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4Kx2K LCD TV panel shipments expected to reach 2.5M in 2013

March 14, 2013 TFT LCD panel suppliers are forecast to ship 2.6 million 4K×2K LCD TV panels (also known as Ultra HD) worldwide in 2013, up more than 40-fold from 63 thousand in 2012, according to the latest NPD D...

U.S. PVMC and NREL to partner on development of thin film PV cells and modules

March 14, 2013 The U.S. Photovoltaic Manufacturing Consortium (PVMC), an industry-led collaboration headquartered in New York at the SUNY College of Nanoscale Science and Engineering (CNSE), has partnered with th...

Yoon-Woo Lee of Samsung Electronics to give keynote address at The ConFab 2013

March 13, 2013 Solid State Technology is proud to announce that Yoon-Woo Lee will be speaking at The ConFab 2013. The event will be held June 23-26, 2013 at The Encore at The Wynn in Las Vegas. Lee is the Executi...

Arizona State and PARC produce world’s largest flexible X-ray detector

March 13, 2013 The Flexible Electronics and Display Center (FEDC) at Arizona State University and PARC, a Xerox company, today announced that they successfully manufactured the world's largest flexible X-ray dete...

Cree announces volume production of second generation SiC MOSFET

March 13, 2013 Cree, Inc. announces the release of its second generation SiC MOSFET, enabling systems to have higher efficiency and smaller size at cost parity with silicon-based solutions. These new 1200V MOSFET...

EV Group ships 300mm wafer bonding system to leading Chinese semiconductor foundry

March 13, 2013

Foundry to use wafers for 3D IC and advanced packaging volume production applications.

Avago MEMS Filter: The highest volume production MEMS using TSV

March 13, 2013 System Plus Consulting analyzed a BAW MEMS Filter manufactured by Avago Technologies, assessing its manufacturing process, costing results and breakdown. With more than 1 billion units produced per...

New Product: Hiden launches integration of on-board timers

March 12, 2013 Hiden announced this week the integration of on-board timers for real-time pulsed plasma measurement, the fast gating fully controllable within the MASsoft operating program. Two timers provide “ga...

ATLIS Semiconductor selected as IBM Microelectronics’ long-term foundry partner for 180nm SOI technology

March 12, 2013 ALTIS Semiconductor, a global specialty foundry based in France, announced today the finalization of a foundry agreement with IBM Microelectronics. Under the terms of this agreement, ALTIS will be ...

Signetics introduces an alternative to standard plastic ball grid array packages

March 12, 2013 Signetics Corporation today introduced their new MapBGA package to the industry. This alternative to standard PBGA packaging has improved reliability and design flexibility due to its unique assemb...

OKI delivers exhaust gas treatment equipment for ON Semiconductor’s European plants

March 12, 2013 OKI Engineering, provider of reliability evaluations and environmental conservation technologies for the OKI Group, recently delivered KGT-3MM-AP exhaust gas treatment equipment for atmospheric pre...

Intersil Corporation appoints Necip Sayiner President and CEO and Mercedes Johnson as Interim CFO

March 12, 2013

Intersil Corporation this week announced major staff changes, with the appointment of new president and CEO and interim CFO.

Cadence to acquire Tensilica

March 12, 2013

Cadence Design Systems, Inc. today announced plans to aquire Tensilica, Inc. for approximately $380 million in cash. Tensilica had approximately $30 million of cash as of December 31, 2012.

Printed electronics sector takes hard look at the flexible future

March 12, 2013 The flexible and printed electronics community reports encouraging progress in the materials and process ecosystem needed for commercial production — and an increasingly realistic focus on applicat...

STMicroelectronics requests ITC investigation of InvenSense

March 12, 2013 STMicroelectronics yesterday filed a complaint with the United States International Trade Commission (ITC). The complaint requests that the ITC initiate an investigation into the alleged infringeme...

AGC and nMode launch subsidiary to develop advanced packaging technology

March 12, 2013 Tokyo-based Asahi Glass Co., Ltd. and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1 million to co-found a subsidiary business, Triton Micro Technologies , to develop via-fill technolo...

STMicroelectronics announces resignation of COO and Interim President, Didier Lamouche

March 11, 2013 STMicroelectronics announced today that Didier Lamouche, Chief Operating Officer, whose operational role was suspended when he took the assignment as President and Chief Executive Officer at ST-Eri...

OE automotive semiconductor market grew 12% in 2012

March 11, 2013 According to the latest analysis by Semicast Research, Renesas Electronics was again the leading vendor of semiconductors to the OE automotive sector in 2012, ahead of Infineon Technologies. STMicr...

Lattice announces world’s smallest FPGA

March 11, 2013 Lattice Semiconductor Corporation today announced the iCE40 LP384 FPGA, the smallest member of its iCE40 family of ultra-low density FPGAs. Enabling designers to rapidly add new features and differ...

New products to be presented at Semicon China 2013

March 11, 2013   Heraeus will present numerous product highlights with regard to bonding wires, assembly materials and sputtering targets at this year's Semicon China, taking place on March 19-21, 2013 in Sh...

MRAM: Disruptive technology for storage applications

March 8, 2013 Everyone wants faster access to stored data, and the issue is becoming critical with Big Data and cloud initiatives. With the speed of DRAM and the non-volatility of storage, Magnetoresistive Rando...

Digi-Key Corporation and MEMSIC announce global distribution agreement

March 8, 2013 Global electronic components distributor Digi-Key Corporation today announced the signing of a global distribution agreement with MEMSIC, a provider of MEMS sensor components, sophisticated inertia...

STMicroelectronics proximity sensor solves smartphone hang-ups

March 8, 2013 Smartphones are set to become even more flexible and more satisfying to use, thanks to a unique sensor system developed by STMicroelectronics. Combining three optical elements in a single compact p...

Nanoelectronics Conference will focus on semiconductor industry’s future

March 8, 2013 How the semiconductor industry can create the next generations of nanoscale computing technology will be one of the themes of the 2013 International Conference on Frontiers of Characterization and ...

Student develops brighter, smarter and more efficient LEDs

March 8, 2013 Rensselaer Polytechnic Institute student Ming Ma has developed a new method to manufacture light-emitting diodes (LEDs) that are brighter, more energy efficient and have superior technical properti...
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