Nakaya, Amkor and Toshiba Provide Update on System LSI Joint Venture - Advanced Packaging
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Nakaya, Amkor and Toshiba Provide Update on System LSI Joint Venture


Nakaya Microdevices Corporation (“NMD”), Amkor Technology, Inc. and Toshiba Corporation announced that they are continuing their negotiations of definitive agreements pursuant to the non-binding memorandum of understanding announced on April 28, 2009 for the formation of a joint venture in Japan to provide system LSI assembly and testing services.

The initial target date of October 1 for the start of operations will be extended and the parties plan to announce the proposed commencement date when definitive agreements are finalized. The terms of the joint venture have not yet been determined and the formation of the joint venture remains subject to the negotiation of definitive agreements.

Founded in 1970 in Oita, Japan, Nakaya Microdevices Corporation has served as an independent provider of semiconductor assembly and test for nearly 40 years. More information is available in Japanese at http://www.nakaya-md.co.jp/
 
Amkor is a leading provider of semiconductor assembly and test services to semiconductor companies and electronics OEMs. More information on Amkor is available from the company’s SEC filings and on Amkor’s website: www.amkor.com.
 
Toshiba is a world leader and innovator in pioneering high technology, and a diversified manufacturer and marketer of advanced electronic and electrical products spanning information & communications systems; digital consumer products; electronic devices and components; power systems, including nuclear energy; industrial and social infrastructure systems; and home appliances.
Toshiba was founded in 1875, and today operates a global network of more than 730 companies, with 199,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm

 

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