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Printed, flexible and organic electronics sees 15.2% CAGR over the next decade
May 17, 2013
The new report from IDTechEx titled "Printed, Organic & Flexible Electronics: Forecasts, Players & Opportunities 2013-2023" finds that the total market for these technologies will...
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STMicroelectronics announces winners of the iNEMO Design Contest 2013
May 17, 2013
The winning teams successfully conceptualized, developed and built demonstrable prototypes of entirely new applications using ST's iNEMO MEMS sensor-fusion modules.
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GT Advanced Technologies acquires Thermal Technology LLC
May 16, 2013
GT Advanced Technologies today announced that it has acquired substantially all of the business of Thermal Technology LLC for purchase consideration. |
SMIC deploys NanoYield High-Sigma for 28nm process development
May 16, 2013
ProPlus Design Solutions, Inc. announced today that Semiconductor Manufacturing International Corporation has deployed ProPlus' NanoYield High-Sigma (HS) within its advanced technology development ...
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Vishay Intertechnology enhances precision thin film chip resistor arrays
May 16, 2013
Vishay Intertechnology, Inc. today announced that the company has enhanced its ACAS 0606 AT and ACAS 0612 AT precision thin film chip resistor arrays with tighter absolute tolerance, relative toler...
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First quarter shipments of touch-screen notebook post 4.57M units, up 51.8% QoQ
May 16, 2013
With Microsoft introducing Windows 8 operating system that provides the touch interface in the fourth quarter of 2012, notebook PCs with touch-screen panels were released. And this led to the openi...
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Imec and Renesas collaborate on ultra-low power short range radios
May 16, 2013
Imec and Renesas Electronics Corporation announced today that they have entered into a new strategic research collaboration at Holst Centre. |
Silicon Valley foundry Noel Technologies adds advanced lithography services
May 16, 2013
Foundry hires former ASML’s Keith Best as director of photolithography; tasked with driving roadmap to 0.15 microns |
Yole Developpement conducts 2.5D, 3DIC and TSV interconnect patent investigation
May 15, 2013
Yole Développement announced its 2.5D, 3DIC and TSV Interconnect Patent Investigation report. For this analysis of 3D packaging technology patents, more than 1800 patent families have been screened.
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Opportunities for electronics manufacturing services in medical industry are increasing
May 15, 2013
Original equipment manufacturers (OEMs) are increasingly turning to electronics manufacturing service (EMS) providers to better handle the escalating volumes of electronic content in the medical in...
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Trends and techniques in sensor fusion to be discussed at 2013 Sensors Expo and Conference
May 15, 2013
MEMS Industry Group (MIG) today announced its conference and exposition line-up for the 2013 Sensors Expo and Conference. |
Global semiconductor sales outpace last year through Q1 of 2013
May 14, 2013
Sales in March 2013 were up slightly compared to February 2013 and March 2012. |
NeoPhotonics opens sales and R&D office in Moscow
May 14, 2013
NeoPhotonics Corporation today announced the opening of a sales and R&D office in Moscow and servicing the Russian Federation and the broader eastern European market. |
Chip Memory Technologies Inc. reveals unique embedded NV memory solution
May 14, 2013
Chip Memory Technology Inc. (CMT), a new embedded memory technology developer, has emerged from stealth mode to reveal company details and its latest product. |
HELIOS develops supply chain for integrating photonics with CMOS circuit
May 14, 2013
The €8.5 million European Commission project developed a complete design and fabrication supply chain for integrating a photonic layer with a CMOS circuit, using microelectronics fabrication proces...
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MEMS New Product Development Blog: The technology development process and design review checklist
May 14, 2013
After a functional A-sample prototype is built, it doesn't take long for a project to gain traction that has market pull. This is usually the point that a project becomes highly visible withi...
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Studying 1/f noise
May 13, 2013
1/f noise is an important characteristic for various semiconductor devices, such as MOSFETs, BJTs, JFETs, Diode, and IC resistors. Not only does it directly impact the circuit performance of modern...
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Silex joins ENIAC project to develop new solutions for TSV and wafer bonding
May 13, 2013
Silex Microsystems, the world’s largest pure-play MEMS foundry, today announced that it has joined an international European Union-funded program aimed at developing a new MEMS manufacturing platfo...
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Teledyne acquires Axiom IC
May 13, 2013
Teledyne Technologies Incorporated announced today that its subsidiary, Teledyne DALSA B.V., has acquired Axiom IC B.V. |
TowerJazz and TLi Korea to collaborate on sensor ICs for mobile market
May 13, 2013
TowerJazz today announced collaboration with TLi (Technology Leaders and Innovators), a fabless company that designs non-memory integrated circuits (ICs) focused on timing controllers and driver IC...
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IQE and II-VI Inc. launch 150mm GaN HEMT epi wafers on SiC substrates
May 13, 2013
IQE plc announces the launch of gallium nitride-based, high electron mobility transistor (GaN HEMT) epitaxial wafers on 150mm diameter semi-insulating silicon carbide (SiC) substrates. |
Perfectly doped quantum dots yield colors to dye for
May 10, 2013
Researchers at the University of Illinois at Chicago have developed a way to introduce precisely four copper ions into each and every quantum dot. |
Intel VP to discuss low-cost computing initiative in IHS/SID 2013
May 10, 2013
Will the enabling and investment strategy of Intel Corp. lead to low-cost touch-screen-enabled notebooks that drive new demand for PCs and yield innovation in the global display market? |
Spectra-Physics introduces industrial picosecond laser
May 10, 2013
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision micromachining applications. |
North American Semiconductor Industry: Continuing with high levels of investments
May 9, 2013
While investments and capital spending in Asia-Pacific garner much of the attention regarding semiconductor manufacturing, spending on equipment and materials in North America has totaled more than...
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