On behalf of the World Gold Council (WGC), SEMI conducted a survey titled “Semiconductor Industry Opinions Concerning the Selection of Bonding Wire Material.” The survey was intended to gauge the semiconductor industry’s use of copper bonding wire versus gold for packaging applications. The WGC is a commercially driven organization focused on creating demand for gold. While 41% of semiconductor companies surveyed use copper bonding wire, none use it in the majority of their products. However, the majority of respondents will consider copper bonding wire in their new products.
The IMAPS-UK MicroTech-2010 and IEEE-CPMT Advanced Packaging Materials (APM), Feb. 28 to March 2 at Cambridge University, will be the major Spring 2010 event on electronics packaging, interconnection and integration conference in Europe.
Samsung Electronics has developed the world’s thinnest multi-die package, one that measures 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory package is just half the thickness of a conventional memory package of eight stacked chips (or dies). The advanced packaging technology delivers a 40 percent thinner and lighter memory solution for high-density multimedia handsets and other mobile devices, according to the company.
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Photovoltaic Modules get a Charge from New Electrically Conductive Adhesives
For high reliability applications such as satellite, automotive, medical and telecom products, electrically conductive adhesives are often used as an alternative ... Sponsored By:
Henkel Corporation
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Breakthrough Package-Level Lead-Free Alloy Addresses Board-Level Alloy Challenges
Not all SAC alloys are created equal: Especially when attempting to use board-level recommended SAC alloys for package-level applications.... Sponsored By:
Henkel Corporation
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Die Attach So Smart it Knows Where to Go
Things in the semiconductor packaging world continue to get smaller and thinner, driving the need for materials to become smarter and more effective.... Sponsored By:
Henkel Corporation
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How Low Can You Go?
Improvements to Low-temperature Curable Electrically Conductive Pastes Advance Touch Panel and LCD Applications... Sponsored By:
Henkel Corporation
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