With input from top military OEMs and after months of research, the IPC Printed Circuit Board (PCB) Executive Agent Task Force has created a roadmap to assist the newly appointed Department of Defense (DoD) PCB Executive Agent. IPC Printed Board Defense Roadmap will be released at IPC’s upcoming Technology Interchange, The North American PCB Industry: It Can and Will Support the Military Market, December 9–10, 2009, in Washington, D.C.
Electronic components distributor Digi-Key Corporation redesigned its toolbar for additional customization, language preferences, country-specific search, a resources menu for training and other needs, and new search capabilities.
KIC teamed with productivity improvement software provider Valor to integrate KIC’s continuous monitoring systems directly to Valor's end-to-end software suite DynamiX.
productronica 2009 will take place November 10–13 in Munich, Germany. Following are more new and flagship products to see at the electronics manufacturing tradeshow, not featured in our Productronica Show Preview: Materials, Productronica Show Preview: Equipment, or productronica 2009: Product Showcase.
productronica 2009 will take place November 10–13 in Munich. The productronica 2009 Website now offers articles, webcasts, and podcasts with commentary and helpful opinions from world experts in a number of disciplines.
Following are design software packages and upgrades that simplify, automate, and otherwise improve PCB design, design for excellence (DfX), and other aspects of new product introduction.
Test program set (TPS) migration solutions address the problem of legacy automated test equipment (ATE) systems that support validation of military/aerospace systems experiencing end of life (EOL) issues. Robert Peet, SEICA, will review a cross section of ATE systems from both a hardware and software perspective, with specific emphasis on the challenges and solutions for test program sets using LASAR™ simulation. Migrating existing TPS from legacy systems* to current technology can be done at considerably reduced time and cost with modern TPS software migration tools. These allow for easy conversion and migration of functional test (FT) programs, with minimal debug. By retaining features such as guided probe, fault dictionary, and many others, test programs developed as far back as the 1970s are easily ported to state-of-the-art testers without losing functionality. Legacy programs can also be enhanced (post-migration) with new software tools. Modern migration tools, combined with hardware advances, can improve test coverage and diagnostic capabilities.
Mike Bixenman, Kyzen Corporation and Michael Konrad, Aqueous Technologies Corporation make an argument for removing flux residue under the quad flat pack no lead (QFN) post-rework, and present cleaning process options for meeting this cleaning challenge. The need for cleanliness under individual components increases as the spacing between connector leads decreases and power increases. The low stand-off height of QFNs traps flux between the ground pad and component leads. Flux trapped under the QFN is a reliability concern. The purpose of this research is to develop process knowledge for cleaning all flux residues from under the QFN device. The authors, representing cleaning material and equipment organizations, investigated process variables such as solder paste, cleaning agents, cleaning equipment, and wash process factors.
In Part I of this article, we asked test and inspection equipment providers for their perspectives on equipment evolution and contemporary challenges. In Part II, we ask what test and inspection customers want from their equipment, and look at examples of difficult test/inspection problems and how to solve them.
These are the new advances in flying probes, in-circuit test (ICT), AOI, test contactors and probes, boundary scan, and more test and inspection systems.
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Sustainability Commitment A Key Driver for Product Development
There's a lot of talk about sustainability these days. While some firms have truly embraced a plan to drive toward more environmentally responsible products and ... Sponsored By:
Henkel Corporation
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Using Hansen Space to Optimize Solvent Based Cleaning Processes
What is an optimized cleaning process? Is it based solely upon removing the residue, or is it more? Of course it is more. We do not want to remove the labels or ... Sponsored By:
Austin American Technology Corp.
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Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers
by Brian Toleno, Ph.D., Henkel CorporationIf you've been in electronics for any length of time, the phenomenon of tin whiskers is something you've likely heard discussed ... Sponsored By:
Henkel Corporation
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Conductive Film for RF Grounding Can Take the Heat
Historically electrically conductive interfaces have been used for RF grounding assembly applications primarily due to their performance and processing benefits.... Sponsored By:
Henkel Corporation
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New Corrosion-Resistant Conductive Adhesive for Consumer Applications Delivers Cost-efficient Alternative to Current Technologies
For nearly two decades, flip chip technology has been widely used and accepted for several mainstream and high-end applications including flat panel displays and ... Sponsored By:
Henkel Corporation
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Tightening Up Type 4
Though the majority of assemblers are using Type 3 solder paste for most of today’s mainstream applications, the prevalence of finer-pitched devices is growing. ... Sponsored By:
Henkel Corporation
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SMT Magazine's editorial team discusses industry events, trends and important news for electronics manufacturers, IDMs, OEMs and related companies.
