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Lee Smith, VP of business development at outsourcing semiconductor assembly and test (OSAT) provider Amkor Technology, was instrumental in developing the package-on-package (PoP) stack.; AmKor; Lee Smith; package on package stack; Pop; Sats; David Geiger, Flextronics International, explains how EMS assemblers implement new packages in their processes.; Bare Die; ems; Flextronics; new packages; Pop; SATS/EMS; smt; stacked packages; Rozalia Beica, 3D interconnect director at Semitool Inc. and representing the EMC3D consortium, expresses integration in packaging.; 3d packaging; packaging; Semitool; SMTAI; TSV; Scott Kennedy, senior development engineer at Rogers Corporation, looks at the potential inherent in new package substrates.; ceramic packages; ceramics; Military; packaging; SMTAI; substrates; TSV; Ritwik Chatterjee, Ph.D., speaking on behalf of the Georgia Tech Packaging Research Center (PRC), defines 1st and 2nd level integration through all-silicon interconnection.; all silicon; Georgia Tech; Package in package; Packaging Research Center; Ritwik Chatterjee; Jan Vardaman, president, TechSearch International, (Vardaman's presentation was delivered by Smith, due to a flight cancellation caused by the weather) explores thru-silicon vias (TSVs).; Jan Vardaman; packaging; SMTAI; TechSearch International; through-silicon vias; thru-silicon via; TSI; TSV; The A-Line at IPC Midwest produces a PCB assembly with jet solder printing, dual-head pick-and-place, reflow, and depanelization.; Assembly; cab; ipc; IPC Midwest; Juki; Mydata; Senju; smt; The Morey Corp; Irene Sterian, Celestica, describes her EMS company's business, and the role of manufacturing services providers in the market.; Celestica; electronics manufacturing; ems; North American EMS; Tier I; Doug Peck, AEIC, discusses industry trends, including the size of SMT components, assembly difficulty, and the effect on rework operations. ; aeic; doug peck; industry trends; Miniaturization; rework; SMTAI; Gary Tanel, SMT advisor, talks about current EMS business sales and best practices for EMS mergers/acquisitions. ; Acquisitions; advisory board; business; ems; Gary Tanel; Gary's List; Mergers; selling EMS business; SMTAI; Bob Willis, consultant and industry educator, discusses teaching techniques for new and experienced engineers. ; bob willis; Certification; SMTAI; training; Eric Beyne, Ph.D., scientific director, Advanced Packaging and Interconnect Center, Interconnect, Packaging & Systems Integration at IMEC talks to Gail Flower at Semicon West.; packaging IMEC Beyne Semicon West; Bob Doetzer, Circuit Technology, talks about certification training and their training lab. IPC certification takes place at the high-tech lab, and at customer locations, like EMS facilities and even ships.; Circuit Technology; ipc; IPC certification; land repair; operator training; rework and repair; SMTAI; training; Jane Feng, Flextronics, discusses the EMS provider's recent paper on nondestructive BGA inspection techniques. ; EMS provider; Flextronics; Nondestructive BGA Inspection; SMTAI; Tier 1 EMS; Dan Weitzman, president, Valor, talks to SMT about software's roles in electronics design and manufacturing.; data libraries; design; manufacturing; MES; process control; software; valor; In this mini-Webcast, SMT's Editorial Advisory Board shares their insights into the magazine and the industry. ; cleaning; columnists; design; lead-free; manufacturing; processing; reliability test; solder; tin/lead; Jim McElroy, iNEMI, describes the consortium's method for roadmapping and advancing electronics assembly technology.; apex; consortia; iNEMI; roadmap; Topics on the agenda include globalization, industry analysis, supply chain issues, and executive-level information. Tradeshow reviews and industry association roadmaps are presented.