Lightspeed Manufacturing has moved from its old factory in Methuen, Mass. to a new 60,000-sq-ft modern manufacturing facility at 135 Ward Hill Avenue in Haverhill, MA. Lightspeed is a contract manufacturer of printed circuit electronics assemblies that has experienced continued growth.
IPC APEX is coming up April 6–9 at the Mandalay Bay Convention Center in Las Vegas. This preview includes cleaner chemistry from Kyzen; test systems from Digitaltest, atg, and Seica; selective soldering systems from Juki and Seica; cleanliness test systems from Gen3 and Ascentech as well as Austin American Technology; process control from ProWorks and Microscan; reflow profiling from KIC; halogen-free solder from Indium; assembly systems from Siemens and Juki; and spray fluxing from Sonotek.
IPC released the winter 2010 edition of Electronics Industries Market Data Update, which offers proof of a continuing economic recovery. The IPC Index of North American Electronics Industry Performance rose dramatically from -18.3 in the third quarter of 2009 to -5.5 in the fourth quarter. The Index is a new business indicator that reflects trends in sales performance from all key segments of the electronics interconnect supply chain.
Yale University scientists have developed a magnetic solder that can be manipulated in three dimensions and selectively heated. The alloy is tin/silver with iron additives that allow magnetic manipulation for selective heating, reflow location, and added strength.
The X PRIZE Foundation will partner with IL-based EMS provider MOREY Corporation to benefit the Progressive Insurance Automotive X PRIZE, a $10 million competition designed to inspire a new generation of viable, safe, and fuel-efficient vehicles.
Zestron and Heraeus optimized cleaning processes for new lead-free and leaded solder pastes; Seika introduced a printer wiper roll cleaner that eliminates waste; Zestron added 5-liter refills for its Bath Analyzer; GEN3 Systems and Ascentech debut a line of cleanliness testers; and Kyzen developed a pH-neutral aqueous cleaning product.
Reflow profiling has gained importance as SMT assemblers struggle to meet the lower-temperature reflow needs of components, and the higher-temperature needs of lead-free solder alloys. Profiling can involve a lot of guess work, wasted boards, and lost time. KIC, along with the Rochester Institute of Technology (RIT), studied the most accurate way to profile a BGA, and achieved nonlinear results. The methodology and design of experiment described here, from Brian O’Leary’s presentation to the SMTA Boston Chapter, can be applied to other profiling situations.
These new test products include functional test with temperature calibration and a new test handler from Multitest, LXI test matrices from Pickering Interfaces, ESD testers from Transforming Technologies, a test system manager from QualiSystems, new boundary scan applications from JTAG Technologies, a test socket from Aries and test socket spacer cutting from A-Laser, Agilent characterization systems, and cleanliness test upgrades from Specialty Coating Systems.
With PCBs becoming increasingly complex, unexpected assembly issues are inhibiting quality. Adding vacuum and nitrogen to reflow — whether in a new reflow oven or integrated onto an existing SMT line — offers benefits like higher quality with an economical cost and continuous operation. Raimund Faber, GM, sales & marketing, SMT Maschinen- und Vertriebs GmbH discusses the causes of voids and how these defects affect quality, and one method to eliminate them during reflow without sacrificing oven flexibility or throughput.
Matt Wuensch, Mentor Graphics, promotes collaboration across PCB design, prototype development, and electronics assembly. The more this collaboration transpires between teams, the more potential for cost savings and less potential for problems in new product introduction (NPI).
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New Lead-Free Alloy that Takes Under-the-Hood Heat in Stride-Innovative Formulation Provides High Reliability for High-Temp Applications
While lead-free processes now seem like yesterday’s news and the electronics industryat large has generally accepted and commonly uses the SnAgCu (SAC) alloy, ... Sponsored By:
Henkel Corporation
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How "Free" is Your Halogen-Free Solder Paste?
With all the talk of halogen-free in the electronics industry these days, it’s hard to believethat there is actually no official halogen-free legislation – ... Sponsored By:
Henkel Corporation
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Using Hansen Space to Optimize Solvent Based Cleaning Processes
What is an optimized cleaning process? Is it based solely upon removing the residue, or is it more? Of course it is more. We do not want to remove the labels or ... Sponsored By:
Austin American Technology Corp.
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Using Hansen Space to Optimize Solvent Based Cleaning Processes
What is an optimized cleaning process? Is it based solely upon removing the residue, or is it more? Of course it is more. We do not want to remove the labels or ... Sponsored By:
Austin American Technology Corp.
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Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers
by Brian Toleno, Ph.D., Henkel CorporationIf you've been in electronics for any length of time, the phenomenon of tin whiskers is something you've likely heard discussed ... Sponsored By:
Henkel Corporation
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Tightening Up Type 4
Though the majority of assemblers are using Type 3 solder paste for most of today’s mainstream applications, the prevalence of finer-pitched devices is growing. ... Sponsored By:
Henkel Corporation
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SMT's editorial team discusses industry events, trends and important news for electronics manufacturers, IDMs, OEMs and related companies.
