IPC — Association Connecting Electronics Industries will host Designers Day, April 8, 2010, at the Mandalay Bay Resort & Convention Center in Las Vegas. This full-day event focused on PCB design will be held in conjunction with IPC APEX EXPO, and will offer practical information and real-world applications in PCB design.
The SMTA and Auburn University (Auburn, AL) will jointly host the AIMS (Automotive, Industrial, Military and Space) Harsh Environment Electronics Symposium October 25-26, 2010. Dr. John Evans, Conference Chairman and the program technical committee invites industry and academia to submit an abstract to participate in the program. The symposium will focus on harsh environments with an emphasis on military and space.
Koh Young Technologies Inc., solder paste inspection (SPI) and automated optical inspection (AOI) systems provider, is relocating and expanding its Seoul headquarters to a new, larger building in February.
Complacency with having survived the trials of 2009 is a naïve posture that, in 2010, will lead to continued struggles, warns Walt Custer. The noted industry analyst and president of Custer Consulting Group will join IPC director of market research Sharon Starr for the Global Business Outlook: Where Do We Go Next? keynote session at IPC APEX EXPO on Wednesday, April 7 in Las Vegas.
Siemens Electronics Assembly Systems (SEAS) completed its five-stage SIPLACE SX Road Show of North America in January of 2010. More than 200 visitors from 60 different companies attended the show. The SIPLACE Team performed more than 100 live placement system gantry upgrade demonstrations during the four-month tour.
These new products include circuit design software, free evaluation kits, and a Website that connects designers and suppliers.
Military and other high-reliability PCBs are cleaned after reflow because of the crucial nature of electronics performance in the field. Why then, with reliability an expected trait of most electronics devices in consumer and commercial applications, does clean not automatically correlate to reliable outside of the military sector? The bigger question, according to Michael Konrad, Aqueous Technologies, is what happens if your product fails. Residues — flux, oils, trapped moisture —are more harmful than ever.
Tin (Sn) whiskers are extremely thin metal filaments, 1 to 3 µm in diameter, that grow from tin metal surfaces as straight, kinked, or even spiral single crystals of Sn. Field failures due to tin whisker growth have occurred in the highest reliability applications, as well as high-volume consumer ones. Lead-free solder and finer pitches are increasing the risk of failures caused by tin whiskers. Laura Turbini, Ph.D., provides updates on the latest whiskers studies.
Siemens announced the SIPLACE SiCluster Professional software to optimize placement machine set up; Manncorp introduced 7700-FV prototyping/low-volume pick-and-place system for OEMs; and Assembléon debuted the YS24 high-mix, dual-sided pick-and-place machine from Yamaha.
The introduction of 01005 chip components and 0.3-mm-pitch CSP devices is pushing surface mount technology (SMT) to its process limits. Miniaturization is driving the smallest and tightest-pitch components, but how far can this go before solder paste is no longer viable? How small a feature can be printed with solder paste, and can this be implemented into a production environment? George Babka, Assembléon America; David Sbiroli and Chris Anglin, Indium Corporation; and Richard Brooks, Kyzen define an experiment and guidelines.
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Now accepting entries for the 18th Annual SMT VISION Awards, recognizing innovation across the electronics manufacturing industry. | ||
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New Lead-Free Alloy that Takes Under-the-Hood Heat in Stride-Innovative Formulation Provides High Reliability for High-Temp Applications
While lead-free processes now seem like yesterday’s news and the electronics industryat large has generally accepted and commonly uses the SnAgCu (SAC) alloy, ... Sponsored By:
Henkel Corporation
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Using Hansen Space to Optimize Solvent Based Cleaning Processes
What is an optimized cleaning process? Is it based solely upon removing the residue, or is it more? Of course it is more. We do not want to remove the labels or ... Sponsored By:
Austin American Technology Corp.
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Using Hansen Space to Optimize Solvent Based Cleaning Processes
What is an optimized cleaning process? Is it based solely upon removing the residue, or is it more? Of course it is more. We do not want to remove the labels or ... Sponsored By:
Austin American Technology Corp.
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Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers
by Brian Toleno, Ph.D., Henkel CorporationIf you've been in electronics for any length of time, the phenomenon of tin whiskers is something you've likely heard discussed ... Sponsored By:
Henkel Corporation
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Conductive Film for RF Grounding Can Take the Heat
Historically electrically conductive interfaces have been used for RF grounding assembly applications primarily due to their performance and processing benefits.... Sponsored By:
Henkel Corporation
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Tightening Up Type 4
Though the majority of assemblers are using Type 3 solder paste for most of today’s mainstream applications, the prevalence of finer-pitched devices is growing. ... Sponsored By:
Henkel Corporation
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SMT's editorial team discusses industry events, trends and important news for electronics manufacturers, IDMs, OEMs and related companies.
