Hitachi Via Mechanics says it has developed new processes for microhole drilling cast polyimide wafers and multilayered materials used in high density electronics packaging, that can produce ≤100μm-dia. holes in high-volume manufacturing.
Micron Technology says it is now sampling a multichip package combing its 34nm-based 4Gb SLC NAND flash and 50nm-based 2Gb low-power DDR DRAM memories, a combination it says offers better cost and power savings for mobile devices.
A new study suggests that through-silicon vias (TSV) with higher aspect ratios (20:1 or 10:1, vs. 5:1) offer a significant payback by saving space on a die, up to $700 per wafer.
Embedded computing modules employing "silicon circuit board" technology as an alternative to expensive ASIC developments offer advantages in performance and power for integrating memory and logic -- and are a practical alternative to 3D integration due to thermal and supply chain issues, explains siXis' David Blaker.
Specialty TSV foundry Allvia is expanding its manufacturing capabilities away from high-cost Silicon Valley to a newly-purchased facility in Oregon, a site with its own chip-equipment pedigree.
Samsung Electronics has developed the world’s thinnest multi-die package, one that measures 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory package is just half the thickness of a conventional memory package of eight stacked chips (or dies). The advanced packaging technology delivers a 40 percent thinner and lighter memory solution for high-density multimedia handsets and other mobile devices, according to the company.
German researchers will demonstrate intelligent production during a special show at productronica 2009 (November 10 to 13, 2009, Munich). The Self-Organizing PROduction (SOPRO) program is the result of a German government-funded initiative to develop a factory of the future in which production processes are more flexible, efficient and environmentally-friendly.
Rudolph Technologies, Inc., announced that is has received orders for 20 tools from the world’s four largest outsourced assembly and test (OSAT) companies and major foundry companies. The orders are for Rudolph’s automated macro defect inspection equipment, which typically sell within a range of $600k to $1.2m.
Nakaya Microdevices Corporation (“NMD”), Amkor Technology, Inc. and Toshiba Corporation announced that they are continuing their negotiations of definitive agreements pursuant to the non-binding memorandum of understanding announced on April 28, 2009 for the formation of a joint venture in Japan to provide system LSI assembly and testing services.
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