ASM exec Shawn Thomas explains to SST how the company's new PowerFill process, which enables void-free filling of deep trenches with doped, epitaxial silicon, addresses needs for smaller die sizes and on-state resistance of power management devices.
Veeco exec Jim Jenson explains the workings of the company's new MOCVD tool targeting high-volume high-brightness LED manufacturing, a market expected to triple in the next four years to $15B.
A two-step plasma cleaning process proves to be a fast and effective method of maintaining a high uptime and high productivity for ALD of Ti- and Ta-based electrode materials, reports Aviza Technology and Pivotal Systems.
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Dual Channel Pulse Testing Simplifies RF Transistor Characterization
Device engineers and test managers are under tremendous pressure to make sure products get to market quickly and perform reliably. This is especially true of RF ... Sponsored By:
Keithley Instruments
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High Precision Ion Beam Milling with Time of Flight Compensation
Advanced circuit editing (CE) becomes more and more difficult as semiconductor structures shrink. Time of Flight (ToF) compensation noticeably extends the utility ... Sponsored By:
FEI Company
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Backside Circuit Edit on Full-Thickness Silicon Devices
Backside Circuit Edit (CE) techniques, in which a Focused Ion Beam (FIB) operator accesses critical circuitry through the substrate of an IC, are popular with processor ... Sponsored By:
FEI Company
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