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Packaging Featured Articles
The second wave of 3D packaging technology: PoP

PoP is one of the most successful packages of the last decade, and their success will extend into this decade, says Mario A. Bolanos, Texas Instruments.

Packaging Featured Articles
IDTechEx releases RFID forecast publication

IDTechEx announced "RFID Forecasts, Players & Opportunities 2011-2021," which shows RFID as a $5.63 billion market in 2010.

Packaging Featured Articles
Patent for modular test system approved

SemiProbe has developed proprietary technologies awarded a patent: The Probe System for Life allows the company and users to configure test and inspection systems that meet unique requirements usually served by custom products.

Packaging Featured Articles
Si, glass interposers for 3D packaging: analysts' takes

Yole asks if next-gen package substrates are myth, niche, or high-volume necessity? Several companies are investigating silicon interposers, but there is no clear consensus on apps and timing for adoption, says TSI in its forecast for Si interposers.

Packaging Featured Articles
IDTechEx launches active RFID and sensor networks report

"Active RFID and Sensor Networks 2011-2021," comprehensively analyzes the technologies, players and markets with detailed 10-year forecasts, including tag numbers, unit prices and interrogator numbers and prices.

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    Dr. Phil Garrou
    by Dr. Phil Garrou

    Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.

    IFTLE 13 3D In and Around the Moscone Part 3

    ……….Finishing our look at the 3D related events at the recent Semicon West exhibition. EVGMarkus Wimplinger , Corp Tech and IP Director, shared that 3D and TSV have been a main focus for EVG during the downturn and they feel these technologies have served...

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    Packaging Videos
    B.J. Han, chief technology officer of STATS ChipPAC talks about trends in advanced packaging technology. ; Confab; HAN; packaging; STATS ChipPAC; Jan Vardaman, president, TechSearch International, (Vardaman's presentation was delivered by Smith, due to a flight cancellation caused by the weather) explores thru-silicon vias (TSVs).; Jan Vardaman; packaging; SMTAI; TechSearch International; through-silicon vias; thru-silicon via; TSI; TSV; At SEMICON China, Kulicke & Soffa Industries, Inc. launched two next-generation wire bonders, IConn and ConnX; Dage's Paul Walter, Managing Director, talks to Gail Flower at Semicon West 2008.; packaging Dage Semicon West 2008; Ritwik Chatterjee, Ph.D., speaking on behalf of the Georgia Tech Packaging Research Center (PRC), defines 1st and 2nd level integration through all-silicon interconnection.; all silicon; Georgia Tech; Package in package; Packaging Research Center; Ritwik Chatterjee; Gene Dunn, Panasonic Factory Solutions of America, examines thin-die packaging issues that EMS providers will need to consider in board layout for bend possibilities, pick-and-place systems for picking force, and reflow for overheat concerns. ; board design; Fragile Components; Fragile Packages; Miniaturization; panasonic; pick-and-place; reflow; smt; Thin Die; Sitaram Arkalgud, PhD, Director, Interconnect Division, talks about SEMATECH's emphasis on new technologies.; Advanced Packaging; Confab; Gail Flower; Sitaram Arkalgud; Aviza's Kevin Crofton, VP and General Manager, talks to Gail Flower at Semicon West 2008.; Aviza Crofton Semicon West 2008; Asymtek's Greg Wood, vice president of sales, talks to Gail Flower at Semicon West 2008.; Semicon West 2008 asymtek packaging; Jacques Coderre, Unovis Solutions, presents "Assembly Evolution as Semiconductor and Circuit Board Converge." ; Co-design; convergence; Embedded Components; Flip Chip; packaging; smt; Unovis; Paul Ruo, National Sales Manager for Aries, talks to Gail Flower at Semicon West 2008.; Aries Semicon West 2008 packaging; Lee Smith, VP of business development at outsourcing semiconductor assembly and test (OSAT) provider Amkor Technology, was instrumental in developing the package-on-package (PoP) stack.; AmKor; Lee Smith; package on package stack; Pop; Sats; David Geiger, Flextronics International, explains how EMS assemblers implement new packages in their processes.; Bare Die; ems; Flextronics; new packages; Pop; SATS/EMS; smt; stacked packages; Panasonic's Gene Dunnn, Engineering Manager, talks to Gail Flower at Semicon West 2008.; Panasonic Semicon West packaging; Palomar's president, Bruce Hueners, talks about packaging trends at Semicon West 2008.; Palomar Semicon West 2008 packaging; Vern Solberg, STI ? Madison, speaks on miniaturization, such as wafer-level packaging (WLP) and chip on board (COB).; BGA; Cob; Flip Chip; Miniaturization; smt; Vern Solberg; Wireless Handsets; Lee Smith, Senior Director at Amkor and industry expert in 3-D packaging talks about the latest package styles.; Advanced Packaging; AmKor; Confab; Gail Flower; Lee Smith; Scott Kennedy, senior development engineer at Rogers Corporation, looks at the potential inherent in new package substrates.; ceramic packages; ceramics; Military; packaging; SMTAI; substrates; TSV; Rozalia Beica, 3D interconnect director at Semitool Inc. and representing the EMC3D consortium, expresses integration in packaging.; 3d packaging; packaging; Semitool; SMTAI; TSV; Eric Beyne, Ph.D., scientific director, Advanced Packaging and Interconnect Center, Interconnect, Packaging & Systems Integration at IMEC talks to Gail Flower at Semicon West.; packaging IMEC Beyne Semicon West; One of Amkor's latest package offerings, FusionQuad, protects the package while making interconnects easier for fine pitch connections to the PCB.; advanced package; AmKor; BGA; fine pitch package; FusionQuad; new package style; PCB package; quad flatpack; SATS provider package; Steve Dwyer, VP and General Manager America, talks about EVG?s greatest strengths as a company.; Advanced Packaging; Confab; EVG; Gail Flower; Steve Dwyer; Welcome to the Advanced Packaging Video Library! AP videos give active, up-close looks at products, people and packaging industry events.
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    Packaging Events
    Electronics Assembly and Packaging Technology Expo 2010 (ATE China 2010)
    Shenzhen, China
    August 31, 2010 - September 02, 2010
    SEMICON Taiwan 2010
    Taipei, Taiwan
    September 08, 2010 - September 10, 2010
    Medical Electronics Packaging Technologies Workshop
    Berlin, Germany
    September 16, 2010 - September 17, 2010
    International Wafer-Level Packaging Conference & Tabletop Exhibition
    Santa Clara, CA
    October 11, 2010 - October 14, 2010
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