These new products include vision sensors and systems, improved AOI machines, measurement and surface analysis products, programming environments, and other inspection tools.
ITM Marketing released a report providing a comprehensive analysis of the automated optical inspection (AOI) system offerings for the electronics assembly industry.
Several inspection companies debuted new models at productronica 2009 in Munich, Germany, with traditionally solder paste inspection (SPI) companies entering the automated optical inspection (AOI) market, and vice versa. While inspection companies have steadily pushed for optical inspection earlier in the SMT assembly line (pre-reflow), this move was markedly widespread, with Koh Young, Mirtec, Marantz, Viscom, and others looking to capture market share outside of their core inspection sector.
JTAG Technologies released JTAG Live; Surface Mount Technology Corp debuted the SMART platform; Pickering Interfaces introduced RF Matrix LXI switches; Vi TECHNOLOGY upgraded its inspection offerings; Marantz entered solder paste inspection (SPI); and ASSET debuted IC test.
The SMTA and Auburn University (Auburn, AL) will jointly host the AIMS (Automotive, Industrial, Military and Space) Harsh Environment Electronics Symposium October 25-26, 2010. Dr. John Evans, Conference Chairman and the program technical committee invites industry and academia to submit an abstract to participate in the program. The symposium will focus on harsh environments with an emphasis on military and space.
Koh Young Technologies Inc., solder paste inspection (SPI) and automated optical inspection (AOI) systems provider, is relocating and expanding its Seoul headquarters to a new, larger building in February.
Complacency with having survived the trials of 2009 is a naïve posture that, in 2010, will lead to continued struggles, warns Walt Custer. The noted industry analyst and president of Custer Consulting Group will join IPC director of market research Sharon Starr for the Global Business Outlook: Where Do We Go Next? keynote session at IPC APEX EXPO on Wednesday, April 7 in Las Vegas.
Siemens Electronics Assembly Systems (SEAS) completed its five-stage SIPLACE SX Road Show of North America in January of 2010. More than 200 visitors from 60 different companies attended the show. The SIPLACE Team performed more than 100 live placement system gantry upgrade demonstrations during the four-month tour.
Although the global electronics contract manufacturing industry is set to return to growth in 2010 after a painful 2009, the market still faces major uncertainties this year, according to iSuppli Corp.
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New Lead-Free Alloy that Takes Under-the-Hood Heat in Stride-Innovative Formulation Provides High Reliability for High-Temp Applications
While lead-free processes now seem like yesterday’s news and the electronics industryat large has generally accepted and commonly uses the SnAgCu (SAC) alloy, ... Sponsored By:
Henkel Corporation
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Using Hansen Space to Optimize Solvent Based Cleaning Processes
What is an optimized cleaning process? Is it based solely upon removing the residue, or is it more? Of course it is more. We do not want to remove the labels or ... Sponsored By:
Austin American Technology Corp.
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Using Hansen Space to Optimize Solvent Based Cleaning Processes
What is an optimized cleaning process? Is it based solely upon removing the residue, or is it more? Of course it is more. We do not want to remove the labels or ... Sponsored By:
Austin American Technology Corp.
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Tightening Up Type 4
Though the majority of assemblers are using Type 3 solder paste for most of today’s mainstream applications, the prevalence of finer-pitched devices is growing. ... Sponsored By:
Henkel Corporation
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SMT's editorial team discusses industry events, trends and important news for electronics manufacturers, IDMs, OEMs and related companies.
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Now accepting entries for the 18th Annual SMT VISION Awards, recognizing innovation across the electronics manufacturing industry. | ||
