Test program set (TPS) migration solutions address the problem of legacy automated test equipment (ATE) systems that support validation of military/aerospace systems experiencing end of life (EOL) issues. Robert Peet, SEICA, will review a cross section of ATE systems from both a hardware and software perspective, with specific emphasis on the challenges and solutions for test program sets using LASAR™ simulation. Migrating existing TPS from legacy systems* to current technology can be done at considerably reduced time and cost with modern TPS software migration tools. These allow for easy conversion and migration of functional test (FT) programs, with minimal debug. By retaining features such as guided probe, fault dictionary, and many others, test programs developed as far back as the 1970s are easily ported to state-of-the-art testers without losing functionality. Legacy programs can also be enhanced (post-migration) with new software tools. Modern migration tools, combined with hardware advances, can improve test coverage and diagnostic capabilities.
In Part I of this article, we asked test and inspection equipment providers for their perspectives on equipment evolution and contemporary challenges. In Part II, we ask what test and inspection customers want from their equipment, and look at examples of difficult test/inspection problems and how to solve them.
These are the new advances in flying probes, in-circuit test (ICT), AOI, test contactors and probes, boundary scan, and more test and inspection systems.
Automated X-ray inspection (AXI) is a standard quality control tool for inspection of hidden solder structures. Tobias Neubrand, Ph.D., GE Sensing & Inspection Technologies GmbH - phoenix|x-ray Systems + Services Inc., explains the capabilities necessary on X-ray systems to meet current and future zero-defect quality standards.
Lean manufacturers are relying on automated inspection equipment (SPI/AOI/AXI) to streamline the manufacturing process and provide real-time root cause analysis of manufacturing defects. The objective is to increase profitability through improved production yields and reduced costly rework. Brian D’Amico, MIRTEC Corp., reviews the types of SPI and AOI technology, and how to choose and implement inspection machines.
productronica 2009 will take place November 10–13 in Munich, Germany. Following are more new and flagship products to see at the electronics manufacturing tradeshow, not featured in our Productronica Show Preview: Materials, Productronica Show Preview: Equipment, or productronica 2009: Product Showcase.
productronica 2009 will take place November 10–13 in Munich. The productronica 2009 Website now offers articles, webcasts, and podcasts with commentary and helpful opinions from world experts in a number of disciplines.
IPC announced the September findings from its monthly North American PCB Statistical Program. “We’re finally starting to see the turnaround in the September numbers for the North American PCB industry,” said IPC president Denny McGuirk. “Both rigid PCB and flexible circuit sales and orders are up by double digits compared to August. Rigid PCB sales and orders are still below September of last year, but the rate of decline is shrinking. Flexible circuit business is ahead of September last year. The most promising indicator is the book-to-bill ratio at 1.08,” he added. “It has been above parity for five consecutive months.”
Slumping mobile phone sales, excess network capacity and the protracted death of traditional telecom technology have greatly undercut the demand for communication equipment this year, according to the Henderson Ventures Forecast Summary. Heated price competition in both the handset and network equipment sectors has amplified the downturn. Much of the price pressure has come from two upstart Chinese equipment manufacturers: Huawei and ZTE, which collected substantial market share during the last few years.
Zurvahn is affiliated with Celestica and has formed a strategic alliance that allows Celestica to use Zurvahn’s Business Centers.
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