Table of ContentsFeaturesSurvey: Soldering Equipment and Materials UpdatesSMT surveyed soldering equipment manufacturers and solder suppliers to learn more about the latest practices and requirements.
BGA Mezzanine Connectors Boost YieldsA high-speed BGA mezzanine connector was developed to improve process-friendliness, replacing a thermally massive, bulky design with a three-piece, SMT-assembly-friendly design that is easier to solder and rework.
Spend Less Time at First Board InspectionEMS providers can save money and time at the FAI process step. FAI is a critical step in the assembly process, yet it is prone to errors, little documentation, and time wastes.
ColuimnsEditor's ViewSMT Recognizes the Vision of an Industry LeaderEvery year for more than 15 years, SMT has celebrated innovative and cost-saving new products for electronics assembly with the SMT VISION awards program.
SMT AdvisoryPart 11: Lead-free System Reliability - Power of Metallurgy ContinuedThe performance of lead-free solders strictly follows solder metallurgy. Here, we look at the core values at play for two common lead-free solder alloys: tin/silver/copper (Sn/Ag/Cu – SAC) and tin/copper (Sn/Cu).
EU's RoHS 2 on the HorizonIn a climate of REACH, RoHS, and China RoHS, RoHS 2 looms right around the corner.
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