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Silicon Labs offers bare die from 1 wafer and up

May 16, 2012

Mixed-signal IC maker Silicon Laboratories Inc. (NASDAQ: SLAB) introduced a microcontroller (MCU) die sales program with a minimum order quantity of 1 wafer.

Gigaphoton opens Korean subsidiary for DUV, EUV lithography support

May 16, 2012 Gigaphoton Inc., lithography light source manufacturer, began operations at its wholly owned subsidiary, Gigaphoton Korea Inc. Gigaphoton points to Korea as “one of the most important regions in th...

Microsoft joins Hybrid Memory Cube Consortium

May 16, 2012 The Hybrid Memory Cube Consortium (HMCC) is a collaboration developing and implementing an open interface standard for Hybrid Memory Cube semiconductor memory architectures. Microsoft Corp. has now...

Knowles tops 3B MEMS microphones shipped

May 16, 2012

Knowles, micro acoustics and MEMS microphone maker, has shipped over 3 billion SiSonic MEMS microphones from the SiSonic MEMS microphone introduction in 2003.

3M dual-brightness enhancement film enables PoE LED-backlit LCD

May 16, 2012 3M Optical Systems Division enabled what is says is the “first all-in-one zero client capable of being powered by Type 1 power-over-Ethernet (PoE, IEEE 802.3af),” using 3M’s Dual Brightness Enhance...

Dow acquires LED phosphor technology IP in Lightscape Materials buy

May 16, 2012 Lightscape Materials offers IP in specialty phosphor technology, which Dow will add to its LED technologies portfolio. Lightscape co-founders Gerard Frederickson and Yongchi Tian will join Dow’s LE...

Wire bonder debuts with Cu wire optimization, automatic rethreading from ASM Pacific Technology

May 16, 2012 The ASM iHawk Xpress Opto Wire Bonder from backend semiconductor assembly equipment supplier ASM Pacific Technology offers new innovations in transport, copper-wire bonding, and automatic rethreadi...

SMIC expands Beijing fab for smaller-node semiconductor manufacturing

May 15, 2012 Semiconductor Manufacturing International Corporation (SMIC) signed a cooperation framework document between its subsidiary SMIC Beijing and the Beijing municipal government, forming a joint ventur...

Buhler approved to acquire Leybold Optics

May 15, 2012

Bühler’s acquisition of Leybold Optics from EQT III, for an undisclosed sum, was approved without any restrictions by anti-trust authorities.

SUSS MicroTec takes over SUSS MicroOptics

May 15, 2012

SÜSS MicroTec AG has increased its shareholding in SUSS MicroOptics S.A. to 100%. SUSS MicroOptics is a leading company for high-quality refractive and diffractive micro-optics.

Infineon CEO Bauer resigns for health considerations

May 15, 2012

Infineon Technologies AG (FSE:IFX, OTCQX:IFNNY) CEO Peter Bauer will resign his post at the end of the current fiscal year (September 30, 2012) due to worsening osteoporosis.

Chinese GaAs foundry installs SPTS PVD tool

May 15, 2012

SPTS Technologies installed a Sigma fxP physical vapor deposition (PVD) system at a Chinese foundry producing RF devices on gallium arsenide (GaAs) substrates.

Beyond sapphire: LED substrates from GaN to ZnO, SiC, and Si

May 14, 2012 LEDs are typically manufactured on sapphire substrates, about 90% of the blue LEDs currently in production. SiC substrates are used for virtually all the remaining 10% of blue LEDs. To improve effi...

MEMS suppliers, equipment maker join MIG Hall of Fame

May 14, 2012

MEMS Industry Group (MIG) inducted 3 members into its MIG Hall of Fame, from EV Group (EVG), Acuity Inc. and Analog Devices Inc. (ADI).

Large-area TFT-LCD panel makers see rising shipments, revenues in Q2 2012

May 14, 2012 Following a “long-standing over-supply” in the TFT LCD industry, which induced lower panel prices, panel makers are “restructuring and adding new technologies and processes” to improve costs and pe...

MEMS microphones shrink to grow market share

May 14, 2012 TechNavio predicts 22% CAGR for MEMS microphones from 2011 to 2015, mainly due to the shrinking form factor of these devices. MEMS microphones are gaining acceptance in a new field: healthcare elec...

GLOBALFOUNDRIES joins top-20 semiconductor suppliers in Q1 2012 on Elpida bankruptcy

May 14, 2012 The top 20 semiconductor suppliers in Q1 2012, compiled in IC Insights' May Update to The McClean Report, show Intel’s firm hold on the top of the rankings, but a disappointing quarter overall. GLO...

Semiconductor-grade flow sensor measures photoresist, solvent supply

May 14, 2012

SENSIRION introduced the SLQ-QT105 semiconductor-grade flow sensor for flow rates below 2cc/sec (120ml/min) of hydrocarbon-based liquids, such as photoresists and solvents.

Nanostructured polymer lithography platform established by CEA-Leti and Arkema

May 11, 2012 Arkema and CEA-Leti, with the help of Professor Hadziioannou’s team of LCPO, have successfully patterned a 20nm pitch and reduced the diameter of contacts down to 7nm with nanostructured polymers.

Precision spray coater builds coatings through layer-by-layer self assembly

May 11, 2012 Nanotrons Corporation launched the SPray Assisted Layer-by-layer Assembly System (SPALAS) for nano-enabled optical coatings on semiconductor, plastic, and glass substrates using layer-by-layer (LbL...

GaN-on-Si LED from Bridgelux, Toshiba hits performance record

May 11, 2012 Bridgelux and Toshiba reported a 1.1mm2 LED chip fabricated on an 8" GaN-on-Si wafer, emitting 614mW, <3.1V @ 350mA. The companies will collaborate on commercializing GaN-on-Si LEDs, and To...

IDT eliminates crystals in high-performance MEMS oscillators

May 11, 2012 Integrated Device Technology, Inc. (IDT), introduced a piezoelectric MEMS resonator technology that does not use crystals. IDT has branded the components CrystalFree pMEMS (piezoelectric MEMS).

CMOS image sensor suppliers ramp up 300mm capacity

May 11, 2012 CMOS image sensors (CIS) are breaking sales records again, after several years without upward momentum, reports IC Insights. New portable systems and embedded imaging are lifting CIS to $6.3 billio...

Intel (INTC) plans high capex and fast node shrinks, expects chipmaker consolidation

May 11, 2012 At Intel’s annual investor day, the chipmaker reported that capital spending will be high in 2012 and 2013, noting that its 22nm and 14nm node capabilities are differentiators. Intel focused on its...

Micron confirms Elpida takeover discussions

May 11, 2012

Memory chip maker Micron Technology Inc. (Nasdaq:MU) confirmed that it is engaged in discussions to take over the assets of bankrupt DRAM maker Elpida Memory Inc.

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