver for this shared research is a next-generation wireless ECG system, developed in the Human++ Program at Holst Centre, Eindhoven.

To Reduce E-Waste, Slow the Pace of Electronics Launches (Oct 19, 2009)

Americans buy new cell phones every 18 months; Europeans buy them every 15 months; and the Japanese every 9 months. Global replacement rates for digital cameras range between two and three years. And U.S. businesses replace their PCs every four years. Where do most of these used products go? Directly into the trash. Indeed, in the United States alone, consumers throw away 400 million electronic products each year, according to a report by the Stanford Graduate School of Business.

Flextronics to Build Suzhou, China Facility to Support Computing Manufacturing, R&D (Oct 16, 2009)

In a signing ceremony held today with Suzhou Wuzhong Economic Development Zone and Jiangsu Wuzhong Export Processing Zone, electronics manufacturing services (EMS) provider Flextronics (Nasdaq: FLEX) announced it will expand its presence in China through the development of a new facility in Wuzhong. The facility will support the growing demand for computing products in China and will include a design center and extended manufacturing capabilities in the Wuzhong Export Processing Zone (WEPZ). The design center will be completed by the end of 2009 and the manufacturing facility is expected to be completed by the end of 2010.

Kyzen Equips Application Laboratory in Penang, Malaysia (Oct 14, 2009)

Cleaning products provider Kyzen plans to add an applications laboratory in its new Penang, Malaysia sales and support office.

ECT, ScanCAD Partner on Process Management Work Instruction Software (Oct 14, 2009)

Everett Charles Technologies (ECT), a Dover Company, finalized a strategic partnership with ScanCAD International, a global supplier of process management tools. This partnership provides for ScanCAD International to exclusively distribute and support the ProWorks process management work instruction software family of products globally within the electronics industry.

Current Issue
SMT
Volume 23, Issue 5
September 2009
Soldering Videos
The A-Line at IPC Midwest produces a PCB assembly with jet solder printing, dual-head pick-and-place, reflow, and depanelization.; Assembly; cab; ipc; IPC Midwest; Juki; Mydata; Senju; smt; The Morey Corp; Al Cabral, marketing manager, VJ Electronix, demonstrates solder rework and X-ray inspection with the company's new machines.; 2D X-ray; manual inspection; rework; VJ Electronix; X-ray inspection; Ed Zamborsky, regional sales manager, OK International, shows solder paste/flux/adhesive dispensers, soldering stations, and the basics of hand soldering.; adhesives; dispensing; flux; hand soldering; OK International; Oki; solder paste; Keith Howell and Masato Nakamura of Nihon Superior discuss the halogen-free solder products debuting at SMTAI. Nihon?s SN100C lead-free solder is the base of this product line.; alloys; dopants; intermetallic layer; lead-free; Nihon Superior; sac; solder; solder paste; Gene Dunn, Panasonic Factory Solutions of America, examines thin-die packaging issues that EMS providers will need to consider in board layout for bend possibilities, pick-and-place systems for picking force, and reflow for overheat concerns. ; board design; Fragile Components; Fragile Packages; Miniaturization; panasonic; pick-and-place; reflow; smt; Thin Die; Rick Short, director of marketing and communications at Indium Corporation, talks about lead-free rework and solar cell manufacturing's materials requirements.; indium; lead-free; photovoltaics; rework; SMTAI; solar cells; solder; Steve Pollock, sales manager at Essemtec, demostrates the printer, pick-and-place, and lead-free convection reflow oven that comprise their turnkey line.; complete line; Essemtec; lead-free reflow; manufacturing line; pick and place; printer; reflow; SMTAI; turnkey manufacturing; Rob DiMatteo introduces BTU's smaller lead-free-capable reflow system, as well as a high-volume 12-zone model, and new lane options for existing systems.; BTU; conveyors; ems; high-volume; lead-free; medical; Military; reflow; SMTAI; Paul Salmon, Balver Zinn, explains the global alliance for the SN100C lead- and silver-free solder alloy, shared with Nihon Superior and other partners. ; Balver Zinn; lead-free solder; Nihon Superior; sac; SMTAI; SN100C; tin-free solder; Brian Toleno, Ph.D., Henkel, describes the FF6000 material -- an epoxy flux and adhesive for innovative electronics assembly.; apex; conductive adhesive; epoxy; flux; Henkel; soldering materials; Tom Nash of BTU discusses reflow trends in nitrogen, process control, and COO.; Josef Jost, Balzer Zinn, parent company of Cobar, explains the XF3 flux medium for SAC, SN100C, and tin/lead alloys.; apex; Balver Zinn; Cobar; flux; lead-free; sac; SN100C; solder; tin/lead; Chris Underhill of Finetech provides rework advice for challenging package and PCBA applications.; 01005; apex; BGA; Finetech; packaging; repair; rework; stacked die; Erik Bergum, Heraeus, tells us about their ball-dippable paste, developed with TI to replace tacky fluxes in solder sphere placement.; apex; ball-dippable paste; flux; Heraeus; solder powder; solder spheres; Mark Dalderup, Rehm, discusses his company's international goals and their vapor-phase reflow products, including a vacuum system to prevent voids.; apex; reflow; Rehm Thermal; solder joints; vapor-phase; voids; Vincent Whipple, Sono-Tek, demonstrates the ultrasonic atomiztion technology behind spray fluxing.; apex; Fluxing; Sono-Tek; Spray Flux; Ultrasonic Atomization; Bennet Bruntil tours EVS's solder recovery technology under the hood of the system.; Solder and equipment suppliers provide live demos of dross recovery, wave and reflow soldering, selective soldering systems, rework & repair capabilites, and next-generatiosn leaded and lead-free solder and flux materials.
Surface Mount Technology White Papers

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Sustainability Commitment A Key Driver for Product Development
There's a lot of talk about sustainability these days. While some firms have truly embraced a plan to drive toward more environmentally responsible products and ...
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Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers
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SMT Blog
SMT Magazine
by SMT Magazine

SMT Magazine's editorial team discusses industry events, trends and important news for electronics manufacturers, IDMs, OEMs and related companies.

IPC Midwest: Friends, Fellowship, and Live SMT Assembly

It was a better-than-expected IPC Midwest tradeshow and conference in Schaumburg, IL this September. The A-Line live electronics assembly line attracted interest as each piece of automated equipment performed its task to build a mixed-assembly board with...

25 Years of SMT, and 25 More

At the SMTA’s 25th anniversary dinner, held during SMTA International in San Diego, Ken Gilleo, Ph.D., ET-Trends LLC, demonstrated the reliability of a decades-old flex circuit by throwing the assembly against a wall. He turned it on, and it worked. This...

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