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Facility Management Articles
iPhone and Competitive Products to Spur NAND Flash Undersupply in 2010 (Feb 19, 2010)

Thanks to its huge sales and high memory usage, Apple Inc.’s iPhone is expected to generate insatiable demand for NAND-type flash memory in 2010, helping to strain supplies for the year, according to iSuppli Corp.

ESD in 201x: What Will the Decade Bring? (Feb 16, 2010)

Jeremy Smallwood, Ph.D., Electrostatic Solutions Ltd.; Charvaka Duvvury, Ph.D., Texas Instruments; and Harald Gossner, Ph.D., Infineon, discuss electrostatic discharge (ESD) control and packaging changes in the next decade. As we enter 2010, ESD control in electronics manufacture may seem like a mature and little-changing area. However, driven by advances in technology and process needs, ESD control practice and standardization will continue evolving throughout the coming decade.

EMS Firms Challenge PV Solar Module Manufacturing Value Chain (Feb 11, 2010)

Alfonso Velosa, Gartner analyst, considers the major advantages EMS providers bring to solar module manufacturers, such as multi-faceted scalability and familiarity with low-margin operation.

New Cabinets, Automation Tools, Depaneling Products and Other Services for Assembly (Jan 25, 2010)

These products for odd-form and final assembly, as well as in-line automation, include lead clippers and component handlers, storage cabinets that meet MSD and ESD standards, singulation systems to depanelize PCBs, laser cutting services for thin metal parts, and more.

Surface Mount Technology Industry News
Banner Year for HB-LED; OLEDs and LEDs Also Fare Well (Mar 10, 2010)

EPIC, the European Photonics Industry Consortium, released “LEDs: The 2009 Market Review.” The report, which is distributed exclusively to EPIC members, tracks the response of the lighting and display industries to one of the most difficult economic crises in recent years. HB-LED and OLED unit production figures as well as revenues have been summarized for major players around the world for the two-year period of 2008 and 2009.

Bob Willis Intros Online Training Service for SMT Production Teams (Mar 10, 2010)

Bob Willis, a consultant who has been providing electronics assembly training over 20 years, will launch a new Website-based training service.

EMS Provider Lightspeed Expands to New Manufacturing Facility (Mar 9, 2010)

Lightspeed Manufacturing has moved from its old factory in Methuen, Mass. to a new 60,000-sq-ft modern manufacturing facility at 135 Ward Hill Avenue in Haverhill, MA. Lightspeed is a contract manufacturer of printed circuit electronics assemblies that has experienced continued growth.

IPC APEX EXPO 2010: Exhibits Preview III (Mar 9, 2010)

IPC APEX is coming up April 6–9 at the Mandalay Bay Convention Center in Las Vegas. This preview includes cleaner chemistry from Kyzen; test systems from Digitaltest, atg, and Seica; selective soldering systems from Juki and Seica; cleanliness test systems from Gen3 and Ascentech as well as Austin American Technology; process control from ProWorks and Microscan; reflow profiling from KIC; halogen-free solder from Indium; assembly systems from Siemens and Juki; and spray fluxing from Sonotek.

New Edition of IPC Market Data Update Shows Continuing Recovery in Electronics Supply Chain, Production (Mar 8, 2010)

IPC released the winter 2010 edition of Electronics Industries Market Data Update, which offers proof of a continuing economic recovery. The IPC Index of North American Electronics Industry Performance rose dramatically from -18.3 in the third quarter of 2009 to -5.5 in the fourth quarter. The Index is a new business indicator that reflects trends in sales performance from all key segments of the electronics interconnect supply chain.

Surface Mount Technology Webcasts

Upcoming Webcasts

Lead-Free/RoHS Materials for Printed Circuit Board Manufacturing
Since most EMS companies are making leaded and lead-free products, inventory and compliance management has become an increasingly time-consuming effort, with inventory ...
(Mar 16, 2010 12:00 PM CDT / 5:00 PM GMT)
Sponsored by: 
Henkel
Ticona

On Demand Webcasts

RoHS Lead-free Electronics Manufacturing
As electronics manufacturing firms move into lead-free assembly, the practical issues play an ever-growing role in determining how well RoHS compliance can become ...
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Current Issue
SMT
Volume 24, Issue 1
January 2010
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Facility Management Videos
Lee Smith, VP of business development at outsourcing semiconductor assembly and test (OSAT) provider Amkor Technology, was instrumental in developing the package-on-package (PoP) stack.; AmKor; Lee Smith; package on package stack; Pop; Sats; David Geiger, Flextronics International, explains how EMS assemblers implement new packages in their processes.; Bare Die; ems; Flextronics; new packages; Pop; SATS/EMS; smt; stacked packages; Rozalia Beica, 3D interconnect director at Semitool Inc. and representing the EMC3D consortium, expresses integration in packaging.; 3d packaging; packaging; Semitool; SMTAI; TSV; Scott Kennedy, senior development engineer at Rogers Corporation, looks at the potential inherent in new package substrates.; ceramic packages; ceramics; Military; packaging; SMTAI; substrates; TSV; Ritwik Chatterjee, Ph.D., speaking on behalf of the Georgia Tech Packaging Research Center (PRC), defines 1st and 2nd level integration through all-silicon interconnection.; all silicon; Georgia Tech; Package in package; Packaging Research Center; Ritwik Chatterjee; Jan Vardaman, president, TechSearch International, (Vardaman's presentation was delivered by Smith, due to a flight cancellation caused by the weather) explores thru-silicon vias (TSVs).; Jan Vardaman; packaging; SMTAI; TechSearch International; through-silicon vias; thru-silicon via; TSI; TSV; The A-Line at IPC Midwest produces a PCB assembly with jet solder printing, dual-head pick-and-place, reflow, and depanelization.; Assembly; cab; ipc; IPC Midwest; Juki; Mydata; Senju; smt; The Morey Corp; Irene Sterian, Celestica, describes her EMS company's business, and the role of manufacturing services providers in the market.; Celestica; electronics manufacturing; ems; North American EMS; Tier I; Doug Peck, AEIC, discusses industry trends, including the size of SMT components, assembly difficulty, and the effect on rework operations. ; aeic; doug peck; industry trends; Miniaturization; rework; SMTAI; Gary Tanel, SMT advisor, talks about current EMS business sales and best practices for EMS mergers/acquisitions. ; Acquisitions; advisory board; business; ems; Gary Tanel; Gary's List; Mergers; selling EMS business; SMTAI; Bob Willis, consultant and industry educator, discusses teaching techniques for new and experienced engineers. ; bob willis; Certification; SMTAI; training; Eric Beyne, Ph.D., scientific director, Advanced Packaging and Interconnect Center, Interconnect, Packaging & Systems Integration at IMEC talks to Gail Flower at Semicon West.; packaging IMEC Beyne Semicon West; Bob Doetzer, Circuit Technology, talks about certification training and their training lab. IPC certification takes place at the high-tech lab, and at customer locations, like EMS facilities and even ships.; Circuit Technology; ipc; IPC certification; land repair; operator training; rework and repair; SMTAI; training; Jane Feng, Flextronics, discusses the EMS provider's recent paper on nondestructive BGA inspection techniques. ; EMS provider; Flextronics; Nondestructive BGA Inspection; SMTAI; Tier 1 EMS; Dan Weitzman, president, Valor, talks to SMT about software's roles in electronics design and manufacturing.; data libraries; design; manufacturing; MES; process control; software; valor; In this mini-Webcast, SMT's Editorial Advisory Board shares their insights into the magazine and the industry. ; cleaning; columnists; design; lead-free; manufacturing; processing; reliability test; solder; tin/lead; Jim McElroy, iNEMI, describes the consortium's method for roadmapping and advancing electronics assembly technology.; apex; consortia; iNEMI; roadmap; Topics on the agenda include globalization, industry analysis, supply chain issues, and executive-level information. Tradeshow reviews and industry association roadmaps are presented.
Surface Mount Technology White Papers

Featured White Papers

New Lead-Free Alloy that Takes Under-the-Hood Heat in Stride-Innovative Formulation Provides High Reliability for High-Temp Applications
While lead-free processes now seem like yesterday’s news and the electronics industryat large has generally accepted and commonly uses the SnAgCu (SAC) alloy, ...
Sponsored By:  Henkel Corporation
How "Free" is Your Halogen-Free Solder Paste?
With all the talk of halogen-free in the electronics industry these days, it’s hard to believethat there is actually no official halogen-free legislation – ...
Sponsored By:  Henkel Corporation
Using Hansen Space to Optimize Solvent Based Cleaning Processes
What is an optimized cleaning process? Is it based solely upon removing the residue, or is it more? Of course it is more. We do not want to remove the labels or ...

Recent White Papers

Tightening Up Type 4
Though the majority of assemblers are using Type 3 solder paste for most of today’s mainstream applications, the prevalence of finer-pitched devices is growing. ...
Sponsored By:  Henkel Corporation
SMT Blog
SMT Magazine
by SMT Magazine

SMT's editorial team discusses industry events, trends and important news for electronics manufacturers, IDMs, OEMs and related companies.

Predicting the Future: The Interrelationship between Technology and Politics

Did you ever want to know the future? Invest in stocks that you knew would soar in value, start a venture at just the right time to take advantage of a new technology (as we did with SMT in 1986), and avoid pitfalls along the way.I’ve recently been...

No Die Code, No OEM Certification, No Service: How One Component Distributor Is Keeping Counterfeit Parts out of Your SMT Line

Fusion, an independent component distributor based in MA, recently added an Anti-Counterfeit Screening and Analysis Laboratory to its Wilmington location; and SMT toured the new facility. While the lab is full of chemicals and equipment for exposing...

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