In a deal that will generate economical new process options for the 3D integration market, Alchimer S.A., a provider of nanometric deposition technology for semiconductor interconnects and through-silicon vias (TSV), and KPM Tech Co. Ltd., a manufacturer of plating materials and systems, announced a multi-level collaboration that gives KPM Tech exclusive rights to produce chemicals in Korea for Alchimer’s technology. The agreement also includes the manufacture of various configurations of wet processing tools to support the Alchimer TSV platform.
Wire bond inspection system maker Viscom introduced software tools for its very high resolution (VHR) camera module, which has the ability to provide exact measurements of balls and wedges. With this technology, 25-µm gold thin-wire wedge sizes can be measured with a standard deviation of 1 µm. In addition to inspecting qualitative characteristics of wire bonds, balls and wedges statistical evaluation and trend analysis of critical geometric dimensions can also be performed in the production process.
On behalf of the World Gold Council (WGC), SEMI conducted a survey titled “Semiconductor Industry Opinions Concerning the Selection of Bonding Wire Material.” The survey was intended to gauge the semiconductor industry’s use of copper bonding wire versus gold for packaging applications. The WGC is a commercially driven organization focused on creating demand for gold. While 41% of semiconductor companies surveyed use copper bonding wire, none use it in the majority of their products. However, the majority of respondents will consider copper bonding wire in their new products.
The Surface Mount Technology Association (SMTA) will host two 90-minute online sessions with Bob Willis, ASKbobwillis.com, on package-on-package (PoP) applications and implementation. The Webtorials will take place February 4 and February 11, 2010 from 1:00 to 2:30 pm EST.
Allvia says it has completed integration and full reliability testing of a silicon interposer between a semiconductor die and an organic or ceramic substrate.
ICAP Ocean Tomo, the intellectual property brokerage division of ICAP Plc (IAP.L), is offering for sale a patent portfolio relating to wafer-level semiconductor packaging owned by Hymite A/S. The 77 issued U.S. and foreign patents and patent applications cover new packaging technologies for optical communications components, LED emitters, and semiconductor fabrication.
The EuroPIC project aims to facilitate access by small companies to cost-effective photonic integrated circuit (PIC) manufacture in Europe. It also will encourage research on manufacturing methods to develop an open-access industrial generic foundry production capability for Europe. EuroPIC is a collaborative project formed by a consortium of experts, consisting of a mix of small- to medium-sized enterprises (SMEs), industry, and academic partners in the fields of component manufacturing, PIC design and applications, photonic CAD, and packaging.
Amkor Technology Inc. (NASDAQ: AMKR) will issue its financial results for the fourth quarter and full year 2009 after the close of trading on the NASDAQ Global Market on Wednesday, February 10, 2010. At 5:00 p.m. Eastern Time, Amkor management will host a conference call to discuss the company’s financial results.
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ElectroIQ, the portal for electronics manufacturing, is the new home for Solid State Technology (semiconductors), Photovoltaics World (photovoltaics), Advanced Packaging (packaging), Small Times (nanotech/MEMS) and SMT (surface mount technology). To learn more about ElectroIQ, read the press release.
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We've Got Your Back: New Wafer Backside Coating - Technology Offers Speed, Throughput and Cost-Effective Advantages over Alternative Materials & Methods
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How Low Can You Go?
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