On behalf of the World Gold Council (WGC), SEMI conducted a survey titled “Semiconductor Industry Opinions Concerning the Selection of Bonding Wire Material.” The survey was intended to gauge the semiconductor industry’s use of copper bonding wire versus gold for packaging applications. The WGC is a commercially driven organization focused on creating demand for gold. While 41% of semiconductor companies surveyed use copper bonding wire, none use it in the majority of their products. However, the majority of respondents will consider copper bonding wire in their new products.
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Achieving Thermal Control for Power Devices: Die Attach Solder Pastes for Varying Requirements
Not only are today’s package designers and assemblers faced with the inherent design and functionality challenges associated with smaller device footprints ... Sponsored By:
Henkel Corporation
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Photovoltaic Modules get a Charge from New Electrically Conductive Adhesives
For high reliability applications such as satellite, automotive, medical and telecom products, electrically conductive adhesives are often used as an alternative ... Sponsored By:
Henkel Corporation
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Breakthrough Package-Level Lead-Free Alloy Addresses Board-Level Alloy Challenges
Not all SAC alloys are created equal: Especially when attempting to use board-level recommended SAC alloys for package-level applications.... Sponsored By:
Henkel Corporation
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How Low Can You Go?
Improvements to Low-temperature Curable Electrically Conductive Pastes Advance Touch Panel and LCD Applications... Sponsored By:
Henkel Corporation
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