Instead of time-consuming hardware tests for thermal analysis, package designers are increasingly turning to software-based device modeling and CFD analysis, which eliminates fabrication of trial components, thermal dice, and other fixturing to preview the impact of design decisions and changes, explains Robin Bornoff from Mentor Graphics.
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Achieving Thermal Control for Power Devices: Die Attach Solder Pastes for Varying Requirements
Not only are today’s package designers and assemblers faced with the inherent design and functionality challenges associated with smaller device footprints ... Sponsored By:
Henkel Corporation
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Photovoltaic Modules get a Charge from New Electrically Conductive Adhesives
For high reliability applications such as satellite, automotive, medical and telecom products, electrically conductive adhesives are often used as an alternative ... Sponsored By:
Henkel Corporation
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Breakthrough Package-Level Lead-Free Alloy Addresses Board-Level Alloy Challenges
Not all SAC alloys are created equal: Especially when attempting to use board-level recommended SAC alloys for package-level applications.... Sponsored By:
Henkel Corporation
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How Low Can You Go?
Improvements to Low-temperature Curable Electrically Conductive Pastes Advance Touch Panel and LCD Applications... Sponsored By:
Henkel Corporation
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