This case study, a partner piece to Robin Bornoff/Mentor Graphics' discussion of fluid dynamics analysis for IC package design, examines how IDT used CFD thermal analysis in a packaging decision for a recent product launch.
Samsung Electronics has developed the world’s thinnest multi-die package, one that measures 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory package is just half the thickness of a conventional memory package of eight stacked chips (or dies). The advanced packaging technology delivers a 40 percent thinner and lighter memory solution for high-density multimedia handsets and other mobile devices, according to the company.
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Photovoltaic Modules get a Charge from New Electrically Conductive Adhesives
For high reliability applications such as satellite, automotive, medical and telecom products, electrically conductive adhesives are often used as an alternative ... Sponsored By:
Henkel Corporation
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Breakthrough Package-Level Lead-Free Alloy Addresses Board-Level Alloy Challenges
Not all SAC alloys are created equal: Especially when attempting to use board-level recommended SAC alloys for package-level applications.... Sponsored By:
Henkel Corporation
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Die Attach So Smart it Knows Where to Go
Things in the semiconductor packaging world continue to get smaller and thinner, driving the need for materials to become smarter and more effective.... Sponsored By:
Henkel Corporation
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How Low Can You Go?
Improvements to Low-temperature Curable Electrically Conductive Pastes Advance Touch Panel and LCD Applications... Sponsored By:
Henkel Corporation
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