Advanced Packaging - Highlighting IC Packaging Processes, Wafer Dicing, Die Placement and More: ElectroIQ.com
Packaging Featured Articles
IMAPS 2009: Fusion bonding for 3D/TSV, WLP/MCP for MEMS

Presentations at this year's International Symposium on Microelectronics included TSV/3D integration challenges, temporary bonding steps qualified for different process flows, and a wafer-level packaging encapsulation process and stacked multi-chip package for a MEMS/IC chip.

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Packaging Featured Articles
Ultrathin, stackable QFN packages

Tom Adams from Sonoscan describes advances with "chip-in-polymer technology, developed at Germany's Fraunhofer IZM, which achieves 3D packaging advantages through better shock/vibration protection and shorter interconnect distances.

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Packaging Featured Articles
Allvia shows off its Si interposer data

Nagesh Vodrahalli, VP of technology & manufacturing at Allvia, discusses some of the issues in developing through-silicon via (TSV) technologies, in conjunction with his presentation at the recent 3-D Architectures for Semiconductor Integration and Packaging conference.

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Packaging Featured Articles
Avoiding ASIC expense and risk with SiCB technology

Embedded computing modules employing "silicon circuit board" technology as an alternative to expensive ASIC developments offer advantages in performance and power for integrating memory and logic -- and are a practical alternative to 3D integration due to thermal and supply chain issues, explains siXis' David Blaker.

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Packaging Current Articles
Alchimer, KPM Tech Sign Agreement for TSV Wet Processing Tools & Materials (Feb 8, 2010)

In a deal that will generate economical new process options for the 3D integration market, Alchimer S.A., a provider of nanometric deposition technology for semiconductor interconnects and through-silicon vias (TSV), and KPM Tech Co. Ltd., a manufacturer of plating materials and systems, announced a multi-level collaboration that gives KPM Tech exclusive rights to produce chemicals in Korea for Alchimer’s technology. The agreement also includes the manufacture of various configurations of wet processing tools to support the Alchimer TSV platform.

Viscom introduces measurement tools for wire bond inspection (Jan 26, 2010)

Wire bond inspection system maker Viscom introduced software tools for its very high resolution (VHR) camera module, which has the ability to provide exact measurements of balls and wedges. With this technology, 25-µm gold thin-wire wedge sizes can be measured with a standard deviation of 1 µm. In addition to inspecting qualitative characteristics of wire bonds, balls and wedges statistical evaluation and trend analysis of critical geometric dimensions can also be performed in the production process.

World Gold Council, SEMI survey packaging industry on wire bonding material choices (Jan 25, 2010)

On behalf of the World Gold Council (WGC), SEMI conducted a survey titled “Semiconductor Industry Opinions Concerning the Selection of Bonding Wire Material.” The survey was intended to gauge the semiconductor industry’s use of copper bonding wire versus gold for packaging applications. The WGC is a commercially driven organization focused on creating demand for gold. While 41% of semiconductor companies surveyed use copper bonding wire, none use it in the majority of their products. However, the majority of respondents will consider copper bonding wire in their new products.

SMTA webcasts on package on package (PoP), STACK assembly, rework and inspection (Jan 22, 2010)

The Surface Mount Technology Association (SMTA) will host two 90-minute online sessions with Bob Willis, ASKbobwillis.com, on package-on-package (PoP) applications and implementation. The Webtorials will take place February 4 and February 11, 2010 from 1:00 to 2:30 pm EST.

Allvia completes tests for stacked-semi Si interposer (Jan 15, 2010)

Allvia says it has completed integration and full reliability testing of a silicon interposer between a semiconductor die and an organic or ceramic substrate.

Packaging Industry News
Hymite will sell portfolio of wafer-level semiconductor packaging patents (Feb 1, 2010)

ICAP Ocean Tomo, the intellectual property brokerage division of ICAP Plc (IAP.L), is offering for sale a patent portfolio relating to wafer-level semiconductor packaging owned by Hymite A/S. The 77 issued U.S. and foreign patents and patent applications cover new packaging technologies for optical communications components, LED emitters, and semiconductor fabrication.

EuroPIC: European manufacturing consortium for photonic integrated circuits (Jan 28, 2010)

The EuroPIC project aims to facilitate access by small companies to cost-effective photonic integrated circuit (PIC) manufacture in Europe. It also will encourage research on manufacturing methods to develop an open-access industrial generic foundry production capability for Europe. EuroPIC is a collaborative project formed by a consortium of experts, consisting of a mix of small- to medium-sized enterprises (SMEs), industry, and academic partners in the fields of component manufacturing, PIC design and applications, photonic CAD, and packaging.

Amkor Technology to Announce Q'04 and Full Year 2009 Financial Results in February (Jan 26, 2010)

Amkor Technology Inc. (NASDAQ: AMKR) will issue its financial results for the fourth quarter and full year 2009 after the close of trading on the NASDAQ Global Market on Wednesday, February 10, 2010. At 5:00 p.m. Eastern Time, Amkor management will host a conference call to discuss the company’s financial results.

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    Announcing ElectroIQ

    ElectroIQ, the portal for electronics manufacturing, is the new home for Solid State Technology (semiconductors), Photovoltaics World (photovoltaics), Advanced Packaging (packaging), Small Times (nanotech/MEMS) and SMT (surface mount technology). To learn more about ElectroIQ,  read the press release.


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    Advanced Packaging Issue Archive


    Packaging Videos
    B.J. Han, chief technology officer of STATS ChipPAC talks about trends in advanced packaging technology. ; Confab; HAN; packaging; STATS ChipPAC; Jan Vardaman, president, TechSearch International, (Vardaman's presentation was delivered by Smith, due to a flight cancellation caused by the weather) explores thru-silicon vias (TSVs).; Jan Vardaman; packaging; SMTAI; TechSearch International; through-silicon vias; thru-silicon via; TSI; TSV; At SEMICON China, Kulicke & Soffa Industries, Inc. launched two next-generation wire bonders, IConn and ConnX; Dage's Paul Walter, Managing Director, talks to Gail Flower at Semicon West 2008.; packaging Dage Semicon West 2008; Ritwik Chatterjee, Ph.D., speaking on behalf of the Georgia Tech Packaging Research Center (PRC), defines 1st and 2nd level integration through all-silicon interconnection.; all silicon; Georgia Tech; Package in package; Packaging Research Center; Ritwik Chatterjee; Gene Dunn, Panasonic Factory Solutions of America, examines thin-die packaging issues that EMS providers will need to consider in board layout for bend possibilities, pick-and-place systems for picking force, and reflow for overheat concerns. ; board design; Fragile Components; Fragile Packages; Miniaturization; panasonic; pick-and-place; reflow; smt; Thin Die; Sitaram Arkalgud, PhD, Director, Interconnect Division, talks about SEMATECH's emphasis on new technologies.; Advanced Packaging; Confab; Gail Flower; Sitaram Arkalgud; Aviza's Kevin Crofton, VP and General Manager, talks to Gail Flower at Semicon West 2008.; Aviza Crofton Semicon West 2008; Asymtek's Greg Wood, vice president of sales, talks to Gail Flower at Semicon West 2008.; Semicon West 2008 asymtek packaging; Jacques Coderre, Unovis Solutions, presents "Assembly Evolution as Semiconductor and Circuit Board Converge." ; Co-design; convergence; Embedded Components; Flip Chip; packaging; smt; Unovis; Paul Ruo, National Sales Manager for Aries, talks to Gail Flower at Semicon West 2008.; Aries Semicon West 2008 packaging; Lee Smith, VP of business development at outsourcing semiconductor assembly and test (OSAT) provider Amkor Technology, was instrumental in developing the package-on-package (PoP) stack.; AmKor; Lee Smith; package on package stack; Pop; Sats; David Geiger, Flextronics International, explains how EMS assemblers implement new packages in their processes.; Bare Die; ems; Flextronics; new packages; Pop; SATS/EMS; smt; stacked packages; Panasonic's Gene Dunnn, Engineering Manager, talks to Gail Flower at Semicon West 2008.; Panasonic Semicon West packaging; Palomar's president, Bruce Hueners, talks about packaging trends at Semicon West 2008.; Palomar Semicon West 2008 packaging; Vern Solberg, STI ? Madison, speaks on miniaturization, such as wafer-level packaging (WLP) and chip on board (COB).; BGA; Cob; Flip Chip; Miniaturization; smt; Vern Solberg; Wireless Handsets; Lee Smith, Senior Director at Amkor and industry expert in 3-D packaging talks about the latest package styles.; Advanced Packaging; AmKor; Confab; Gail Flower; Lee Smith; Scott Kennedy, senior development engineer at Rogers Corporation, looks at the potential inherent in new package substrates.; ceramic packages; ceramics; Military; packaging; SMTAI; substrates; TSV; Rozalia Beica, 3D interconnect director at Semitool Inc. and representing the EMC3D consortium, expresses integration in packaging.; 3d packaging; packaging; Semitool; SMTAI; TSV; Eric Beyne, Ph.D., scientific director, Advanced Packaging and Interconnect Center, Interconnect, Packaging & Systems Integration at IMEC talks to Gail Flower at Semicon West.; packaging IMEC Beyne Semicon West; One of Amkor's latest package offerings, FusionQuad, protects the package while making interconnects easier for fine pitch connections to the PCB.; advanced package; AmKor; BGA; fine pitch package; FusionQuad; new package style; PCB package; quad flatpack; SATS provider package; Steve Dwyer, VP and General Manager America, talks about EVG?s greatest strengths as a company.; Advanced Packaging; Confab; EVG; Gail Flower; Steve Dwyer; Welcome to the Advanced Packaging Video Library! AP videos give active, up-close looks at products, people and packaging industry events.
    Packaging Webcasts

    On Demand Webcasts

    It's Time For 3D Now - Process Integration
    The use of new packaging methods enables production of IC's with reduced cost, lower power consumption, small form factor, higher performance and increased yield ...
    Sponsored by: 
    EV Group (EVG)

    Trends in Wafer Bonding for MEMS and 3D Integration
    The wafer-level capping of fragile MEMS structures (e.g. for accelerometer, gyroscopes and pressure sensors) for protection and sealing purposes with wafer bonding ...
    Sponsored by: 

    Building Blocks and Roadmaps for 3D Integration
    Convergence of front and back end process and technologies are driving successful high yielding examples of 3D devices to head into early markets. Continued success ...
    Sponsored by: 

    Packaging White Papers

    Featured White Papers

    Photovoltaic Modules get a Charge from New Electrically Conductive Adhesives
    For high reliability applications such as satellite, automotive, medical and telecom products, electrically conductive adhesives are often used as an alternative ...
    Sponsored By:  Henkel Corporation
    Breakthrough Package-Level Lead-Free Alloy Addresses Board-Level Alloy Challenges
    Not all SAC alloys are created equal: Especially when attempting to use board-level recommended SAC alloys for package-level applications....
    Sponsored By:  Henkel Corporation
    Die Attach So Smart it Knows Where to Go
    Things in the semiconductor packaging world continue to get smaller and thinner, driving the need for materials to become smarter and more effective....
    Sponsored By:  Henkel Corporation
    Something for Everyone! New Advances Offer Die Attach Options for Just About Any Application
    Next-generation technology development and new device designs continue to advance at an unprecedented pace....
    Sponsored By:  Henkel Corporation
    We've Got Your Back: New Wafer Backside Coating - Technology Offers Speed, Throughput and Cost-Effective Advantages over Alternative Materials & Methods
    While many advances in die attach methods and materials have taken center stage in recent months, there is one novel technology that has quietly emerged on the scene ...
    Sponsored By:  Henkel Corporation

    Recent White Papers

    How Low Can You Go?
    Improvements to Low-temperature Curable Electrically Conductive Pastes Advance Touch Panel and LCD Applications...
    Sponsored By:  Henkel Corporation
    Packaging Events
    MEPTEC
    San Jose, CA
    February 25, 2010 - February 26, 2010
    IMAPS UK-MicroTech 2010
    University of Cambridge, UK
    February 28, 2010 - March 02, 2010
    BiTs Workshop
    Phoenix, AZ
    March 07, 2010 - March 10, 2010
    SEMICON China
    Shanghai, China
    March 16, 2010 - March 18, 2010
    IPC APEX
    Las Vegas, NV
    April 06, 2010 - April 08, 2010
    http://www.ipcapexexpo.org
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