Given the advantages and technical feasibility of through-silicon vias (TSV), the major focus now is on the manufacturability and integration of all the different building blocks for TSVs and 3D interconnects. EV Group's Thorsten Matthias et al. review advances in lithography, thin wafer processing, and wafer bonding, and the integration of all these process steps.
The VectorGuard stencil portfolio from DEK now includes the double layer Platinum stencil, a stencil technology that is said to offer performance benefits over conventional screens. VectorGuard Double Layer Platinum stencils suit semiconductor applications and component manufacture, solar cell manufacture, low-temperature co-fired ceramic (LTCC) manufacture, as well as other production challenges requiring fine line or mixed feature sizes.
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Achieving Thermal Control for Power Devices: Die Attach Solder Pastes for Varying Requirements
Not only are today’s package designers and assemblers faced with the inherent design and functionality challenges associated with smaller device footprints ... Sponsored By:
Henkel Corporation
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Photovoltaic Modules get a Charge from New Electrically Conductive Adhesives
For high reliability applications such as satellite, automotive, medical and telecom products, electrically conductive adhesives are often used as an alternative ... Sponsored By:
Henkel Corporation
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Breakthrough Package-Level Lead-Free Alloy Addresses Board-Level Alloy Challenges
Not all SAC alloys are created equal: Especially when attempting to use board-level recommended SAC alloys for package-level applications.... Sponsored By:
Henkel Corporation
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How Low Can You Go?
Improvements to Low-temperature Curable Electrically Conductive Pastes Advance Touch Panel and LCD Applications... Sponsored By:
Henkel Corporation
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